EEPROM (2048x8)(1024x16)16K
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION |
| 备用内存宽度 | 8 |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 100 |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | MICROWIRE |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| CAT93C86V | CAT93C57LI | CAT93C86LI | CAT93C56WI-G | CAT93C66YI | CAT93C57X | CAT93C86SI | CAT93C86VI | CAT93C46RWI-GT3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM (2048x8)(1024x16)16K | EEPROM (256x8) (128x16) 2K | EEPROM (2048x8)(1024x16)16K | EEPROM (256x8)/(128x16) 2K | EEPROM (512x8) (256x16) 4K | EEPROM (256x8) (128x16) 2K | EEPROM (2048x8)(1024x16)16K | EEPROM (2048x8)(1024x16)16K | EEPROM 1K-Bit Microwire |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
| 包装说明 | SOP, | LEAD AND HALOGEN FREE, PLASTIC, DIP-8 | LEAD AND HALOGEN FREE, PLASTIC, DIP-8 | SOIC-8 | LEAD AND HALOGEN FREE, TSSOP-8 | SOP, | SOP, | SOP, SOP8,.25 | 0.150 INCH, ROHS COMPLIANT, MS-012, SOIC-8 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | compliant | unknown | unknown | compliant |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 (fCLK) | 1 MHz | 0.5 MHz | 1 MHz | 2 MHz | 0.5 MHz | 0.5 MHz | 1 MHz | 1 MHz | 2 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e4 | e3 | e3 | e0 | e3 | e4 |
| 长度 | 4.9 mm | 9.36 mm | 9.36 mm | 4.9 mm | 4.4 mm | 5.3 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 16384 bit | 2048 bit | 16384 bit | 2048 bit | 4096 bit | 2048 bit | 16384 bit | 16384 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 1024 words | 128 words | 1024 words | 128 words | 256 words | 128 words | 1024 words | 1024 words | 64 words |
| 字数代码 | 1000 | 128 | 1000 | 128 | 256 | 128 | 1000 | 1000 | 64 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 1KX16 | 128X16 | 1KX16 | 128X16 | 256X16 | 128X16 | 1KX16 | 1KX16 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP | TSSOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 4.57 mm | 4.57 mm | 1.75 mm | 1.1 mm | 2.03 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 5.5 V | 6 V | 6 V | 6 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 1.8 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 3 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin (Sn) | Tin (Sn) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) | Tin/Lead (Sn/Pb) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3 mm | 5.25 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC | DIP | DIP | - | SOIC | SOIC | SOIC | SOIC | SOIC |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | - | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | 1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION | - |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 3 | - | - | 1 |
| Base Number Matches | 1 | 1 | - | - | - | 1 | 1 | - | 1 |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| 封装等效代码 | - | DIP8,.3 | DIP8,.3 | SOP8,.25 | TSSOP8,.25 | - | - | SOP8,.25 | SOP8,.25 |
| 电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | - | 3/5 V | 2/5 V |
| 最大待机电流 | - | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | - | - | 0.00001 A | 0.00001 A |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - | - | 0.003 mA | 0.001 mA |
| 写保护 | - | SOFTWARE | HARDWARE/SOFTWARE | SOFTWARE | SOFTWARE | - | - | HARDWARE/SOFTWARE | SOFTWARE |
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