NCP623
Ultra Low Noise
150 mA Low Dropout
Voltage Regulator with
ON/OFF Control
The NCP623 low dropout linear regulator can deliver up to 150 mA
of output current with a typical dropout voltage of 180 mV. This low
dropout feature helps to maintain a regulated output voltage for a
longer period of time as the lifetime of the battery decreases.
It is the ideal choice for noise sensitive environments like portable
applications where noise performance and space are at a premium. The
typical output noise voltage specification is 25
mV
RMS
. The space
saving package choices include a Micro8™ or DFN6. An additional
noise saving feature of this device is its ability to filter choppy signals
on the power supply by providing a typical DC ripple rejection of
−90
dB and
−70
dB at 1.0 kHz.
The NCP623 is designed to work with very low ESR capacitors such
as ceramic capacitors which are common in the industry now.
Additional features such as thermal shutdown and short−circuit
protection provide for a robust system design.
Features
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MARKING
DIAGRAMS
8
Micro8
DM SUFFIX
CASE 846A
1
DFN6, 3X3
MN SUFFIX
CASE 488AE
NCP6
23yy
ALYW
G
G
Lxx
AYW
G
G
1
•
Very Low Quiescent Current 170
mA
(ON, no load), 100 nA
•
•
•
•
•
•
•
•
•
•
•
(OFF, no load)
Very Low Dropout Voltage, Typical Value is 137 mV at an Output
Current of 100 mA
Very Low Noise with External Bypass Capacitor (10 nF),
Typically 25
mV
RMS
over 100 Hz to 100 kHz
Internal Thermal Shutdown
Extremely Tight Line Regulation Typically
−90
dB
Ripple Rejection
−70
dB @ 1.0 kHz
Line Transient Response: 1.0 mV for
DV
in
= 3.0 V
Extremely Tight Load Regulation, Typically 20 mV at
DI
out
= 150 mA
Multiple Output Voltages Available
Logic Level ON/OFF Control (TTL−CMOS Compatible)
Output Capacitor ESR Can Vary from 0
W
to 3.0
W
Pb−Free Packages are Available
ON/OFF
Applications
Telephones, Radio Control Systems, Toys and Low Voltage Systems
V
IN
1
2
3
6
5
4
GND
V
OUT
DFN6
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2011
January, 2011
−
Rev. 9
1
Publication Order Number:
NCP623/D
ÇÇ
ÇÇ
ÇÇ
Ç
Ç
Ç
•
All Portable Systems, Battery Powered Systems, Cellular
Ç
Ç
Ç
1
= Device Code (Micro8)
xx = See Ordering Information
NCP623yy = Device Code (DFN6)
yy = 25, 28, 30, 33, 40, or 50
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb Free Package
(Note: Microdot may be in either location)
Lxx
PIN CONNECTIONS
Bypass
NC
NC
1
2
3
4
Micro8
(Top View)
8
7
6
5
V
OUT
GND
GND
V
IN
ON/OFF
GND
Bypass
NCP623
V
IN
On/Off
ON/OFF
Thermal
Shutdown
Bypass
Band Gap
Reference
* Current Limit
* Antisaturation
*
Protection
V
OUT
GND
GND
Figure 1. NCP623 Block Diagram
MAXIMUM RATINGS
Rating
Power Supply Voltage
Power Dissipation and Thermal Resistance
Maximum Power Dissipation
Case 488AE (DFN6, 3x3) MN Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 846A (Micro8) DM Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Operating Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
