J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, PDIP16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | J-K FLIP-FLOP |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
触发器类型 | MASTER-SLAVE |
Base Number Matches | 1 |
CD4027BE | CD4027BD | CD4027BH | CD4027BF | CD4027BK | |
---|---|---|---|---|---|
描述 | J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, PDIP16, | J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, CDIP16, | J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, | J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, CDIP16, | J-K Flip-Flop, 2-Func, Master-slave Triggered, CMOS, CDFP16, |
厂商名称 | RCA | RCA | RCA | RCA | RCA |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | DIP, DIP16,.3 | DFP, FL16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
功能数量 | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIE OR CHIP | DIP16,.3 | FL16,.3 |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
触发器类型 | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 |
JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | - | R-XDIP-T16 | R-XDFP-F16 |
JESD-609代码 | e0 | e0 | - | e0 | e0 |
端子数量 | 16 | 16 | - | 16 | 16 |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | - | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | - | DIP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | - | IN-LINE | FLATPACK |
表面贴装 | NO | NO | - | NO | YES |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | FLAT |
端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | - | - |
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