Current mode PWM control with PFM mode for improved
light load efficiency
Voltage supervisor for VOUT reported at the PG pin
Input supply under voltage lockout
Soft start for controlled startup with no overshoot
Cycle-by-cycle currrent limit with frequency foldback
Full protection for over-temperature and VOUT
over-voltage
Less than 10uA in standby mode
Low external component count
Description
The TS30011 (1A), TS30012 (2A) and TS30013 (3A) are DC/DC
synchronous switching regulator with fully integrated power
switches, internal compensation, and full fault protection. The
switching frequency of 1MHz enables the use of small filter
components resulting in minimal board space and reduced
BOM costs.
The TS30011/12/13 utilizes current mode feedback in normal
regulation PWM mode. When the regulator is placed in
standby (EN is low), the device draws less than 10uA quiescent
current.
The TS30011/12/13 integrates a wide range of protection
circuitry including input supply under-voltage lockout, output
voltage soft start, current limit, and thermal shutdown.
The TS30011/12/13 includes supervisory reporting through
the PG (Power Good) open drain output to interface other
components in the system.
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Summary Specification
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Junction operating temperature -40 °C to 125 °C
Packaged in a 16pin QFN (3x3)
Applications
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On-card switching regulators
Set-top box, DVD, LCD, LED supply
Industrial power supplies
Typical Application Circuit
TS30011/12/13
Final Datasheet
August 08, 2016
Rev 2.0
www.semtech.com
1 of 18
Semtech
Pin Configuration
Figure 1: 16 Lead 3x3 QFN, Top View
Pin Description
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Pin Symbol Function
VSW
VCC
VCC
GND
FB
NC
NC
PG
EN
BST
VCC
VSW
VSW
PGND
PGND
VSW
PAD
Switching Voltage Node
Input Voltage
Input Voltage
GND
Feedback Input
No Connect
No Connect
Power Good Output
Enable Input
Bootstrap Capacitor
Input Voltage
Switching Voltage Node
Switching Voltage Node
Power GND
Power GND
Switching Voltage Node
Thermal PAD
Description
Connected to 4.7uH (typical) inductor
Input voltage
Input voltage
Primary ground for the majority of the device except the low-side power FET
Regulator FB Input. Connects to VOUT for fixed mode and the output resistor
divider for adjustable mode
Not Connected
Not Connected
Open-drain output
Above 2.2V the device is enabled. GND the EN pin to put device in standby
mode. Includes internal pull-up resistor.
Bootstrap capacitor for the high-side FET gate driver. Connect a ceramic
capacitor in the range 15 nF - 200 nF from BST pin to VSW pin
Input Voltage
Connected to 4.7uH (typical) inductor
Connected to 4.7uH (typical) inductor
GND supply for internal low-side FET/integrated diode
GND supply for internal low-side FET/integrated diode
Connected to 4.7uH (typical) inductor
Connected internally to GND
TS30011/12/13
Final Datasheet
August 08, 2016
Rev 2.0
www.semtech.com
2 of 18
Semtech
Functional Block Diagrams
Figure 2: TS30011/12/13 Block Diagram
Figure 3: Monitor & Control Logic Functionality
TS30011/12/13
Final Datasheet
August 08, 2016
Rev 2.0
www.semtech.com
3 of 18
Semtech
Absolute Maximum Ratings
Over operating free–air temperature range unless otherwise noted(1, 2).
Parameter
VCC to PGND
BST to PGND
BST to VSW
VSW to PGND
EN, PG, FB to GND
PGND to GND
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Charge Device Model
Lead Temperature (soldering, 10 seconds)
(1)
Value
-0.3 to 26.4 (-0.3 to 20 for TS30013)
-0.3 to (VCC+6)
-0.3 to 6
-1 to 26.4 (-1 to 20 for TS30013)
-0.3 to 6
-0.3 to 0.3
+/-2k
+/-500
260
Units
V
V
V
V
V
V
V
V
O
C
(2)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
Thermal Characteristics
Parameter
Thermal Resistance Junction to Air (Note 1)
Thermal Resistance Junction to Case (Note 1)
Storage Temperature Range
Maximum Junction Temperature
Operating junction Temperature Range
Symbol Value
θ
JA
θ
JC
T
STG
T
J MAX
T
J
34.5
2.5
-65 to 150
150
-40 to 125
Units
O
O
C/W
C/W
O
O
O
C
C
C
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch
2
of 1 oz Cu and 4 thermal vias connected to PAD
Recommended Operating Conditions
Parameter
Input Operating Voltage
Bootstrap Capacitor
Output Filter Inductor Typical Value (Note 1)
Output Filter Capacitor Typical Value (Note 2)
Output Filter Capacitor ESR
Input Supply Bypass Capacitor Typical Value (Note 3)
Symbol
VCC
C
BST
L
OUT
C
OUT
C
OUT-ESR
C
BYPASS
Min
4.5
15
3.3
33
2
8
Typ
12
22
4.7
44 (2 x 22)
Max
24 (18 for TS30013)
200
5.64
100
Units
V
nF
uH
uF
mΩ
uF
10
Note 1: For best performance, use an inductor with saturation current rating exceeding the maximum expected load plus 50% of the inductor current ripple.
Note 2: For best performance, a low ESR ceramic capacitor should be used.
Note 3: For best performance, a low ESR ceramic capacitor should be used. If C
BYPASS
is not a low ESR ceramic capacitor, a 0.1uF ceramic capacitor should be add-
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