Datasheet
AS1371
4 0 0 m A , L o w I n p u t Vol t a g e , L o w Q u i e s c e n t C u r r e n t L D O
1 General Description
The AS1371 low input voltage, positive voltage regulator is designed
to deliver up to 400mA while consuming typically only 15µA of
quiescent current. The device operates from input voltages of 1.2V
to 3.6V, and is available in fixed output voltages between 0.6V and
3.3V (programmable in 50mV steps).
Operation at the full 400mA load current is dependent upon the
maximum power dissipation available from package and
environment.
The low input voltage and ultra-low dropout voltage (20mV @
100mA load and 80mV @ 400mA load) supports single primary cell
operation in small applications, when operated with minimum input-
to-output voltage differentials. In addition, the regulator provides a
power management life extension by operating from pre-existing
1.8V and 2.5V outputs to provide low output voltages for new
generation portable processor cores.
The device features stable output voltage with ceramic capacitors
down to a value of 1µF, strict output voltage regulation tolerances
(±1%), and good line- and load-regulation.
The AS1371 is available in a 6-pin 2x2 TDFN package and is
qualified for -40°C to +85°C operation.
2 Key Features
Ultra-Low Dropout Voltage: 20mV @ 100mA load
Operating Input Voltage Range: 1.2V to 3.6V
Output Voltages: 0.6V to 3.3V in 50mV steps
Max. Output Current: 400mA
Output Voltage Accuracy: ±1%
Low Shutdown Current: 10nA
Low Quiescent Current: 50µA @ max load
Integrated Overtemperature/Overcurrent Protection
Under-Voltage Lockout Feature
Chip Enable Input
Power-OK and Low Battery Detection
Sense Input Option
Minimal External Components Required
Operating Temperature Range: -40°C to +85°C
6-pin 2x2 TDFN Package
3 Applications
Figure 1. AS1371 - Typical Application Diagram
The devices are ideal for powering cordless and mobile phones,
MP3 players, CD and DVD players, PDAs, hand-held computers,
digital cameras, and any other hand-held and/or battery-powered
device.
Input
1.2V to 3.6V
C
IN
1µF
ON
OFF
IN
OUT
Output
0.6V to 3.3V
C
OUT
1µF
AS1371
EN
POK
100k
GND
SENSE
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AS1371
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
IN 1
POK 2
EN 3
6
OUT
SENSE
GND
AS1371
Exposed Pad
5
4
4.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Number
1
2
3
4
5
6
Exposed Pad
Pin Name
IN
POK
EN
GND
SENSE
OUT
GND
Description
LDO Input.
Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND.
Power-OK Output.
Active-low, open-drain output indicates an out-of-regulation condition.
Connect a 100k pull-up resistor to pin OUT for logic levels. Leave this pin unconnected if the
Power-OK feature is not used.
Active-High Enable Input.
A logic low reduces the supply current to < 1µA.
Connect to pin IN for normal operation.
Ground.
This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board
ground plane to maximize power dissipation.
Sense Input.
Represents the input for the Power-OK behavior. If connected to GND the POK
output is related to OUT.
LDO Output.
Bypass with 1µF to GND.
Exposed Pad.
This pin also functions as a heat sink. Solder it to a large pad or to the circuit-
board ground plane to maximize power dissipation. Internally it is connected GND.
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AS1371
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Section 6 Electrical Characteristics on page 4
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
IN and EN to GND
POK and OUT to GND
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
Temperature Ranges and Storage Conditions
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power
dissipation exists, special attention must be paid
to thermal dissipation during board design.
±1000
V
Norm: MIL 883 E method 3015
-0.3
-0.3
-100
+5.0
V
IN
+ 0.3
100
V
V
mA
Norm: JEDEC 78
Min
Max
Units
Notes
Thermal Resistance
JA
+78.6
ºC/W
Junction Temperature
Storage Temperature Range
-55
+125
+125
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Represents a maximum floor life time of unlimited
Package Body Temperature
+260
ºC
Humidity non-condensing
Moisture Sensitive Level
5
1
85
%
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AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
V
IN
= V
OUT
(Nominal) + 0.5V, EN = IN, C
IN
= C
OUT
= 1µF, T
AMB
= -40°C to +85ºC (unless otherwise specified).
Typical Values are at T
AMB
= +25ºC.
Table 3. Electrical Characteristics
Symbol
T
AMB
V
IN
V
OUT
Parameter
Operating Temperature Range
Input Voltage
Output Voltage
Available in 50mV steps,
see
Ordering Information on page 16
T
AMB
= +25ºC, I
OUT
= 1mA,
1V
V
OUT
>
Conditions
Min
-40
1.2
0.6
-2
-3.5
400
650
I
OUT
= 0mA
I
OUT
= 400mA
I
OUT
= 100mA
I
OUT
= 400mA
I
OUT
= 1mA
I
OUT
= 1mA to 400mA
f = 10Hz to 100kHz, I
OUT
= 10mA
f = 10kHz, I
OUT
= 10mA
Load Capacitor Range
ESR Load
0.47
-15
15
50
20
80
0
0.003
100
50
1
500
+15
50
20
Typ
Max
+85
3.6
3.3
+2
%
+3.5
mA
mA
µA
mV
mV
%/mA
µV
RMS
dB
µF
m
Units
°C
V
V
Output Voltage Accuracy
T
AMB
= -40 to +85ºC, I
OUT
= 1mA,
V
OUT
> 1V
I
OUT
I
LIM
I
Q
V
IN
-V
OUT
V
LNR
V
LDR
Maximum Output Current
Current Limit
Quiescent Current
1
Dropout Voltage
Line Regulation
Load Regulation
Output Voltage Noise
PSRR
C
OUT
Shutdown
t
ON
I
OFF
V
IH
V
IL
I
EN
2
Output Voltage AC
Power-Supply Rejection Ratio
Output Capacitor
Exit Delay from Shutdown
Enable Supply Current
Enable Input Threshold
3,4
90
EN = GND, T
AMB
= +25ºC
EN = GND, T
AMB
= +85ºC
1.0
0.01
0.04
150
1
µs
µA
V
nA
0.4
EN = IN or GND, T
AMB
= +25ºC
EN = IN or GND, T
AMB
= +85ºC
SENSE = GND, V
POKFALLING
SENSE = GND, Hysteresis
V
OUT
½
1.05V, V
SENSE
falling
Hysteresis
I
SINK
= 100µA
650
90
0.03
0.2
94
1
800
50
0.4
950
97
100
Enable Input Bias Current
Power-OK Output
V
POK
V
SENSE
V
OL
Power-OK Voltage Threshold
5
% V
OUT
mV
V
Power-OK Sense Voltage Threshold
POK Output Voltage Low
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AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics
Symbol
I
POK
Parameter
POK Output Leakage Current
Conditions
0
V
POK
3.6V,
T
AMB
= +25ºC, V
OUT
in
regulation
150
15
Min
Typ
Max
1
Units
µA
Thermal Protection
T
SHDN
T
SHDN
1.
2.
3.
4.
5.
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
ºC
ºC
Dropout voltage = V
IN
- V
OUT
when V
OUT
is 100mV < V
OUT
for V
IN
= V
OUT(NOM)
+0.5V (applies only to output voltages
1.3V).
The rise and fall time of the shutdown signal must not exceed 1ms.
The delay time is defined as time required to set V
OUT
to 95% of its final nominal value.
Guaranteed by design.
The functionality is proven by production test, limits are guaranteed by design.
Note:
All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality
Control) methods.
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