Junction Temperature ......................................................+150°C
Storage Temperature Range
............................ -55°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........29°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..............1.7°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
CCX
= V
CCRO
= V
CCT
=
2.85V to 3.47V, V
CCTO
= 2.97V to 3.47V, V
GND
= 0V, T
A
= -40°C to +95°C. Typical values are at V
CCX
=
V
CCRO
= V
CCT
=
V
CCTO
= 3.3V, 14Ω single-ended load for TOUTC/TOUTA, and T
A
= +25°C, unless otherwise noted. See Figure 1
for electrical setup.) (Note 2)
PARAMETER
Power-Supply Current
Power-On-Reset (Enable Part)
Power-On-Reset (Disable Part)
RX INPUT SPECIFICATION
Input Sensitivity for BER < 10
-12
Differential Input Resistance
Differential Output Voltage
Programming Range
Differential Output Voltage
when Squelched
Differential Output Resistance
V
RIN_MIN
R
RIN
2
31
-1 PRBS at 11.3Gbps
3
100
mV
P-P
Ω
SYMBOL
I
CC
V
POR_DE
V
POR_AS
CONDITIONS
Excludes current through TOUTC and
TOUTA; I
LD_MOD
= 60mA, I
LD_DC
=
40mA, and SET_CML[4:0] = 3d
MIN
TYP
105
2.5
2.4
MAX
130
UNITS
mA
V
V
RX OUTPUT SPECIFICATION (SET_RXDE[2:0] = 0xx)
V
ROUT
V
ROUT
R
ROUT
See Table 7 for more information
SQ_EN = 1
450
5
100
800
mV
P-P
mV
P-P
Ω
www.maximintegrated.com
Maxim Integrated │
2
MAX3956
11.3Gbps Transceiver with DDM and
DC-Coupled Laser Interface
Electrical Characteristics (continued)
(V
CCX
= V
CCRO
= V
CCT
=
2.85V to 3.47V, V
CCTO
= 2.97V to 3.47V, V
GND
= 0V, T
A
= -40°C to +95°C. Typical values are at V
CCX
=
V
CCRO
= V
CCT
=
V
CCTO
= 3.3V, 14Ω single-ended load for TOUTC/TOUTA, and T
A
= +25°C, unless otherwise noted. See Figure 1
for electrical setup.) (Note 2)
PARAMETER
Deterministic Jitter
SYMBOL
DJ
CONDITIONS
10.3Gbps (Notes 3, 4, and 5)
11.3Gbps (Notes 3, 4, and 5)
V
RIN
= 60mV
P-P
at 10.3Gbps,
11111 00000 pattern, SET_CML[4:0] =
10d (Note 3)
20% to 80%, RSEL = high,
(Notes 3 and 5) 11111 00000 pattern
(Note 6)
SET_LOS[6:0]
= 8d
SET_LOS[6:0] =
38d
SET_LOS[6:0] =
101d
Assert level
Deassert level
Assert level
Deassert level
Assert level
Deassert level
2.3
6
12
10
16.7
48
78
121
197
0
4.6
36
MIN
TYP
4.6
5.6
0.25
27
MAX
10
11
0.4
35
UNITS
ps
P-P
Random Jitter
ROUT Rise/Fall Time
RJ
t
R
/t
F
ps
RMS
ps
RX OMA BASED LOSS-OF-SIGNAL (LOS) SPECIFICATION (Notes 3 and 7)
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