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IS42S16160B-7B

产品描述DRAM 256M (16Mx16) 143MHz Commercial Temp
产品类别存储    存储   
文件大小712KB,共62页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
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IS42S16160B-7B概述

DRAM 256M (16Mx16) 143MHz Commercial Temp

IS42S16160B-7B规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码BGA
包装说明VFBGA, BGA54,9X9,32
针数54
Reach Compliance Codenot_compliant
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
最长访问时间5.4 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)143 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PBGA-B54
JESD-609代码e0
长度13 mm
内存密度268435456 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度16
功能数量1
端口数量1
端子数量54
字数16777216 words
字数代码16000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA54,9X9,32
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
刷新周期8192
座面最大高度1 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.001 A
最大压摆率0.16 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度8 mm
Base Number Matches1

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IS42S83200B
IS42S16160B
32Meg x 8, 16Meg x16
256-MBIT SYNCHRONOUS DRAM
SEPTEMBER 2008
FEATURES
• Clock frequency: 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42S83200B
IS42S16160B
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable
CAS
latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Available in Industrial Temperature
• Available in 54-pin TSOP-II and 54-ball BGA
(x16 only)
• Available in Lead-free
V
DDQ
V
DD
3.3V 3.3V
3.3V 3.3V
OVERVIEW
ISSI
's 256Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 256Mb SDRAM is organized as follows.
IS42S83200B
54-pin TSOPII
IS42S16160B
54-pin TSOPII
54-ball BGA
8M x 8 x 4 Banks 4M x16x4 Banks
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS
Latency = 3
CAS
Latency = 2
Clk Frequency
CAS
Latency = 3
CAS
Latency = 2
Access Time from Clock
CAS
Latency = 3
CAS
Latency = 2
-6
6
8
166
125
5.4
6.5
-7
7
10
143
100
5.4
6.5
Unit
ns
ns
Mhz
Mhz
ns
ns
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. D
07/28/08
1

 
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