Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| 其他特性 | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 负电源电压最大值（Vsup） | -18 V |
| 负电源电压最小值（Vsup） | -4.5 V |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 70 dB |
| 通态电阻匹配规范 | 12 Ω |
| 最大通态电阻 (Ron) | 300 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大信号电流 | 0.02 A |
| 最大供电电流 (Isup) | 0.5 mA |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 1000 ns |
| 最长接通时间 | 2000 ns |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MX7501KQ | MX7502KN | MX7501SE | MX7502SE | MX7502KQ | MX7502JN | |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers | Multiplexer Switch ICs 8-Channel Low-Power Monolithic CMOS Multiplexer | Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers | Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers | Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers | Multiplexer Switch ICs Low Power Monolithic CMOS Analog Multiplexers |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | DIP | DIP |
| 包装说明 | 0.300 INCH, CERAMIC, DIP-16 | 0.300 INCH, PLASTIC, DIP-16 | PLASTIC, LCC-20 | PLASTIC, LCC-20 | 0.300 INCH, CERAMIC, DIP-16 | 0.300 INCH, PLASTIC, DIP-16 |
| 针数 | 16 | 16 | 20 | 20 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 其他特性 | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY | ALSO OPERATES WITH 10 TO 30 SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 | R-PDIP-T16 | S-PQCC-N20 | S-PQCC-N20 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负电源电压最大值（Vsup） | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
| 负电源电压最小值（Vsup） | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 4 | 8 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 20 | 16 | 16 |
| 标称断态隔离度 | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB |
| 通态电阻匹配规范 | 12 Ω | 12 Ω | 12 Ω | 12 Ω | 12 Ω | 12 Ω |
| 最大通态电阻 (Ron) | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω |
| 最高工作温度 | 85 °C | 70 °C | 125 °C | 125 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -55 °C | -55 °C | -40 °C | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCN | QCCN | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | 245 | 240 | 240 | 240 | 245 |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 4.572 mm | 2.54 mm | 2.54 mm | 5.08 mm | 4.572 mm |
| 最大信号电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最大供电电流 (Isup) | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES | YES | NO | NO |
| 最长断开时间 | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns |
| 最长接通时间 | 2000 ns | 2000 ns | 2000 ns | 2000 ns | 2000 ns | 2000 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 长度 | - | 19.175 mm | 8.89 mm | 8.89 mm | - | 19.175 mm |
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