ESD Protection
−
Human Body Model
−
Machine Model
Symbol
V
in
P
D
R
qJA
**psi−JC* or
Y
JC
R
qJA
R
qJC
T
A
T
Jmax
T
stg
V
ESD
Value
12
Internally Limited
161
13
240
105
−40
to +85
150
−60
to +150
2000
200
°C
°C
°C
V
Unit
V
W
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
** Refer to the JEDEC Specs (51−2, 51−6).
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2
NCP623
ELECTRICAL CHARACTERISTICS
(For typical values T
A
= 25°C, for min/max values T
A
=
−40°C
to +85°C, Max T
J
= 150°C)
Characteristics
CONTROL ELECTRICAL CHARACTERISTICS
Input Voltage Range
ON/OFF Input Current (All versions)
V
ON/OFF
= 2.4 V
ON/OFF Input Voltages (All versions)
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions)
OFF Mode Current: V
IN
= V
out
+1.0 V, I
out
= 0 mA
Current Consumption in ON State (All versions)
ON Mode Sat Current: V
in
= V
out
+ 1.0 V, I
out
= 0 mA
Current Consumption in Saturation ON State (All versions)
ON Mode Sat Current: V
IN
= 2.5 V or V
in
= V
out
−
0.4 V (Whichever is Higher), I
out
= 0 mA
Current Limit V
in
= V
out
+ 1.0 V, (All versions) (Note 1)
V
in
= V
out
+ 1.0 V, T
A
= 25°C, 1.0 mA < I
out
< 150 mA
2.5 Suffix
2.8 Suffix
3.0 Suffix
3.3 Suffix
4.0 Suffix
4.5 Suffix
5.0 Suffix
V
in
= V
out
+ 1.0 V,
−40°C
< T
A
< 85°C, 1.0 mA < I
out
< 150 mA
2.5 Suffix
2.8 Suffix
3.0 Suffix
3.3 Suffix
4.0 Suffix
4.5 Suffix
5.0 Suffix
LINE AND LOAD REGULATION, DROPOUT VOLTAGES
Line Regulation (All versions)
V
out
+ 1.0 V < V
in
< 12 V, I
out
= 60 mA
Load Regulation (All versions)
I
out
= 1.0 to 60 mA
I
out
= 1.0 to 100 mA
I
out
= 1.0 to 150 mA
Dropout Voltage (All versions)
I
out
= 10 mA
I
out
= 100 mA
I
out
= 150 mA
V
in
−
V
out
mV
−
−
−
30
137
180
90
230
260
V
in
= V
out
+ 1.0 V
Reg
line
Reg
load
mV
−
−
−
−
2.0
8.0
15
20
10
mV
25
35
45
IQ
OFF
IQ
ON
IQ
SAT
I
MAX
V
out
−
−
−
175
2.45
2.74
2.94
3.23
3.92
4.41
4.90
2.41
2.70
2.89
3.18
3.86
4.34
4.83
0.1
170
900
210
2.5
2.8
3.0
3.3
4.0
4.5
5.0
2.5
2.8
3.0
3.3
4.0
4.5
5.0
2.0
200
1400
−
2.55
2.86
3.06
3.37
4.08
4.59
5.1
V
2.59
2.90
3.11
3.42
4.14
4.66
5.17
mA
mA
mA
mA
V
V
ON/OFF
I
ON/OFF
V
ON/OFF
2.5
−
−
2.2
−
2.5
−
−
V
in
−
0.3
−
V
mA
V
Symbol
Min
Typ
Max
Unit
V
out
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NCP623
ELECTRICAL CHARACTERISTICS
(For typical values T
A
= 25°C, for min/max values T
A
=
−40°C
to +85°C, Max T
J
= 150°C)
Characteristics
DYNAMIC PARAMETERS
Ripple Rejection (All versions)
V
in
= V
out
+ 1.0 V, V
pp
= 1.0 V, f = 1.0 kHz, I
out
= 60 mA
Line Transient Response
V
in
= V
out
+ 1.0 V to V
out
+ 4.0 V, I
out
= 60 mA, d(V
in
)/dt = 15 mV/ms
Output Noise Voltage (All versions)
C
out
= 1.0
mF,
I
out
= 60 mA, f = 100 Hz to 100 kHz
C
bypass
= 10 nF
C
bypass
= 1.0 nF
C
bypass
= 0 nF
Output Noise Density
C
out
= 1.0
mF,
I
out
= 60 mA, f = 1.0 kHz
Output Rise Time (All versions)
C
out
= 1.0
mF,
I
out
= 30 mA, V
ON/OFF
= 0 to 2.4 V
1% of ON/OFF Signal to 99% of Nominal Output Voltage
Without Bypass Capacitor
With C
bypass
= 10 nF
THERMAL SHUTDOWN
Thermal Shutdown (All versions)
−
150
−
°C
1. I
MAX
(Output Current Limit) is the current measured when the output voltage drops below 0.3 V with respect to V
out
at I
out
= 30 mA.
V
N
t
r
−
−
40
1.1
−
−
ms
ms
−
230
−
nV/
√Hz
V
RMS
−
−
−
25
40
65
−
−
−
dB
60
−
70
1.0
−
mV
−
mVrms
Symbol
Min
Typ
Max
Unit
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4
NCP623
DEFINITIONS
Load Regulation
−
The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage
−
The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage
−
The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation
−
The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current
−
Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation
−
The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Line Transient Response
−
Typical over− and
undershoot response when input voltage is excited with a
given slope.
Thermal Protection
−
Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150°C, the regulator turns off.
This feature is provided to prevent catastrophic failures from
accidental overheating.
Maximum Package Power Dissipation
−
The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125°C. The junction temperature is rising while the
difference between the input power (V
CC
X I
CC
) and the
output power (V
out
X I
out
) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the I
C
has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for NCP623) and ambient
temperature.
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