SRAM 18Mb 100Mhz 512Kx36 Flow-Thru SRAM
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Cypress(赛普拉斯) |
| 产品种类 Product Category | SRAM |
| RoHS | Details |
| Memory Size | 18 Mbit |
| Organization | 512 k x 36 |
| Access Time | 8.5 ns |
| Maximum Clock Frequency | 100 MHz |
| 接口类型 Interface Type | Parallel |
| 电源电压-最大 Supply Voltage - Max | 3.6 V |
| 电源电压-最小 Supply Voltage - Min | 3.135 V |
| Supply Current - Max | 175 mA |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 85 C |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | FBGA-165 |
| 系列 Packaging | Tray |
| 数据速率 Data Rate | SDR |
| Memory Type | SDR |
| 类型 Type | Synchronous |
| Number of Ports | 4 |
| Moisture Sensitive | Yes |
| NumOfPackaging | 1 |
| 工厂包装数量 Factory Pack Quantity | 136 |
| CY7C1381D-100BZXI | CY7C1381D-100BZIT | CY7C1381D-133AXI | CY7C1381D-133AXC | CY7C1381D-133AXCT | CY7C1381D-100BZI | CY7C1383D-133AXCT | |||
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM 18Mb 100Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 100Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 133Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 133Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 133Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 100Mhz 512Kx36 Flow-Thru SRAM | SRAM 18Mb 133Mhz 1M x 18 Flow-Thru SRAM | ||
| 是否无铅 | - | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | ||
| 是否Rohs认证 | - | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | ||
| 包装说明 | - | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 | ||
| Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant | compliant | ||
| ECCN代码 | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | ||
| 最长访问时间 | - | 8.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 8.5 ns | 6.5 ns | ||
| 其他特性 | - | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | ||
| 最大时钟频率 (fCLK) | - | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz | 133 MHz | ||
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | ||
| JESD-30 代码 | - | R-PBGA-B165 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B165 | R-PQFP-G100 | ||
| JESD-609代码 | - | e0 | e3 | e3 | e4 | e0 | e4 | ||
| 长度 | - | 15 mm | 20 mm | 20 mm | 20 mm | 15 mm | 20 mm | ||
| 内存密度 | - | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | ||
| 内存集成电路类型 | - | STANDARD SRAM | CACHE SRAM | CACHE SRAM | STANDARD SRAM | CACHE SRAM | STANDARD SRAM | ||
| 内存宽度 | - | 36 | 36 | 36 | 36 | 36 | 18 | ||
| 湿度敏感等级 | - | 3 | 3 | 3 | 3 | 3 | 3 | ||
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | ||
| 端子数量 | - | 165 | 100 | 100 | 100 | 165 | 100 | ||
| 字数 | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 1048576 words | ||
| 字数代码 | - | 512000 | 512000 | 512000 | 512000 | 512000 | 1000000 | ||
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | ||
| 最高工作温度 | - | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | ||
| 组织 | - | 512KX36 | 512KX36 | 512KX36 | 512KX36 | 512KX36 | 1MX18 | ||
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | ||
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | ||
| 封装代码 | - | LBGA | LQFP | LQFP | LQFP | LBGA | LQFP | ||
| 封装等效代码 | - | BGA165,11X15,40 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | BGA165,11X15,40 | QFP100,.63X.87 | ||
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ||
| 封装形式 | - | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE | ||
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | ||
| 峰值回流温度（摄氏度） | - | 220 | 250 | 260 | 260 | 220 | 260 | ||
| 电源 | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | ||
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | ||
| 座面最大高度 | - | 1.4 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.4 mm | 1.6 mm | ||
| 最大待机电流 | - | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A | ||
| 最小待机电流 | - | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | ||
| 最大压摆率 | - | 0.175 mA | 0.21 mA | 0.21 mA | 0.21 mA | 0.175 mA | 0.21 mA | ||
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | ||
| 最小供电电压 (Vsup) | - | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | ||
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | ||
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | ||
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | ||
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | ||
| 端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | ||
| 端子形式 | - | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING | ||
| 端子节距 | - | 1 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1 mm | 0.65 mm | ||
| 端子位置 | - | BOTTOM | QUAD | QUAD | QUAD | BOTTOM | QUAD | ||
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 40 | 20 | 20 | NOT SPECIFIED | 20 | ||
| 宽度 | - | 13 mm | 14 mm | 14 mm | 14 mm | 13 mm | 14 mm | ||
| 厂商名称 | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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