NUMBER
TYPE
GS-12-1321
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1 of 10
Minitek 1.5mm Wire to Board Connectors
AUTHORIZED BY
DATE
A
2015-07-02
Kenny Tai
CLASSIFICATION
UNRESTRICTED
1.0
Objective
This specification defines the performance, test, quality and reliability requirements of the Minitek 1.5mm
Wire to Board Connectors.
2.0
Scope
This specification is applicable to the termination characteristics of the Minitek 1.5mm Wire to Board
Connectors which provides interconnecting between PCB receptacle connectors and cable header
connectors.
3.0
Applicable FCI Product Series
Plug HSG: FCI base number 10135175.
Plug Crimp Terminal: FCI base number 10135176.
Vertical Mount, SMT, Receptacle Connector: FCI base number 10135177.
Right Angle Mount, SMT, Receptacle Connector: FCI base number 10136353.
4.0
Ratings
4.1
4.2
Operating Voltage Rating = 100VAC/DC.
Operating Current Rating = 2.0A AC/DC (AWG 24 wires), 1.5A AC/DC (AWG 26 wires) and
1.0A AC/DC (AWG 28 wires)
4.3
4.4
4.5
Operating Temperature Range = -25 to +85℃, includes the terminal temperature rise when powered.
Applicable Printed Circuit Board: thickness 0.6mm ~ 1.2mm and 1.6mm.
Applicable Wire: AWG #24 to #28, Insulation O.D. 0.78~1.28mm.
5.0
Applicable Documents
5.1
FCI Specifications
5.1.1
5.1.2
5.2
FCI engineering drawings.
Application specification: GS-20-0444.
Industrial standards: MIL-STD-202, JIS C0025, JIS C0041, JIS C5402, JIS C60068 and EIA-364.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Sep 21, 2015
NUMBER
TYPE
GS-12-1321
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
2 of 10
Minitek 1.5mm Wire to Board Connectors
AUTHORIZED BY
DATE
A
2015-07-02
Kenny Tai
CLASSIFICATION
UNRESTRICTED
6.0
Test Requirements and Procedures Summary
TEST ITEMS
REQUIREMENT
Meet requirements of product
drawing. No physical damage.
PROCEDURE
Visual inspection
(EIA-364-18)
6.1
Examination of
Product
ELECTRICAL REQUIREMENTS
6.2
Low Level Contact
Resistance
20mΩ max.
Mate connectors and measured by dry
circuit, 20 mV max., 10mA.
(JIS C5402 5.4 or equivalent spec.)
6.3
Insulation Resistance
500MΩ Min.
Mate connectors and apply 250VDC
between adjacent terminals or ground.
(JIS C5402 5.2/MIL-STD-202 Method
302
or equivalent spec.
)
Mate connectors and apply 500VAC
(rms) for 1 minute between adjacent
terminals or ground.
(JIS C5402 5.1/MIL-STD-202 Method
301 or equivalent spec.)
Crimp the applicable wire to the terminal,
measured by dry circuit, 20mV max.,
10mA.
6.4
Dielectric Withstanding
Voltage
No change.
Leakage current 2mA max.
6.5
Contact Resistance on
Crimped Portion
5 mΩ max.
MECHANICAL REQUIREMENTS
Fix the crimped terminal, apply axial
pull out force on the wire at the speed
of 25±3mm/min.
(JIS C5402 6.8 or equivalent spec.)
* Crimping Specification: see Section 8.0
Insert the plug crimp terminal into the plug
HSG at the speed of 25±3mm/min.
Apply axial pull out force on the plug
crimp terminal assembled in the plug
HSG, at the speed of 25±3mm/min.
Insert and withdraw connector at the
speed of 25±3mm/min.
6.6
Crimping Pull out
Force
AWG # 24: 29.4N (3.0Kgf) Min.
AWG # 26: 19.6N (2.0Kgf) Min.
AWG # 28: 9.8N (1.0Kgf) Min.
6.7
Terminal Insertion
Force into Plug HSG
9.8N (1.0Kgf) max.
6.8
Terminal Retention
Force from Plug HSG
9.8N (1.0Kgf) Min.
6.9
Mating & Un-mating
Force
Refer to Section 9.0
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Sep 21, 2015
NUMBER
TYPE
GS-12-1321
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
3 of 10
Minitek 1.5mm Wire to Board Connectors
AUTHORIZED BY
DATE
A
2015-07-02
Kenny Tai
CLASSIFICATION
UNRESTRICTED
6.10
Durability
Contact resistance: 40mΩ max.
after durability cycles
Mate/Unmate 30 cycles repeatedly at the
speed of 10 cycles per minute with hand.
Apply axial pull out force on the
receptacle terminal assembled in the
receptacle connector HSG at the speed of
25±3mm/min.
Mated connectors, and apply axial pull out
force at the speed of 25±3mm/min.
6.11
Pin Retention Force
from Receptacle
Connector
Housing Lock Strength
(Positive Lock)
2.94N (0.3Kgf) Min.
6.12
29.4N (3.0Kgf) Min.
