IRF8302MPbF
l
l
l
l
l
l
l
l
l
l
l
RoHs Compliant and Halogen-Free
HEXFET
®
Power MOSFET plus Schottky Diode
Integrated Monolithic Schottky Diode
Typical values (unless otherwise specified)
Low Profile (<0.7 mm)
V
DSS
V
GS
R
DS(on)
R
DS(on)
Dual Sided Cooling Compatible
30V max ±20V max 1.4mΩ@ 10V 2.2mΩ@ 4.5V
Ultra Low Package Inductance
Q
g tot
Q
gd
Q
gs2
Q
rr
Q
oss
V
gs(th)
Optimized for High Frequency Switching
35nC
8.9nC
5.1nC
40nC
29nC
1.8V
Ideal for CPU Core DC-DC Converters
Optimized for Sync. FET socket of Sync. Buck Converter
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques
100% Rg tested
MX
MP
DirectFET ISOMETRIC
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF8302MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
®
packaging to achieve
the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET
®
package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET
®
package allows dual
sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF8302MPbF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance to
reduce both conduction and switching losses. This part contains an integrated Schottky diode to reduce the Qrr of the body drain diode further
reducing the losses in a Synchronous Buck circuit. The reduced losses make this product ideal for high frequency/high efficiency DC-DC
converters that power high current loads such as the latest generation of microprocessors. The IRF8302MPbF has been optimized for
parameters that are critical in synchronous buck converter’s Sync FET sockets.
Base Part number
IRF8302MPbF
Package Type
DirectFET MX
Parameter
Standard Pack
Form
Quantity
Tape and Reel
4800
Orderable Part Number
IRF8302MTRPbF
Max.
Units
V
Absolute Maximum Ratings
V
DS
V
GS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
D
@ T
C
= 25°C
I
DM
E
AS
I
AR
6
Typical RDS(on) (mΩ)
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
g
e
e
f
VGS, Gate-to-Source Voltage (V)
Ãg
h
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0
10
20
30
ID= 25A
30
±20
31
25
190
250
260
25
VDS= 24V
VDS= 15V
A
mJ
A
5
4
3
2
1
0
0
2
4
6
8
10
12
14
T J = 25°C
ID = 31A
VDS= 6.0V
T J = 125°C
16
18
20
40
50
60
70
80
90 100
VGS, Gate -to -Source Voltage (V)
Fig 1.
Typical On-Resistance vs. Gate Voltage
Notes:
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
QG Total Gate Charge (nC)
Fig 2.
Typical Total Gate Charge vs. Gate-to-Source Voltage
T
C
measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.83mH, R
G
= 25Ω, I
AS
= 25A.
1
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IRF8302MPbF
Static @ T
J
= 25°C (unless otherwise specified)
Parameter
BV
DSS
∆ΒV
DSS
/∆T
J
R
DS(on)
V
GS(th)
∆V
GS(th)
/∆T
J
I
DSS
I
GSS
gfs
Q
g
Q
gs1
Q
gs2
Q
gd
Q
godr
Q
sw
Q
oss
R
G
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Q
gs2
+ Q
gd
)
Output Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
30
–––
–––
–––
1.35
–––
–––
–––
–––
–––
120
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max. Units
–––
4.0
1.4
2.2
1.8
-4.2
–––
–––
–––
–––
–––
35
11
5.1
8.9
10
14
29
1.3
22
37
20
15
6030
1360
560
–––
V
Conditions
V
GS
= 0V, I
D
= 1.0mA
––– mV/°C Reference to 25°C, I
D
= 10mA
1.8
mΩ V
GS
= 10V, I
D
= 31A
V
GS
= 4.5V, I
D
= 25A
2.7
V
DS
= V
GS
, I
D
= 150µA
2.35
V
––– mV/°C V
DS
= V
GS
, I
D
= 10mA
100
µA V
DS
= 24V, V
GS
= 0V
i
i
5.0
100
-100
–––
53
–––
–––
–––
–––
–––
–––
2.2
–––
–––
–––
–––
–––
–––
–––
mA
nA
S
V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
DS
= 15V, I
D
= 25A
V
DS
= 15V
V
GS
= 4.5V
I
D
= 25A
See Fig. 15
nC
nC
Ω
V
DS
= 16V, V
GS
= 0V
V
DD
= 15V, V
GS
= 4.5V
I
D
= 25A
R
G
= 1.8Ω
See Fig. 17
V
GS
= 0V
Ãi
ns
pF
V
DS
= 15V
ƒ = 1.0MHz
Diode Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Min.
–––
–––
–––
–––
–––
Typ. Max. Units
–––
–––
–––
30
40
31
A
250
0.80
45
60
V
ns
nC
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= 25A, V
GS
= 0V
T
J
= 25°C, I
F
= 25A
di/dt = 300A/µs
Ãg
i
Reverse Recovery Time
Reverse Recovery Charge
i
Notes:
Pulse width
≤
400µs; duty cycle
≤
2%.
