IS43/46DR81280A, IS43/46DR16640A
1Gb (x8, x16) DDR2 SDRAM
FEATURES
Clock frequency up to 400MHz
8 internal banks for concurrent operation
4‐bit prefetch architecture
Programmable CAS Latency: 3, 4, 5, 6 and 7
Programmable Additive Latency: 0, 1, 2, 3, 4, 5
and 6
Write Latency = Read Latency‐1
Programmable Burst Sequence: Sequential or
Interleave
Programmable Burst Length: 4 and 8
Automatic and Controlled Precharge Command
Power Down Mode
Auto Refresh and Self Refresh
Refresh Interval: 7.8 s (8192 cycles/64 ms)
OCD (Off‐Chip Driver Impedance Adjustment)
ODT (On‐Die Termination)
Weak Strength Data‐Output Driver Option
Bidirectional differential Data Strobe (Single‐
ended data‐strobe is an optional feature)
On‐Chip DLL aligns DQ and DQs transitions with
CK transitions
DQS# can be disabled for single‐ended data
strobe
Read Data Strobe supported (x8 only)
Differential clock inputs CK and CK#
VDD and VDDQ = 1.8V ± 0.1V
PASR (Partial Array Self Refresh)
SSTL_18 interface
tRAS lockout supported
Operating temperature:
Commercial (T
A
= 0°C to 70°C ; T
C
= 0°C to 85°C)
Industrial (T
A
= ‐40°C to 85°C; T
C
= ‐40°C to 95°C)
Automotive, A1 (T
A
= ‐40°C to 85°C; T
C
= ‐40°C to 95°C)
Automotive, A2 (T
A
= ‐40°C to 105°C; T
C
= ‐40°C to
105°C)
SEPTEMBER 2011
OPTIONS
ADDRESS TABLE
Parameter
Row Addressing
Column Addressing
Bank Addressing
Precharge Addressing
128Mx8
A0‐A13
A0‐A9
BA0‐BA2
A10
64Mx16
A0‐A12
A0‐A9
BA0‐BA2
A10
Configuration:
128Mx8 (16M x 8 x 8 banks)
64Mx16 (8M x 16 x 8 banks)
Package:
60‐ball TW‐BGA for x8
84‐ball TW‐BGA for x16
Clock Cycle Timing
Speed Grade
CL‐tRCD‐tRP
tCK (CL=3)
tCK (CL=4)
tCK (CL=5)
tCK (CL=6)
tCK (CL=7)
Frequency (max)
‐37C
DDR2‐533C
4‐4‐4
5
3.75
3.75
3.75
3.75
266
‐3D
DDR2‐667D
5‐5‐5
5
3.75
3
3
3
333
‐25E
DDR2‐800E
6‐6‐6
5
3.75
3
2.5
2.5
400
‐25D
DDR2‐800D
5‐5‐5
5
3.75
2.5
2.5
2.5
400
Units
tCK
ns
ns
ns
ns
ns
MHz
Note: The ‐37C device specification is shown for reference only.
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
– www.issi.com –
Rev. D, 08/30/2011
1
IS43/46DR81280A, IS43/46DR16640A
Package Ball‐out and Description
DDR2 SDRAM (128Mx8) TW‐BGA Ball‐out (Top‐View) (8.00mm x 13.65mm Body, 0.8mm pitch)
Symbol
CK, CK#
CKE
CS#
RAS#,CAS#,WE#
A[13:0]
BA[2:0]
DQ[7:0]
DQS, DQS#
RDQS, RDQS#
DM
VDD
VSS
VDDQ
VSSQ
VREF
VDDL
VSSDL
ODT
NC
Description
Input clocks
Clock enable
Chip Select
Command control pins
Address
Bank Address
I/O
Data Strobe
Redundant Data Strobe
Input data mask
Supply voltage
Ground
DQ power supply
DQ ground
Reference voltage
DLL power supply
DLL ground
On Die Termination Enable
No connect
Notes:
1. Pins B3 and A2 have identical capacitance as pins B7
and A8.
2. For a read, when enabled, strobe pair RDQS & RDQS#
are identical in function and timing to strobe pair DQS &
DQS# and input masking function is disabled.
3. The function of DM or RDQS/RDQS# are enabled by
EMRS command.
