Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60DN512ZVMD10

MK60DN512ZVMD10: 产品描述ARM Microcontrollers - MCU KINETIS CORTEX M4 512K ENET; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共79页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK60DN512ZVMD10概述

ARM Microcontrollers - MCU KINETIS CORTEX M4 512K ENET

MK60DN512ZVMD10规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	BGA
包装说明	13 X 13 MM, MAPBGA-144
针数	144
Reach Compliance Code	unknown
ECCN代码	3A991.A.2
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4
最大时钟频率	32 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PBGA-B144
长度	13 mm
湿度敏感等级	3
I/O 线路数量	104
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装等效代码	BGA144,12X12,40
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	131072
ROM（单词）	524288
ROM可编程性	FLASH
座面最大高度	1.7 mm
速度	100 MHz
最大压摆率	87 mA
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper - with Nickel barrier
端子形式	BALL
端子节距	0.5 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

文档解析

K60系列微控制器是Freescale（现为NXP Semiconductors的一部分）生产的一款高性能微控制器，基于ARM Cortex-M4核心。这些微控制器因其丰富的存储器配置、高性能和多功能性，在工业控制、医疗设备、汽车电子和高端消费电子等领域有着广泛的应用。以下是K60系列微控制器在存储器配置方面的一些优势和应用场景：

灵活的存储器配置：
- K60系列提供了不同容量的程序闪存（Program Flash）和数据闪存（Data Flash），以及FlexNVM技术，允许用户将一部分闪存用作数据存储或执行代码。
高性能：
- 核心运行频率高达100 MHz，提供了快速的数据处理能力，适合需要快速响应的应用。
内存保护单元（MPU）：
- 具备内存保护功能，可以有效地隔离不同任务或进程的内存空间，提高系统的安全性和稳定性。
FlexRAM：
- FlexRAM技术允许用户将一部分RAM用作程序存储或数据存储，提供了灵活的内存使用方案。
低功耗运行：
- K60系列支持多种低功耗模式，如VLLS（Very Low Leakage Stop Mode），有助于延长电池寿命，适合便携式设备。
安全特性：
- 内置硬件加密模块，支持多种加密算法，如AES、DES等，适合需要高安全性的应用。
丰富的外设接口：
- 提供了多种通信接口，如Ethernet、USB、CAN、SPI、I2C等，便于与其他设备或网络进行数据交换。

应用场景：

工业控制：利用其高性能和丰富的通信接口，K60系列微控制器可以用于复杂的工业自动化和控制系统。
医疗设备：由于其低功耗和高安全性，K60系列适合用于便携式医疗监测设备和诊断设备。
汽车电子：在汽车信息娱乐系统、车身控制、安全系统中，K60系列可以提供所需的处理能力和可靠性。
高端消费电子：如智能手机、平板电脑、智能家居设备等，K60系列能够提供流畅的用户体验和快速的数据处理。

K60系列微控制器的存储器配置和性能特点使其成为多种应用的理想选择，尤其是在需要高性能处理、安全运行和灵活内存管理的场合。

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K60P144M100SF2

Rev. 7, 02/2013

Supports the following:

MK60DN256ZVLQ10,

MK60DX256ZVLQ10,

MK60DN512ZVLQ10,

MK60DN256ZVMD10,

MK60DX256ZVMD10,

MK60DN512ZVMD10

K60 Sub-Family Data Sheet

K60P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 63

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................11

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 AC electrical characteristics..............................................12

5.2 Nonswitching electrical specifications...............................12

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements......13

LVD and POR operating requirements...............14

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......16

Power consumption operating behaviors............17

EMC radiated emissions operating behaviors....20

Designing with radiated emissions in mind.........21

Capacitance attributes........................................21

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

5.4.2

Thermal attributes...............................................23

6 Peripheral operating requirements and behaviors....................24

6.1 Core modules....................................................................24

6.1.1

6.1.2

Debug trace timing specifications.......................24

JTAG electricals..................................................25

6.2 System modules................................................................28

6.3 Clock modules...................................................................28

6.3.1

6.3.2

6.3.3

MCG specifications.............................................28

Oscillator electrical specifications.......................30

32 kHz Oscillator Electrical Characteristics........32

6.4 Memories and memory interfaces.....................................33

6.4.1

6.4.2

6.4.3

Flash electrical specifications.............................33

EzPort Switching Specifications.........................37

Flexbus Switching Specifications........................38

6.5 Security and integrity modules..........................................41

6.6 Analog...............................................................................41

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................41

CMP and 6-bit DAC electrical specifications......49

12-bit DAC electrical characteristics...................51

Voltage reference electrical specifications..........54

6.7 Timers................................................................................55

6.8 Communication interfaces.................................................55

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................57

USB DCD electrical specifications......................57

USB VREG electrical specifications...................58

CAN switching specifications..............................58

DSPI switching specifications (limited voltage

range).................................................................59

DSPI switching specifications (full voltage

range).................................................................60

Inter-Integrated Circuit Interface (I2C) timing..... 62

UART switching specifications............................63

SDHC specifications...........................................63

I2S switching specifications................................64

5.3 Switching specifications.....................................................21

5.3.1

5.3.2

Device clock specifications.................................21

General switching specifications.........................21

6.9 Human-machine interfaces (HMI)......................................67

6.9.1

TSI electrical specifications................................67

5.4 Thermal specifications.......................................................22

5.4.1

Thermal operating requirements.........................22

7 Dimensions...............................................................................68

7.1 Obtaining package dimensions.........................................68

K60 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.

Freescale Semiconductor, Inc.

MK60DN512ZVMD10相似产品对比

	MK60DN512ZVMD10	MK60DN512ZVLQ10R	MK60DX256ZVLQ10
描述	ARM Microcontrollers - MCU KINETIS CORTEX M4 512K ENET	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144
是否Rohs认证	符合	符合	符合
包装说明	13 X 13 MM, MAPBGA-144	LFQFP,	LFQFP,
Reach Compliance Code	unknown	compliant	compliant
ECCN代码	3A991.A.2	3A991.A.2	3A991.A.2
具有ADC	YES	YES	YES
位大小	32	32	32
最大时钟频率	32 MHz	32 MHz	32 MHz
DAC 通道	YES	YES	YES
DMA 通道	YES	YES	YES
JESD-30 代码	S-PBGA-B144	S-PQFP-G144	S-PQFP-G144
长度	13 mm	20 mm	20 mm
湿度敏感等级	3	3	3
I/O 线路数量	104	104	104
端子数量	144	144	144
最高工作温度	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	LFQFP	LFQFP
封装形状	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	FLASH	FLASH	FLASH
座面最大高度	1.7 mm	1.6 mm	1.6 mm
速度	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES
技术	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Silver/Copper - with Nickel barrier	TIN	TIN
端子形式	BALL	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm
端子位置	BOTTOM	QUAD	QUAD
处于峰值回流温度下的最长时间	40	40	40
宽度	13 mm	20 mm	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Objectid	-	4000174849	4000174880
Country Of Origin	-	Mainland China, Malaysia	Malaysia
Factory Lead Time	-	52 weeks	52 weeks
Samacsys Manufacturer	-	NXP	NXP
Samacsys Modified On	-	2022-12-27 12:55:46	2022-12-27 12:55:46
YTEOL	-	3.6	4.28
JESD-609代码	-	e3	e3