Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
–40 to +85
Units
°C
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2
CM1240
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
C
LV
C
HV
I
LV
I
HV
V
CL(LV)
Parameter
LV Diode Capacitance at 3 Vdc; 1 MHz, 30 mVac
HV Diode Capacitance at 3 Vdc; 1 MHz, 30 mVac
LV Diode Leakage at +3.3 V reverse bias voltage
HV Diode Leakage at +11 V reverse bias voltage
LV Diode Signal Clamp Voltage:
Positive Clamp, 10 mA
Negative Clamp,
−10
mA
HV Diode Signal Clamp Voltage:
Positive Clamp, 10 mA
Negative Clamp,
−10
mA
In−system ESD withstand voltage:
Human Body Model (MIL−STD−883, method 3015)
IEC 61000−4−2, contact discharge method
LV Diode Dynamic Resistance:
Positive
Negative
HV Diode Dynamic Resistance:
Positive
Negative
(Note 2)
5.6
−1.5
13
−1.5
±25
±12
2.8
1.2
1.0
0.7
Conditions
Min
Typ
6
25
0.01
0.01
6.8
–0.8
16
–0.8
0.4
0.4
9
−0.4
19
−0.4
Max
Units
pF
pF
mA
mA
V
V
CL(HV)
V
V
ESD
kV
R
DYN(LV)
W
R
DYN(HV)
W
1. Guaranteed at 25°C only
2. ESD applied to input/output pins with respect to GND, one at a time. These parameters are guaranteed by design.
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3
CM1240
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
6
5
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
A
L
1
2
3
E
−Y−
b
H
E
e
5
6 PL
M
C
X Y
0.08 (0.003)
DIM
A
b
C
D
E
e
L
H
E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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