4. VDDL and VSSDL are power and ground for the DLL.
Integrated Silicon Solution, Inc.
– www.issi.com –
Rev. D, 08/30/2011
2
IS43/46DR81280A, IS43/46DR16640A
DDR2 SDRAM (64Mx16) TW‐BGA Ball‐out (Top‐View) (8.00mm x 13.65mm Body, 0.8mm pitch)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
VDD
VSS
BA2
2
3
4
5
6
7
8
9
VDD
NC
VSS
VSSQ
UDQS
VDDQ
UDQS VSSQ DQ15
VDDQ DQ8 VDDQ
DQ10 VSSQ DQ13
VSSQ
LDQS
VDDQ
LDQS VSSQ DQ7
VDDQ DQ0 VDDQ
DQ2
VSSDL
RAS
CAS
A2
A6
A11
NC
VSSQ DQ5
CK
CK
CS
A0
A4
A8
NC
VSS
VDD
VDD
ODT
DQ14 VSSQ UDM
VDDQ DQ9 VDDQ
DQ12 VSSQ DQ11
VDD
DQ6
NC
VSS
VSSQ LDM
VDDQ DQ1 VDDQ
DQ4
VSSQ DQ3
VSS
WE
BA1
VDDL VREF
CKE
BA0
A10/AP A1
A3
A7
A12
A5
A9
NC
Not populated
Symbol
CK, CK#
CKE
CS#
RAS#,CAS#,WE#
A[12:0]
BA[2:0]
DQ[15:0]
UDQS, UDQS#
LDQS, LDQS#
UDM, LDM
VDD
VSS
VDDQ
VSSQ
VREF
VDDL
VSSDL
ODT
NC
Description
Input clocks
Clock enable
Chip Select
Command control inputs
Address
Bank Address
I/O
Upper Byte Data Strobe
Lower Byte Data Strobe
Input data mask
Supply voltage
Ground
DQ power supply
DQ ground
Reference voltage
DLL power supply
DLL ground
On Die Termination Enable
No connect
Note:
VDDL and VSSDL are power and ground for the DLL.
Integrated Silicon Solution, Inc.
– www.issi.com –
Rev. D, 08/30/2011
3
IS43/46DR81280A, IS43/46DR16640A
Functional Description
Power‐up and Initialization
DDR2 SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may
result in undefined operation.
Power‐up and Initialization Sequence
The following sequence is required for Power‐up and Initialization.
1. Either one of the following sequence is required for Power‐up:
A. While applying power, attempt to maintain CKE below 0.2 x VDDQ and ODT
1
at a LOW state (all other inputs may be
undefined.) The VDD voltage ramp time must be no greater than 200 ms from when VDD ramps from 300 mV to
VDD(Min); and during the VDD voltage ramp, |VDD‐VDDQ|
≥
0.3 V. Once the ramping of the supply voltages is
complete (when VDDQ crosses VDDQ(Min)), the supply voltage specifications provided in the table Recommended DC
Operating Conditions (SSTL_1.8), prevail.
VDD, VDDL and VDDQ are driven from a single power converter output, AND
VTT is limited to 0.95V max, AND
VREF tracks VDDQ/2, VREF must be within ± 300mV with respect to VDDQ/2 during supply ramp time.
VDDQ ≥ VREF must be met at all times
B. While applying power, attempt to maintain CKE below 0.2 x VDDQ and ODT
1
at a LOW state (all other inputs may be
undefined, voltage levels at I/Os and outputs must be less than VDDQ during voltage ramp time to avoid DRAM latch‐
up. During the ramping of the supply voltages, VDD ≥ VDDL ≥ VDDQ must be maintained and is applicable to both AC
and DC levels until the ramping of the supply voltages is complete, which is when VDDQ crosses VDDQ min. Once the
ramping of the supply voltages is complete, the supply voltage specifications provided in the table Recommended DC
Operating Conditions (SSTL‐1.8), prevail.
Apply VDD/VDDL before or at the same time as VDDQ.
VDD/VDDL voltage ramp time must be no greater 200 ms from when VDD ramps from 300 mV to VDD(Min) .
Apply VDDQ before or at the same time as VTT.
