NCS20091/2/4,
NCV20091/2/4
350 kHz, 20
mA
Low Power
Operational Amplifier
The NCS20091/2/4 is a family of single, dual and quad, Operational
Amplifiers (Op Amps) with 350 kHz of Gain−Bandwidth Product
(GBWP) and draws only 20
mA
of Quiescent current. The NCS2009x
has Input Offset Voltage of 4 mV and operates from 1.8 V to 5.5 V
supply voltage over a wide temperature range (−40°C to 125°C). The
Rail−to−Rail In/Out operation allows the designers to use the entire
supply voltage range while taking advantage of the 350 kHz GBWP.
Thus, this family offers superior performance over many industry
standard parts. These devices are AEC−Q100 qualified which is
denoted by the NCV suffix.
NCS2009x’s low current consumption and low voltage performance
in space saving packages, makes them ideal for sensor signal
conditioning and low voltage current sensing applications in
Automotive, Consumer and Industrial markets.
Features
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5
1
SC70−5
CASE 419A
TSOP−5/SOT23−5
CASE 483
8
1
Micro8]/MSOP8
CASE 846A
SOIC−8
CASE 751
•
•
•
•
•
•
•
•
•
Gain−Bandwidth Product: 350 kHz
Low Supply Current/ Channel: 20
mA
(typ.)
Low Input Offset Voltage: 4 mV (max.)
Wide Supply Range: 1.8 V to 5.5 V
Wide Temperature Range: −40°C to +125°C
Rail−to−Rail Input and Output
Unity Gain Stable
Available in Single, Dual and Quad Packages
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
14
1
TSSOP−8
CASE 948S
TSSOP−14
CASE 948G
6
14
1
SOIC−14
CASE 751A
1
UDFN6
CASE 517AP
•
•
•
•
•
•
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 2 of this data sheet.
Automotive
Battery Powered/ Portable Application
Sensor Signal Conditioning
Low Voltage Current Sensing
Filters Circuits
Unity Gain Buffer
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of
this data sheet.
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
©
Semiconductor Components Industries, LLC, 2017
1
February, 2018 − Rev. 10
Publication Order Number:
NCS2009/D
NCS20091/2/4, NCV20091/2/4
MARKING DIAGRAMS
Single Channel Configuration
NCS20091, NCV20091
5
XXMG
G
1
SC70−5
CASE 419A
TSOP−5/SOT23−5
CASE 483
UDFN6
CASE 517AP
XXXAYWG
G
1
XX MG
G
Dual Channel Configuration
NCS20092, NCV20092
8
XXXX
AYWG
G
1
Micro8]/MSOP8
CASE 846A
1
SOIC−8
CASE 751
8
XXXXXX
ALYW
G
XXX
YWW
AG
TSSOP−8
CASE 948S
Quad Channel Configuration
NCS20094, NCV20094
14
XXXX
XXXX
ALYWG
G
1
TSSOP−14
CASE 948G
XXXXX
A
WL, L
Y
WW, W
G or
G
1
SOIC−14
CASE 751A
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
14
XXXXX
AWLYWWG
(Note: Microdot may be in either location)
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2
NCS20091/2/4, NCV20091/2/4
Single Channel Configuration
NCS20091, NCV20091
OUT
VSS
1
5
VDD
IN+
VSS
+
−
1
+
2
2
−
4
SOT23−5 (TSOP−5)
SN2 Pinout
IN−
IN−
3
4
OUT
IN−
3
UDFN6 1.6 x 1.6
Quadruple Channel Configuration
NCS20094, NCV20094
Dual Channel Configuration
NCS20092, NCV20092
OUT 1
IN− 1
IN+ 1
VSS
1
2
3
4
−
+
−
+
8
7
6
5
VDD
IN+ 1
OUT 2
VDD
IN− 2
IN+ 2
IN+ 2
IN− 2
OUT 2
4
5
6
7
+
−
+
−
11 VSS
10 IN+ 3
9
8
IN− 3
OUT 3
3
OUT 1
IN− 1
1
2
−
+
−
+
14 OUT 4
13 IN− 4
12 IN+ 4
NC
2
−
+
5
4
VDD
IN+
5
VDD
VSS
1
6
OUT
IN+
3
SC70−5, SOT23−5 (TSOP−5)
SQ3, SN3 Pinout
Figure 1. Pin Connections
ORDERING INFORMATION
Device
NCS20091SQ3T2G
NCS20091SN2T1G
NCS20091SN3T1G
NCS20091MUTAG
NCV20091SQ3T2G*
NCV20091SN2T1G*
NCS20092DMR2G
NCS20092DR2G
NCS20092DTBR2G
NCV20092DMR2G*
NCV20092DR2G*
NCV20092DTBR2G*
NCS20094_
NCS20094_
NCS20094_
NCV20094_
NCV20094_
NCV20094_
Quad**
Yes
No
Dual
Yes
No
Yes
No
Single
Configuration
Automotive
Marking
AAQ
AEV
AEW
AJ
AAQ
AEV
2K92
NCS20092
K92
2K92
NCS20092
K92
TBD
TBD
TBD
TBD
TBD
TBD
Package
SC70
SOT23−5/TSOP−5
SOT23−5/TSOP−5
UDFN6
SC70
SOT23−5/TSOP−5
Micro8/MSOP8
SOIC−8
TSSOP−8
Micro8/MSOP8
SOIC−8
TSSOP−8
SOIC−14
SOP−14
TSSOP−14
SOIC−14
SOP−14
TSSOP−14
Contact local sales office for
more information
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**In Development. Not yet released.