2
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IRF8302MPbF
Absolute Maximum Ratings
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
P
D
@T
C
= 25°C
T
P
T
J
T
STG
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
e
e
f
Parameter
Max.
2.8
1.8
104
270
-40 to + 150
Units
W
°C
Thermal Resistance
R
θJA
R
θJA
R
θJA
R
θJC
R
θJ-PCB
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
100
D = 0.50
Thermal Response ( Z thJA )
el
jl
kl
fl
Parameter
Typ.
–––
12.5
20
–––
1.0
0.022
Max.
45
–––
–––
1.2
–––
Units
°C/W
eÃ
W/°C
10
0.20
0.10
0.05
1
0.02
0.01
τ
J
R
1
R
1
τ
J
τ
1
τ
2
R
2
R
2
R
3
R
3
τ
3
R
4
R
4
τ
A
τ
4
τ
A
Ri (°C/W)
14.507
8.742
18.806
2.945
τi
(sec)
12.335077
0.1865935
1.9583548
0.0065404
τ
1
τ
2
τ
3
τ
4
0.1
SINGLE PULSE
( THERMAL RESPONSE )
0.01
1E-005
0.0001
0.001
0.01
Ci=
τi/Ri
Ci=
τi/Ri
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
(At lower pulse widths Zth
JA
& ZTH
JC
are combined)
Notes:
R
θ
is measured at
T
J
of approximately 90°C.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Fig 3.
Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Surface mounted on 1 in. square Cu
(still air).
Mounted to a PCB
with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
February 17, 2014
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IRF8302MPbF
1000
TOP
VGS
10V
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
1000
TOP
VGS
10V
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
100
100
BOTTOM
10
BOTTOM
1
10
2.5V
0.1
2.5V
≤
60µs PULSE WIDTH
0.01
0.1
1
Tj = 25°C
1
100
0.1
1
10
≤
60µs PULSE WIDTH
Tj = 150°C
10
100
VDS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
Fig 4.
Typical Output Characteristics
1000
VDS = 15V
≤60µs
PULSE WIDTH
Typical RDS(on) (Normalized)
Fig 5.
Typical Output Characteristics
2.0
ID = 31A
V GS = 10V
1.5
V GS = 4.5V
ID, Drain-to-Source Current (A)
100
T J = 150°C
T J = 25°C
T J = -40°C
10
1.0
1
0.1
1
2
3
4
0.5
-60 -40 -20 0
20 40 60 80 100 120 140 160
T J , Junction Temperature (°C)
VGS, Gate-to-Source Voltage (V)
Fig 6.
Typical Transfer Characteristics
100000
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
C rss = C gd
Fig 7.
Normalized On-Resistance vs. Temperature
10
T J = 25°C
8
Vgs = 3.5V
Vgs = 4.0V
Vgs = 4.5V
Vgs = 5.0V
Vgs = 10V
10000
Ciss
Coss
Typical RDS(on) ( mΩ)
C oss = C ds + C gd
C, Capacitance(pF)
6
4
1000
Crss
2
100
1
10
VDS, Drain-to-Source Voltage (V)
100
0
0
50
100
150
200
Fig 8.
Typical Capacitance vs.Drain-to-Source Voltage
4
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Fig 9.
Typical On-Resistance vs.
Drain Current and Gate Voltage
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ID, Drain Current (A)
IRF8302MPbF
1000
1000
OPERATION IN THIS AREA LIMITED
BY RDS(on)
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
100
100
10msec
10
DC
1
100µsec
1msec
10
T J = 150°C
1
T J = 25°C
T J = -40°C
VGS = 0V
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VSD, Source-to-Drain Voltage (V)
TA = 25°C
TJ = 150°C
Single Pulse
0.1
0.01
0.10
1.00
10.00
100.00
VDS, Drain-to-Source Voltage (V)
Fig 10.
Typical Source-Drain Diode Forward Voltage
200
Fig11.
Maximum Safe Operating Area
Typical VGS(th) Gate threshold Voltage (V)
2.4
ID, Drain Current (A)
150
2.2
2.0
ID = 10mA
1.8
100
50
1.6
0
25
50
75
100
125
150
T C , Case Temperature (°C)
1.4
-75 -50 -25
0
25
50
75 100 125 150
T J , Temperature ( °C )
Fig 12.
Maximum Drain Current vs. Case Temperature
1200
EAS , Single Pulse Avalanche Energy (mJ)
Fig 13.
Typical Threshold Voltage vs. Junction
Temperature
ID
TOP
1.3A
2.2A
BOTTOM 25A
1000
800
600
400
200
0
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
Fig 14.
Maximum Avalanche Energy vs. Drain Current
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