The VDDQ voltage ramp time from when VDD(Min) is achieved on VDD to the VDDQ(Min) is achieved on VDDQ
must be no greater than 500 ms.
2. Start clock and maintain stable condition.
3. For the minimum of 200 µs after stable power (VDD, VDDL, VDDQ, VREF, and VTT values are in the range of the minimum and
maximum values specified in the table Recommended DC Operating Conditions (SSTL‐1.8)) and stable clock (CK, CK#), then apply
NOP or Deselect and assert a logic HIGH to CKE.
4. Wait minimum of 400 ns then issue a precharge all command. During the 400 ns period, a NOP or Deselect command must be
issued to the DRAM.
5. Issue an EMRS command to EMR(2).
6. Issue an EMRS command to EMR(3).
7. Issue EMRS to enable DLL.
8. Issue a Mode Register Set command for DLL reset.
9. Issue a precharge all command.
10. Issue 2 or more auto‐refresh commands.
11. Issue a MRS command with LOW to A8 to initialize device operation. (i.e. to program operating parameters without resetting
the DLL.)
12. Wait at least 200 clock cycles after step 8 and then execute OCD Calibration (Off Chip Driver impedance adjustment). If OCD
calibration is not used, EMRS Default command (A9=A8=A7=HIGH) followed by EMRS OCD Calibration Mode Exit command
(A9=A8=A7=LOW) must be issued with other operating parameters of EMR(1).
13. The DDR2 SDRAM is now ready for normal operation.
Note:
1. To guarantee ODT off, VREF must be valid and a LOW level must be applied to the ODT pin.
Integrated Silicon Solution, Inc.
– www.issi.com –
Rev. D, 08/30/2011
4
IS43/46DR81280A, IS43/46DR16640A
Initialization Sequence after Power‐Up Diagram
Programming the Mode Register and Extended Mode Registers
For application flexibility, burst length, burst type, CAS# latency, DLL reset function, write recovery time (WR) are user defined
variables and must be programmed with a Mode Register Set (MRS) command. Additionally, DLL disable function, driver impedance,
additive CAS latency, ODT (On Die Termination), single‐ended strobe, and OCD (off chip driver impedance adjustment) are also user
defined variables and must be programmed with an Extended Mode Register Set (EMRS) command. Contents of the Mode Register
(MR) or Extended Mode Registers EMR[1] and EMR[2] can be altered by re‐executing the MRS or EMRS Commands. Even if the user
chooses to modify only a subset of the MR, EMR[1], or EMR[2] variables, all variables within the addressed register must be
redefined when the MRS or EMRS commands are issued. The x16 option does not have A13, so all references to this address can be
ignored for this option.
MRS, EMRS and Reset DLL do not affect memory array contents, which mean re‐initialization including those can be executed at any
time after power‐up without affecting memory array contents.
DDR2 Mode Register (MR) Setting
The mode register stores the data for controlling the various operating modes of DDR2 SDRAM. It controls CAS# latency, burst
length, burst sequence, DLL reset, tWR and active power down exit time to make DDR2 SDRAM useful for various applications. The
default value of the mode register is not defined, therefore the mode register must be written after power‐up for proper operation.
The mode register is written by asserting LOW on CS#, RAS#, CAS#, WE#, BA0, BA1, and BA2 while controlling the state of address
pins A0 ‐ A13. The DDR2 SDRAM should be in all bank precharge with CKE already HIGH prior to writing into the mode register. The
mode register set command cycle time (tMRD) is required to complete the write operation to the mode register. The mode register
contents can be changed using the same command and clock cycle requirements during normal operation as long as all banks are in
the precharge state. The mode register is divided into various fields depending on functionality. Burst length is defined by A0 ‐ A2
with options of 4 and 8 bit burst lengths. The burst length decodes are compatible with DDR SDRAM. Burst address sequence type is
defined by A3; CAS latency is defined by A4 ‐ A6. The DDR2 doesn’t support half clock latency mode. A7 is used for test mode. A8 is
used for DLL reset. A7 must be set to LOW for normal MRS operation. Write recovery time tWR is defined by A9 ‐ A11. Refer to the
table for specific codes.
Integrated Silicon Solution, Inc.
– www.issi.com –
Rev. D, 08/30/2011
5
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