Supervisory Circuits
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SON |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 其他特性 | RESET THRESHOLD VOLTAGE IS 2.5V |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XDSO-N8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.12,25 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 14 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 0.14 mA |
| 最大供电电压 (Vsup) | 72 V |
| 最小供电电压 (Vsup) | 5.5 V |
| 标称供电电压 (Vsup) | 14 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| MAX6397YATA-T | MAX6397ZATA-T | MAX6398ATT-T | MAX6397TATA-T | MAX6397LATA-T | MAX6397MATA-T | MAX6397SATA-T | MAX6397WATA-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SON | SON | SON | SON | SON | SON | SON | SON |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEA, TDFN-6 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 |
| 针数 | 8 | 8 | 6 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N6 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 6 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON |
| 封装等效代码 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | 245 | 245 | 245 | 245 |
| 电源 | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电流 (Isup) | 0.14 mA | 0.14 mA | 0.13 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA |
| 最大供电电压 (Vsup) | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V |
| 最小供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 标称供电电压 (Vsup) | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 其他特性 | RESET THRESHOLD VOLTAGE IS 2.5V | RESET THRESHOLD VOLTAGE IS 2.5V | - | RESET THRESHOLD VOLTAGE IS 3.3V | RESET THRESHOLD VOLTAGE IS 5V | RESET THRESHOLD VOLTAGE IS 5V | RESET THRESHOLD VOLTAGE IS 3.3V | RESET THRESHOLD VOLTAGE IS 1.8V |
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