NCP2811
NOCAPt Advanced Stereo
Headphone Amplifier
NCP2811 is a dual audio power amplifier designed for portable
communication device applications such as mobile phones. This part
is capable of delivering 27 mW of continuous average power into a
16
Ω
load from a 2.7 V power supply with a THD+N of 1%.
Based on the power supply delivered to the device, an internal
power management block generates a symmetrical positive and
negative voltage. Thus, the internal amplifiers provide outputs
referenced to Ground. In this True Ground configuration, the two
external heavy coupling capacitors can be removed. It offers
significant space and cost savings compared to a typical stereo
application.
NCP2811 is available with an external adjustable gain (version A),
or with an internal gain of
−1.5
V/V (version B). It reaches a superior
−100
dB PSRR and noise floor. Thus, it offers high fidelity audio
sound, as well as a direct connection to the battery. It contains circuitry
to prevent from “Pop & Click” noise that would otherwise occur
during turn−on and turn−off transitions. The device is available in 12
bump CSP package (2 x 1.5 mm) which help to save space on the
board. It is also available in WQFN12 and TSSOP−14 packages.
Features
1
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MARKING
DIAGRAMS
12 PIN CSP
FC SUFFIX
CASE 499AZ
x
2811xz
AYWW
G
= A for NCP2811A
= B for NCP2811B
z
= C for backside laminate
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
•
True Ground Configuration Output Eliminates DC−Blocking
WQFN12
MT SUFFIX
CASE 510AH
x
A
L
Y
W
G
= A for NCP2811A
= B for NCP2811B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
2811x
ALYWG
G
•
•
•
•
•
•
•
•
•
•
Capacitors:
−
Save Board Area
−
Save Component Cost
−
No Low−Frequency Response Attenuation
High PSRR (−100 dB): Direct Connection to the Battery
“Pop and Click” Noise Protection Circuitry
Internal Gain (−1.5 V/V) or External Adjustable Gain
Ultra Low Current Shutdown Mode
2.7 V – 5.0 V Operation
Thermal Overload Protection Circuitry
CSP 2 x 1.5 mm
WQFN12 3 x 3 mm
TSSOP−14
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
(Note: Microdot may be in either location)
14
14
1
TSSOP−14
DTB SUFFIX
CASE 948G
1
x
A
L
Y
W
G
= A for NCP2811A
= B for NCP2811B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
2811
x
ALYWG
G
Typical Applications
•
Headset Audio Amplifier for
−
Cellular Phones
−
MP3 Player
−
Personal Digital Assistant and Portable Media Player
−
Portable Devices
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2010
November, 2010
−
Rev. 3
1
Publication Order Number:
NCP2811/D
NCP2811
1
mF
CPM
CPP
1
mF
VP
1
mF
VP
1
mF
CPM
TSSOP14
NC
VP
CPP
PGND
CPM
PVM
SD
(Top View)
OUTL
OUTR
NC
INR
AGND
INL
NC
CPP
Audio Left
SD
Audio Right
C3
1
mF
C2
PGND
C4
PVM
PVM
B3
INL
SPVM B4
A2
10 OUTL
SD
A4
B2
OUTL
INR
A3
OUTR
OUTR
AGND
10
A version
A1
CPP
CPM
Figure 1. Application Schematics
WQFN12
12 PIN CSP
A1
AGND
B1
VP
C1
CPP
A2
SD
B2
INR
C2
A3
B3
INL
C3
A4
B4
SPVM
C4
PVM
PVM
SD
INL
CPP
PGND
CPM
NC
INR
AGND
VP
OUTL
OUTR
OUTR OUTL
PGND CPM
(Top View)
(Top View)
Figure 2. Pin Configurations
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2
CPP
CPM
B1 C1
VP
