SiHP25N40D
www.vishay.com
Vishay Siliconix
D Series Power MOSFET
PRODUCT SUMMARY
V
DS
(V) at T
J
max.
R
DS(on)
max. at 25 °C ()
Q
g
max. (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
88
12
23
Single
D
FEATURES
450
0.17
TO-220AB
• Optimal Design
- Low Area Specific On-Resistance
- Low Input Capacitance (C
iss
)
- Reduced Capacitive Switching Losses
- High Body Diode Ruggedness
- Avalanche Energy Rated (UIS)
• Optimal Efficiency and Operation
- Low Cost
- Simple Gate Drive Circuitry
- Low Figure-of-Merit (FOM): R
on
x Q
g
- Fast Switching
• Compliant to RoHS Directive 2011/65/EU
Note
*
Pb containing terminations are not RoHS compliant, exemptions
may apply
G
S
S
N-Channel MOSFET
G
D
APPLICATIONS
• Consumer Electronics
- Displays (LCD or Plasma TV)
• Lighting
• Industrial
- Welding
- Induction Heating
- Motor Drives
- Battery Chargers
• SMPS
ORDERING INFORMATION
Package
Lead (Pb)-free
Lead (Pb)-free and Halogen-free
TO-220AB
SiHP25N40D-E3
SiHP25N40D-GE3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Gate-Source Voltage AC (f > 1 Hz)
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain
Current
a
Energy
b
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
E
AS
P
D
T
J
, T
stg
T
J
= 125 °C
for 10 s
dV/dt
LIMIT
400
± 30
30
25
16
78
2.2
556
278
- 55 to + 150
24
0.6
300
c
W/°C
mJ
W
°C
V/ns
°C
A
V
UNIT
Linear Derating Factor
Single Pulse Avalanche
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Drain-Source Voltage Slope
Reverse Diode dV/dt
d
Soldering Recommendations (Peak Temperature)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 2.3 mH, R
g
= 25
,
I
AS
= 17 A.
c. 1.6 mm from case.
d. I
SD
I
D
, starting T
J
= 25 °C.
S12-0625-Rev. B, 26-Mar-12
Document Number: 91483
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHP25N40D
www.vishay.com
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
SYMBOL
R
thJA
R
thJC
TYP.
-
-
MAX.
62
0.45
UNIT
°C/W
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage (N)
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Input Resistance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
S
I
SM
V
SD
t
rr
Q
rr
I
RRM
T
J
= 25 °C, I
F
= I
S
= 13 A,
dI/dt = 100 A/μs, V
R
= 20 V
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
g
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 250 μA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 30 V
V
DS
= 400 V, V
GS
= 0 V
V
DS
= 320 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 13 A
V
DS
= 50 V, I
D
= 13 A
400
-
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.5
-
-
-
-
0.14
7.4
1707
177
19
44
12
23
21
57
40
37
1.8
-
-
5
± 100
1
10
0.17
-
-
-
-
88
-
-
42
86
80
74
-
V
V/°C
V
nA
μA
S
V
GS
= 0 V,
V
DS
= 100 V,
f = 1 MHz
pF
V
GS
= 10 V
I
D
= 13 A, V
DS
= 320 V
nC
V
DD
= 320 V, I
D
= 13 A,
V
GS
= 10 V, R
g
= 24.6
f = 1 MHz, open drain
ns
-
-
-
-
-
-
-
-
-
353
4.4
24
24
A
78
1.2
-
-
-
V
ns
μC
A
G
S
T
J
= 25 °C, I
S
= 13 A, V
GS
= 0 V
S12-0625-Rev. B, 26-Mar-12
Document Number: 91483
2
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHP25N40D
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Vishay Siliconix
80
I
D
, Drain-to-Source Current (A)
R
DS(on)
, Drain-to-Source
On Resistance (Normalized)
60
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