ENVIRONMENTAL REQUIREMENTS
All crimp-style terminals shall be
connected in a direct series by minimum
AWG. The temperature rise shall be
measured by thermocouple when the
terminals reach equilibrium under rated
voltage / rated current.
(However with resistive load)
Mate connectors and subject to the
following vibration conditions, for a period
of 2 hours in each of 3 mutually
perpendicular axes, passing DC 1mA
during the test.
Amplitude: 1.52mm P-P
Frequency: 10~55~10 Hz in 1 minute.
Duration: 2 hours in each X.Y. Z. axes.
(MIL-STD-202 Method 201 or equivalent
spec.)
Mate connectors and subject to the
following shock conditions. 3 shocks shall
be applied along 3 mutually perpendicular
axes, passing DC 1 mA current during the
test. (Total of 18 shocks)
Test pulse: Half Sine
Peak value: 490 m/s
2
(50G)
Duration: 11 ms
(JIS C0041/MIL-STD-202 Method 213 or
equivalent spec.)
6.13
Temperature rise
30°C max.
6.14
Vibration
Appearance: No damage.
Contact resistance: 40mΩ max.
Discontinuity: 1 micro second
max.
6.15
Mechanical
Shock
Appearance: No damage.
Contact resistance: 40mΩ max.
Discontinuity: 1 micro second
max.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Sep 21, 2015
NUMBER
TYPE
GS-12-1321
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
4 of 10
Minitek 1.5mm Wire to Board Connectors
AUTHORIZED BY
DATE
A
2015-07-02
Kenny Tai
CLASSIFICATION
UNRESTRICTED
6.16
Heat Resistance
Appearance: No damage.
Contact resistance: 40mΩ max.
Mate connectors and expose to 85±2℃
for 96 hours. Upon completion of the
exposure period, the test specimens shall
be conditioned at ambient room
conditions for 1 hour, after which the
specified measurements shall be
performed.
(JIS C60068-2-2/MIL-STD-202 Method
108 or equivalent spec.)
Mate connectors and expose to -25±3℃
for 96 hours. Upon completion of the
exposure period, the test specimens shall
be conditioned at ambient room
conditions for 1 hour, after which the
specified measurements shall be
performed.
(JIS C60068-2-1 or equivalent spec.)
Mate connectors and expose to 40±2℃,
relative humidity 90 to 95% for 96 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned at
ambient room conditions for 1 to 2 hours,
after which the specified measurements
shall be performed.
(JIS C60068-2-3/MIL-STD-202 Method
103 or equivalent spec.)
Mate connectors and subject to the
following conditions for 5 cycles. Upon
completion of the exposure period, the
test specimens shall be conditioned at
ambient room conditions for 1 to 2hours,
after which the specified measurements
shall be performed.
5 cycles of:
a) -25℃ 30 minutes
b) +85℃ 30 minutes
(JIS C0025 or equivalent spec.)
6.17
Cold
Resistance
Appearance: No damage.
Contact resistance: 40mΩ max.
6.18
Humidity
Appearance: No damage.
Contact resistance: 40mΩ max.
Insulation Resistance: 100MΩ
Min.
Dielectric withstanding voltage:
Must meet 6.4
6.19
Temperature Cycling
Appearance: No damage.
Contact resistance: 40mΩ max.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Sep 21, 2015
NUMBER
TYPE
GS-12-1321
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
5 of 10
Minitek 1.5mm Wire to Board Connectors
AUTHORIZED BY
DATE
A
2015-07-02
Kenny Tai
CLASSIFICATION
UNRESTRICTED
6.20
Salt spray
Appearance: No damage.
Contact resistance: 40mΩ max.
Mate connectors and expose to the
following salt mist conditions. Upon
completion of the exposure period, salt
deposits shall be removed by a gentle
wash or dip in running water, after which
the specified measurements shall be
performed.
NaCl solution concentration: 5±1 %
Spray time: 48±4 hours
Ambient temperature: 35±2
℃
(JIS 60068-2-11/MIL-STD-202 Method
101 or equivalent spec.)
Mated connectors and expose to the
conditions of 50±5 ppm SO
2
gas ambient
temperature 40±2℃ for 24 hours.
Mated connectors and expose to the
conditions of NH3 gas evaporating from
28% Ammonia solution for 40 minutes.
Dip solder tails into the molten solder
(held at 245±5℃) up to 0.5mm from the
bottom of the housing for 4½5 sec.
Reflow soldering method: referred to
reflow condition at Section 7.0.
6.21
SO
2
Gas
Appearance: No damage.
Contact resistance: 40mΩ max.
Appearance: without damage
such as cracks or other breaks.
Contact resistance: 40mΩ max.
90% of immersed area must
show no voids and pin holes.
6.22
Ammonia gas
6.23
Solderability
6.24
Resistance to
Soldering Heat
Appearance: No damage.
Soldering iron method:
0.2mm from terminal tip
Solder Temperature: 350±10℃
Soldering Time: 3½4 sec. max.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Sep 21, 2015
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