The ICS671-01 is a low phase noise, high speed PLL
based, 8 output, low skew zero delay buffer and multiplier.
Based on IDT’s proprietary low jitter Phase Locked Loop
(PLL) techniques, the device provides eight low skew
outputs at speeds up to 160 MHz at 3.3V. The part includes
a bank of six outputs running at either x2 or x4 mode, one
output running at either x2, x4, or x4 mode, and one
additional output running at either x1, x2, or x4 mode. For
normal operation as a zero delay buffer, any output clock is
tied to the FBIN pin.
IDT manufactures the largest variety of clock generators
and buffers and is the largest clock supplier in the world.
ICS671-01
Features
•
•
•
•
•
•
•
Packaged in 16 pin SOIC
Pb (lead) free package, RoHS compliant
Clock outputs from 5 to 160 MHz
Zero input-output delay
Integrated x2 or x4 selections, and x5 for CLK7
Eight low-skew (<250 ps) outputs
Full CMOS outputs with 25 mA output drive capability at
TTL levels
•
Tri-state mode for board-level testing
•
Advanced, low power, sub-micron CMOS process
•
Operating voltage of 3.3V or 5V
Block Diagram
VDD
2
CLK1
CLK2
CLK3
CLK4
CLK5
CLK6
CLK7
CLK8
CLKIN
FBIN
x2, x4, or x5
PLL
S1, S0
2
Control
Logic
2
GND
IDT™ / ICS™
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
1
ICS671-01
REV F 051310
ICS671-01
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Pin Assignment
C L K IN
CLK1
CLK2
VDD
GND
CLK3
CLK4
S0
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
F B IN
C LK8
C LK7
VDD
GND
C LK6
C LK5
S1
1 6 p in n a rro w (1 5 0 m il) S O IC
Output Clock Mode Select Table
S1
0
0
1
1
S0
0
1
0
1
CLK1:6
Tri-state (note 1)
x2 (note 2)
x2
x4
CLK7
Tri-state (note 1)
x5 (note 2)
x2
x4
CLK8
Tri-state (note 1)
x1
x2
x4
Input Range
-
5 to 30 MHz
15 to 80 MHz
7.5 to 40 MHz
Note 1. Outputs are in high impedence state
Note 2: In S1:S0 = 01 Mode, only the x1 output on CLK 8 will be zero delay. The x2 and x5 outputs can power-up in different
states so the skew relationship is not defined.
Pin Descriptions
Pin
Number
1
2-3, 6-7, 10-11
4
5
8
9
12
13
14
15
16
Pin
Name
CLKIN
CLK1:6
VDD
GND
S0
S1
GND
VDD
CLK7
CLK8
FBIN
Pin Type
Input
Output
Power
Power
Input
Input
Power
Power
Output
Output
Input
Clock input.
Clock outputs 1:6. See table above.
Power supply. Connect both pins to the same voltage (either 3.3V or 5V).
Connect to ground.
Select input 0. See table above.
Select input 1. See table above.
Connect to ground.
Power supply. Connect both pins to the same voltage (either 3.3V or 5V).
Clock output 7. See table above.
Clock output 8. See table above. Normally use this clock as feedback.
Feedback input. Connect to CLK8 under normal operations.
Pin Description
IDT™ / ICS™
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
2
ICS671-01
REV F 051310
ICS671-01
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
External Components
The ICS671-01 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.01mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as
close to the device as possible. A series termination resistor of 33Ω may be used to each clock output pin to reduce
reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS671-01. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
CLKIN and FBIN inputs
Electrostatic Discharge
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
7V
Rating
-0.5V to VDD+0.5V
-0.5V to 5.5V
2000 V
0 to +70° C
-65 to +150° C
150° C
260° C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.13
Typ.
Max.
+70
+5.50
Units
°
C
V
DC Electrical Characteristics
VDD=3.3V ±10%,
Ambient temperature 0 to +70° C, unless stated otherwise
Parameter
Operating Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Input Low Voltage
Input Low Current
Input High Current
Output High Voltage
Symbol
VDD
V
IH
V
IL
V
IH
V
IL
I
IL
I
IH
V
OH
Conditions
CLKIN
CLKIN
Min.
3.13
Typ.
Max.
5.5
Units
V
V
V
V
V
µA
µA
V
VDD/2+1 VDD/2
VDD/2 VDD/2-1
2
0.8
VIN = 0V
VIN = VDD
I
OH
= -25 mA
2.4
50
100
IDT™ / ICS™
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
3
ICS671-01
REV F 051310
ICS671-01
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Parameter
Ouput Low Voltage
Output High Voltage,
CMOS level
Operating Supply Current
Symbol
V
OL
V
OH
IDD
Conditions
I
OL
= 25mA
I
OH
= -8 mA
No Load, S1 = 1, S0 = 0,
Note 1
No Load, S1 = 1, S0 =0
Note 2
Min.
VDD-0.4
Typ.
Max.
0.4
Units
V
V
25
mA
Power Down Supply
Current
Short Circuit Current
Input Capacitance
IDDPD
I
OS
C
IN
CLKIN = 0, S0 = 0, S1 = 0
Each output
S0, S1, FBIN
500
±50
7
µA
mA
pF
AC Electrical Characteristics
VDD = 3.3V ±10%,
Ambient Temperature 0 to +70° C, C
LOAD
at CLK = 15 pF, unless stated otherwise
Parameter
Input Clock Frequency
Output Clock Frequency
Output Rise Time
Output Fall Time
Output Clock Duty Cycle
Device to Device Skew
Output to Output Skew
Input to Output Skew
Maximum Absolute JItter
Cycle to Cycle Jitter
PLL Lock Time
Symbol
f
IN
t
OR
t
OF
t
DC
Conditions
See table on page 2
See table on page 2
0.8 to 2.0V, CL=30 pF
2.0 to 0.8V, CL=30 pF
measured at VDD/2
rising edges at VDD/2, Note 3
rising edges at VDD/2, Note 3
rising edges at VDD/2, FBIN to
CLK8
15 pF
30 pF loads
Note 3
Min.
5
5
Typ.
Max. Units
80
160
1.5
1.5
MHz
MHz
ns
ns
%
ps
ps
ps
ps
500
1.0
ps
ms
40
50
60
700
250
±350
300
Note 1: With CLKIN = 20 MHz, FBIN to CLK8, all outputs at 40 MHz.
Note 2:With CLKIN = 80 MHz, FBIN to CLK8, all outputs at 160 MHz.
Note 3: These specs do not apply to mode 01.
Thermal Characteristics (16 pin SOIC)
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
120
115
105
58
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
IDT™ / ICS™
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
4
ICS671-01
REV F 051310
ICS671-01
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Package Outline and Package Dimensions
(16 pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Symbol
Min
Max
Inches
Min
Max
16
E
INDEX
AREA
H
1 2
D
A
A1
B
C
D
E
e
H
h
L
α
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
9.80
10.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
0
°
8
°
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.3859
.3937
.1497
.1574
0.050 BASIC
.2284
.2440
.010
.020
.016
.050
0
°
8
°
A
A1
h x 45
C
-C-
e
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
671M-01LF
671M-01LFT
Marking
ICS671M-01LF
ICS671M-01LF
Shipping Packaging
Tubes
Tape and Reel
Package
16-pin SOIC
16-pin SOIC
Temperature
0 to +70° C
0 to +70° C
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility
for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses
are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range,
high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to
change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical