Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device contains ESD protection and exceeds the following tests:
Human Body Model 1500 V per MIL−STD−883, Method 3015.
Machine Model Method 150 V.
A+
1N4004
0.01
mF
TYP
FB*
0.027
mF
TYP
18 V
TYP R
opt
I
enbl
Enbl
1
N.C.
2
R
boost
I
boost
FB*
A−
*FB = MMZ2012 Y601B
3
NCP3712
ASN
V
out
6
V
in
5
V
Z
4
I
Z
I
load
R
load
R
enbl
KEY
0−500
W
1.0 k TYP
Figure 2. Typical Applications Circuit for Load Dump Transient Protection
15
“ENABLE
NOT”
INPUT
13.5 V SUPPLY RAIL
DEVICE OUTPUT
VOLTAGE
LOAD
DEPENDENT
EXP DECAY
120
100
AMPLITUDE (V)
80
60
40
20
V
off
13.5 V
SUPPLY
RAIL
V
on
LOAD
DEPENDENT
OUTPUT
EXP DECAY
TYPICAL
INPUT
TRANSIENT
AMPLITUDE (V)
10
50%
AMPLITUDE
tpLH
5
0
0
5
10
15
30
20 25
TIME (ms)
35
40
45
50
0
0
50
100
150
200
TIME (ms)
250
300
350
Figure 3. Enable NOT Switching Waveforms
Figure 4. Load Dump Waveforms
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2
NCP3712ASN, SZNCP3712ASN
ELECTRICAL CHARACTERISTICS
(V
in
= 12.5 V
DC
Ref to Gnd, T
A
= 25°C unless otherwise noted.)
Characteristic
OFF CHARACTERISTICS
Input−Output Breakdown Voltage
(@ I
out
= 200
mA)
Output Reverse Breakdown Voltage
(@ I
out
= −1.0 mA Pulse)
Output Leakage Current
(V
in
= V
enbl
= 30 V, T
A
= 25°C)
Guaranteed “Off” State “ENBL NOT” Voltage
(I
O
≤
100
mA)
Required “Off” State I
z
Current
(R
load
= 100
W)
V
in(off)
(V
z
= 16 V, I
load
= 100 mA, R
enbl
= 1500
W)
ON CHARACTERISTICS
Input−Output On Voltage
(I
o
= 100 mA, I
enbl
= −3.0 mA)
Output Load Current
⎯
Continuous
(I
enbl
= −3.0 mA, V
io(on)
= 0.5 Vdc)
(I
boost
= −9.0 mA, V
io(on)
= 0.5 Vdc)
(I
boost
= −9.0 mA, V
io(on)
= 0.6 Vdc)
V
in(on)
(V
z
= 16 V, I
load
= 100 mA, R
enbl
= 1500
W)
“ENBL NOT” Input Current
(I
o
= 100 mA, V
io(on)
= 0.35 Vdc, R
enbl
= 1500
W)
SWITCHING CHARACTERISTICS
Propagation Delay Time:
Hi to Lo Prop Delay; Fig. 3 (V
in
= V
enbl
= 13.5 V)
Lo to Hi Prop Delay; Fig. 3 (V
in
= 13.5 V, V
enbl
= 0 V)
Transition Times:
Fall Time; Fig. 4 (V
in
= V
enbl
= 13.5 V)
Rise Time; Fig. 4 (V
in
= V
enbl
= 0 V)
INTERNAL RESISTORS
Input Leakage Resistor
Input Resistor
Output Leakage Resistor
Enable Input Resistor
2.95
I
BASE
, BASE CURRENT (mA)
2.9
2.85
2.8
2.75
2.7
2.65
2.6
2.55
2.5
2.45
−40
−20
0
I
C
− 300 mA
V
CE
− 600 mV
20
40
60
TEMPERATURE (°C)
80
100
R2
R1
R4
R3
7.0
3.3
1.4
1.4
10
4.7
2.4
2.4
13
6.1
3.2
3.2
kW
kW
kW
kW
mS
t
PHL
t
PLH
t
f
t
r
−
−
−
−
1.5
1.5
75
400
−
−
hS
−
−
V
io(on)
−
I
o(on)
−
−
−
V
on
8.5
I
enbl
−
−
−1.0
−
10.5
mAdc
−
−
−
−200
−200
−300
Vdc
0.2
0.5
mAdc
Vdc
V
(BRio)
105
V
(−BRout)
−
I
load(off)
−
V
enbl(off)
13
I
z(off)
150
V
off
15.5
−
18.7
−
−
Vdc
−
−
mAdc
−
−100
Vdc
−0.7
−
mAdc
−
−
Vdc
Vdc
Symbol
Min
Typ
Max
Unit
Figure 5. Q2 Base Current vs Temperature with Pin 4 Open
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3
NCP3712ASN, SZNCP3712ASN
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
6
5
1
2
4
H
E
E
3
DIM
A
A1
b
c
D
E
e
L
H
E
q
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
b
e
q
0.05 (0.002)
A1
A
L
C
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.37
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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