C3
1
mF
C2
PGND
C4
PVM
PVM
Audio Left B3
INL
SPVM
B4
SD
A2
SD
A4 10 OUTL
OUTL
Audio Right B2
INR
OUTR
A3
OUTR
AGND
10
A1
B version
B1 C1
VP
NCP2811
VP
Cs
1
mF
1
mF
VP
VRP
POWER MANAGEMENT
VRM
Left
Audio
CPP
CPM
PGND
PVM
SPVM
1
mF
VRP
INL
−
+
OUTL
VRM
SD
BIASING
CLICK/POP
SUPPRESSION
VRP
Right
Audio
INR
+
Use 10 ohm
resistor for
capacitive drive
capability
OUTR
−
VRM
AGND
Figure 3. Typical Application Schematic version A
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3
NCP2811
VP
Cs
1
mF
1
mF
VP
VRP
POWER MANAGEMENT
VRM
Left
Audio
INL
−
CPP
CPM
PGND
PVM
1
mF
VRP
+
OUTL
VRM
SD
BIASING
CLICK/POP
SUPPRESSION
VRP
Use 10 ohm resistor
for capacitive
drive capability
Right
Audio
INR
+
OUTR
−
VRM
AGND
Figure 4. Typical Application Schematic version B
Table 1. PIN FUNCTION DESCRIPTION
PIN
CSP
A1
A2
A3
A4
B1
B2
B3
B4
C1
C2
C3
C4
PIN
TQFN
7
5
10
11
12
8
6
−
1
2
3
4
PIN TS-
SOP
10
7
13
14
2
11
9
−
3
4
5
6
PIN
NAME
AGND
SD
OUTR
OUTL
VP
INR
INL
SPVM
CPP
PGND
CPM
PVM
TYPE
GROUND
INPUT
OUTPUT
OUTPUT
POWER
INPUT
INPUT
POWER
INPUT/
OUTPUT
GROUND
INPUT
OUTPUT
DESCRIPTION
Analog ground. Connect to ground reference
Enable activation
Right audio channel output signal
Left audio channel output signal
Positive supply voltage. It can be connected for example to a Lithium/Ion
battery
Right input of the first audio source
Left input of the first audio source
Amplifier negative power supply voltage. Connect to PVM
Charge pump flying capacitor positive terminal. A 1
mF
ceramic filtering
capacitor to CPM is needed
Power ground, connect to ground reference
Charge pump flying capacitor negative terminal. A 1
mF
ceramic filtering
capacitor to CPP is needed
Charge pump output. A 1
mF
ceramic filtering capacitor to ground is
needed
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4
NCP2811
Table 2. MAXIMUM RATINGS
Rating
AVIN, PVIN Pins: Power Supply Voltage (Note 2)
INL, INR Pins: Input (Note 2)
A version
B version
SD Pin: Input (Note 2)
Human Body Model (HBM) ESD Rating are (Note 3)
Machine Model (MM) ESD Rating are (Note 3)
CSP 1.5 x 2.0 mm package (Notes 6 and 7)
Thermal Resistance Junction to Case
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature (Note 6)
Storage Temperature Range
Moisture Sensitivity (Note 5)
Symbol
V
P
V
IN
−V
P
– 0.3 to V
P
+ 0.3
−2
to +2
V
YY
ESD HBM
ESD MM
R
qJC
T
A
T
J
T
JMAX
T
STG
MSL
−0.3
to V
P
+ 0.3
2000
200
(Note 7)
−40
to + 85
−40
to + 125
+ 150
−65
to + 150
Level 1
V
V
V
°C/W
°C
°C
°C
°C
Value
−
0.3 to + 6.0
Unit
V
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Notes:
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
A
= 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM)
±2.0
kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM)
±200
V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating:
±100
mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
JA
is highly dependent of the PCB Heatsink area. For example, R
JA
can equal 195°C/W with 50 mm
2
total area and also 135°C/W with
50 mm
2
. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.
R
qCA
+
125
*
T
A
*
R
qJC
P
D
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5
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