7V
6V
BOTTOM 5 V
TOP
3
T
J
= 25 °C
2.5
2
1.5
1
V
GS
= 10 V
0.5
0
- 60 - 40 - 20 0
I
D
= 13 A
40
20
0
0
5
10
15
20
25
30
20 40 60 80 100 120 140 160
V
DS
, Drain-to-Source Voltage (V)
Fig. 1 - Typical Output Characteristics
T
J
, Junction Temperature (°C)
Fig. 4 - Normalized On-Resistance vs. Temperature
60
I
D
, Drain-to-Source Current (A)
50
40
30
20
10
Capacitance (pF)
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
7V
BOTTOM 6 V
TOP
10 000
T
J
= 150 °C
C
iss
1000
C
oss
100
C
rss
10
5V
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
Shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
0
0
5
10
15
20
25
30
1
0
100
200
300
400
V
DS
, Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
V
DS
, Drain-to-Source Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
100
24
V
GS
,
Gate-to-Source
Voltage (V)
I
D
, Drain-to-Source Current (A)
80
20
16
12
8
4
0
V
DS
= 320 V
V
DS
= 200 V
V
DS
= 80 V
60
40
T
J
= 150 °C
20
T
J
= 25 °C
0
0
5
10
15
20
25
0
10
20
30
40
50
60
70
80
V
DS
, Drain-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
S12-0625-Rev. B, 26-Mar-12
Q
g
, Total
Gate
Charge (nC)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Document Number: 91483
3
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHP25N40D
www.vishay.com
Vishay Siliconix
100
30
I
SD
, Reverse Drain Current (A)
10
T
J
= 25 °C
I
D
, Drain Current (A)
T
J
= 150 °C
24
18
12
1
6
V
GS
= 0 V
0.1
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
25
50
75
100
125
150
V
SD
,
Source-Drain
Voltage (V)
Fig. 7 - Typical Source-Drain Diode Forward Voltage
T
J
, Case Temperature (°C)
Fig. 9 - Maximum Drain Current vs. Case Temperature
1000
Operation in this Area
Limited by R
DS(on)
100
I
D
, Drain Current (A)
I
DM
= Limited
500
475
V
DS
, Drain-to-Source
Brakdown Voltage (V)
10
Limited by R
DS(on)
*
1
100 μs
1 ms
10 ms
450
425
400
375
0.1
T
C
= 25 °C
T
J
= 150 °C
Single
Pulse
1
BVDSS Limited
350
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
0.01
10
100
1000
V
DS
, Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is
specified
T
J
, Junction Temperature (°C)
Fig. 10 - Temperature vs. Drain-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
Single
Pulse
0.02
0.01
0.0001
0.001
0.01
0.1
1
Pulse Time (s)
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case
S12-0625-Rev. B, 26-Mar-12
Document Number: 91483
4
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHP25N40D
www.vishay.com
Vishay Siliconix
R
D
10 V
Q
G
V
DS
V
GS
R
G
D.U.T.
+
-
V
DD
Q
GS
Q
GD
10 V
Pulse width
≤
1 µs
Duty factor
≤
0.1 %
V
G
Charge
Fig. 12 - Switching Time Test Circuit
Fig. 16 - Basic Gate Charge Waveform
Current regulator
Same type as D.U.T.
50 kΩ
12 V
V
DS
90 %
0.2 µF
0.3 µF
+
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
V
GS
3 mA
D.U.T.
-
V
DS
Fig. 13 - Switching Time Waveforms
I
G
I
D
Current sampling resistors
L
Vary t
p
to obtain
required I
AS
R
G
V
DS
Fig. 17 - Gate Charge Test Circuit
D.U.T
I
AS
+
-
V
DD
10 V
t
p
0.01
Ω
Fig. 14 - Unclamped Inductive Test Circuit
V
DS
t
p
V
DD
V
DS
I
AS
Fig. 15 - Unclamped Inductive Waveforms
S12-0625-Rev. B, 26-Mar-12
Document Number: 91483
5
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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