SRAM 1M, 3.3V, 15ns, FAST 128K x 8 Asynch SRAM
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 15 ns |
| JESD-30 代码 | R-PDSO-J32 |
| JESD-609代码 | e3 |
| 长度 | 20.955 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 245 |
| 座面最大高度 | 3.683 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |

| AS7C31024B-15TJCN | AS7C31024B-15JCN | AS7C31024B-12JCNTR | AS7C31024B-15JCNTR | AS7C31024B-15TCN | AS7C31024B-20JCNTR | AS7C31024B-12TCNTR | AS7C31024B-20TJCN | AS7C31024B-10TJCN | AS7C31024B-12TJCN | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM 1M, 3.3V, 15ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 15ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 12ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 15ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 15ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 20ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 12ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 20ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 10ns, FAST 128K x 8 Asynch SRAM | SRAM 1M, 3.3V, 12ns, FAST 128K x 8 Asynch SRAM |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOJ | SOJ | SOJ | SOJ | TSOP1 | SOJ | TSOP1 | SOJ | SOJ | SOJ |
| 包装说明 | SOJ, | SOJ, | SOJ, | SOJ, | TSOP1, TSSOP32,.8,20 | SOJ, | TSOP1, | SOJ, | SOJ, | SOJ, SOJ32,.34 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 15 ns | 15 ns | 12 ns | 15 ns | 15 ns | 20 ns | 12 ns | 20 ns | 10 ns | 12 ns |
| JESD-30 代码 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 |
| JESD-609代码 | e3 | e3 | e3/e6 | e3/e6 | e3 | e3/e6 | e3/e6 | e3 | e3 | e3 |
| 长度 | 20.955 mm | 20.955 mm | 20.955 mm | 20.955 mm | 18.4 mm | 20.955 mm | 18.4 mm | 20.955 mm | 20.955 mm | 20.955 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | SOJ | SOJ | SOJ | TSOP1 | SOJ | TSOP1 | SOJ | SOJ | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 | 260 | 245 | 260 | 245 | 245 | NOT SPECIFIED |
| 座面最大高度 | 3.683 mm | 3.7084 mm | 3.683 mm | 3.683 mm | 1.2 mm | 3.683 mm | 1.2 mm | 3.683 mm | 3.683 mm | 3.683 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | PURE MATTE TIN/TIN BISMUTH | PURE MATTE TIN/TIN BISMUTH | Matte Tin (Sn) | PURE MATTE TIN/TIN BISMUTH | PURE MATTE TIN/TIN BISMUTH | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | GULL WING | J BEND | GULL WING | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | NOT SPECIFIED |
| 宽度 | 7.62 mm | 10.16 mm | 10.16 mm | 10.16 mm | 8 mm | 10.16 mm | 8 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 3 | 3 | - | - | 3 | - | - | 3 | 3 | 3 |
| 厂商名称 | - | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | - | - | Alliance Memory |
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