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3
NCS20091/2/4, NCV20091/2/4
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Rating
Supply Voltage (V
DD
– V
SS
) (Note 2)
Input Voltage
Differential Input Voltage
Maximum Input Current
Maximum Output Current
Continuous Total Power Dissipation (Note 2)
Maximum Junction Temperature
Storage Temperature Range
Mounting Temperature (Infrared or Convection – 20 sec)
ESD Capability (Note 3)
Human Body Model
Machine Model
Charge Device Model
Symbol
V
S
V
I
V
ID
I
I
I
O
P
D
T
J
T
STG
T
mount
ESD
HBM
ESD
MM
ESD
CDM
I
LU
MSL
Limit
7
V
SS
− 0.5 to V
DD
+ 0.5
±V
s
±10
±100
200
150
−65 to 150
260
2000
100
2000
100
Level 1
Unit
V
V
V
mA
mA
mW
°C
°C
°C
V
Latch−Up Current (Note 4)
Moisture Sensitivity Level (Note 5)
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS for Safe Operating Area.
2. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JEDEC standard: JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (JEDEC standard: JESD22−A115)
4. Latch−up Current tested per JEDEC standard: JESD78
5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J-STD-020A
THERMAL INFORMATION
Parameter
Symbol
Channels
Package
SC−70
Single
SOT23−5/TSOP−5
UDFN6
Micro8/MSOP8
Junction to Ambient
Thermal Resistance
q
JA
Dual
SOIC−8
TSSOP−8
SOIC−14
Quad
SOP−14
TSSOP−14
6. Value based on 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm
2
copper area
7. Value based on 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm
2
copper area
Single Layer
Board
(Note 6)
490
310
276
236
190
253
Multi−Layer
Board
(Note 7)
444
247
239
167
131
194
°C/W
Unit
OPERATING RANGES
Parameter
Operating Supply Voltage
Differential Input Voltage
Input Common Mode Range
Ambient Temperature
Symbol
V
S
V
ID
V
ICM
T
A
V
SS
– 0.2
−40
Min
1.8
Max
5.5
V
S
V
DD
+ 0.2
125
Unit
V
V
V
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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4
NCS20091/2/4, NCV20091/2/4
ELECTRICAL CHARACTERISTICS AT V
S
= 1.8 V
T
A
= 25°C; R
L
≥
10 kW; V
CM
= V
OUT
= mid−supply unless otherwise noted.
Boldface
limits apply over the specified temperature range, T
A
= −40°C to 125°C. (Note 8)
Parameter
INPUT CHARACTERISTICS
Input Offset Voltage
V
OS
DV
OS
/DT
I
IB
0.5
3.5
4
Offset Voltage Drift
Input Bias Current (Note 8)
1
1
1500
Input Offset Current (Note 8)
I
OS
1
1100
Channel Separation
Differential Input Resistance
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
Common Mode Rejection Ratio
XTLK
R
ID
R
IN
C
ID
C
CM
CMRR
V
CM
= V
SS
– 0.2 to V
DD
+ 0.2
V
CM
= V
SS
+ 0.2 to V
DD
− 0.2
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain
A
VOL
85
73
Short Circuit Current
I
SC
Output to positive rail, sinking current
Output to negative rail, sourcing current
Output Voltage High
V
OH
Voltage output swing from positive rail
8.5
7.5
3
19
20
Output Voltage Low
V
OL
Voltage output swing from negative rail
3
19
20
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
Gain Margin
Settling Time
UGBW
SR
y
m
A
m
t
S
V
IN
= 1.2 Vpp,
Gain = 1
Settling time to 0.1%
Settling time to 0.01%
f = 100 Hz
V
ID
= 1.2 Vpp, Gain = 1
350
0.15
60
15
21
27
1
W
kHz
V/ms
°
dB
ms
mV
mV
mA
120
dB
48
45
DC
125
10
10
1
5
73
mV
mV
mV/°C
pA
pA
pA
pA
dB
GW
GW
pF
pF
dB
Symbol
Conditions
Min
Typ
Max
Unit
Open Loop Output Impedance
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
Input Referred Voltage Noise
Z
OL
THD+N
e
n
V
IN
= 1.2 Vpp, f = 1 kHz, Av = 1
f = 1 kHz
f = 10 kHz
0.04
40
30
300
%
nV/√Hz
Input Referred Current Noise
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio
i
n
PSRR
f = 1 kHz
fA/√Hz
No Load
63
60
90
dB
mA
Power Supply Quiescent Current
I
DD
Per channel, no load
20
29
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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