Analog Switch ICs 2Ch DPDT Analog Switch
参数名称 | 属性值 |
Product Attribute | Attribute Value |
制造商 Manufacturer | Maxim(美信半导体) |
产品种类 Product Category | Analog Switch ICs |
RoHS | Details |
Number of Switches | 2 Switch |
Configuration | 2 x DPDT |
On Resistance - Max | 75 Ohms |
Switch Voltage - Max | 3.3 V |
On Time - Max | 35 ns |
Off Time - Max | 20 ns |
工作电源电压 Operating Supply Voltage | 1.8 V to 5.5 V |
最小工作温度 Minimum Operating Temperature | - 40 C |
最大工作温度 Maximum Operating Temperature | + 85 C |
安装风格 Mounting Style | SMD/SMT |
封装 / 箱体 Package / Case | TQFN-16 EP |
系列 Packaging | Reel |
Supply Type | Single Supply |
Supply Current - Max | 1 uA |
NumOfPackaging | 1 |
Pd-功率耗散 Pd - Power Dissipation | 1.67 W |
工厂包装数量 Factory Pack Quantity | 2500 |
电源电压-最大 Supply Voltage - Max | 5.5 V |
电源电压-最小 Supply Voltage - Min | 1.8 V |
Switch Continuous Current | 20 mA |
MAX4699ETE-T | MAX4699ETE+ | MAX4701EUE+ | MAX4702EUE+T | MAX4702EUE+ | |
---|---|---|---|---|---|
描述 | Analog Switch ICs 2Ch DPDT Analog Switch | Analog Switch ICs 2Ch DPDT Analog Switch | Analog Switch ICs 2Ch DPDT Analog Switch | Analog Switch ICs 4Ch SPDT Analog Switch | Analog Switch ICs 4Ch SPDT Analog Switch |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | - | QFN | TSSOP | TSSOP | TSSOP |
包装说明 | - | HVQCCN, LCC16,.16SQ,25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 |
针数 | - | 16 | 16 | 16 | 16 |
Reach Compliance Code | - | compliant | compliant | compliant | compliant |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | - | 1 week | 6 weeks | 6 weeks | 6 weeks |
模拟集成电路 - 其他类型 | - | DPDT | DPDT | SPDT | SPDT |
JESD-30 代码 | - | S-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | - | e3 | e3 | e3 | e3 |
长度 | - | 4 mm | 5 mm | 5 mm | 5 mm |
湿度敏感等级 | - | 1 | 1 | 1 | 1 |
信道数量 | - | 2 | 2 | 1 | 1 |
功能数量 | - | 2 | 2 | 4 | 4 |
端子数量 | - | 16 | 16 | 16 | 16 |
标称断态隔离度 | - | 76 dB | 76 dB | 76 dB | 76 dB |
通态电阻匹配规范 | - | 2 Ω | 2 Ω | 2 Ω | 2 Ω |
最大通态电阻 (Ron) | - | 75 Ω | 75 Ω | 75 Ω | 75 Ω |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
封装主体材料 | - | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | HVQCCN | TSSOP | TSSOP | TSSOP |
封装等效代码 | - | LCC16,.16SQ,25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 |
封装形状 | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 |
电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 0.8 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
表面贴装 | - | YES | YES | YES | YES |
最长断开时间 | - | 25 ns | 20 ns | 20 ns | 20 ns |
最长接通时间 | - | 45 ns | 35 ns | 35 ns | 35 ns |
切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | - | NO LEAD | GULL WING | GULL WING | GULL WING |
端子节距 | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | - | QUAD | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 |
宽度 | - | 4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
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