TB62781FNG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62781FNG
9-Channel Constant-Current LED Driver of the 3.3V and 5V Power Supply Voltage
Operation
1. Features
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Power supply voltages: V
CC
= 3.3 V/5 V
Output drive capability and output count: 80 mA (max)× 9 channels
Constant-current output range: 5 to 40 mA
Voltage applied to constant-current output terminals: 0.4 V(min) (I
OUT
= 5 to 40 mA)
Designed for common-anode LEDs
The input interface is controlled by the SDA and SCLK signal lines.
Thermal shutdown (TSD) (min: 150℃)
Logical Input signal voltage level: 3.3V and 5V CMOS interfaces (Schmitt trigger input)
Maximum output voltage: 28 V
Incorporates PWM control circuitry: Provides seven-bit PWM control.
Driver identification: Up to 64 drivers can be controlled individually.
Operating temperature range: T
opr
=
−40
to 85°C
Package: SSOP20-P-225-0.65A
Absolute Maximum Ratings (T
a
= 25 °C)
Characteristics
Supply voltage
Input voltage
Output current
Output voltage
Power dissipation
Thermal resistance
Operating temperature range
Storage temperature range
Maximum junction temperature
Symbol
V
CC
V
IN
I
OUT
V
OUT
P
d
R
th (j-a)
T
opr
T
stg
T
j
Rating
6.0
−0.3
to V
CC
+
0.3 (Note 1)
85
−0.3
to 29
1.02 (Notes 2 and 3)
122 (Note 2)
−40
to 85
−55
to 150
150
Unit
V
V
mA/ch
V
W
°C/W
°C
°C
°C
Note 1:
Note 2:
Note 3:
However, do not exceed 6.0 V.
When mounted on a PCB (76.2
×
114.3
×
1.6 mm; Cu
=
30%; 35-µm-thick; SEMI-compliant)
Power dissipation is reduced by 1/R
th (j-a)
for each °C above 25°C ambient.
Please use contents on this material as reference.
Please contact if you need formal datasheet.
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TB62781FNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush current
at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (T
J
) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum
ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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2011-06-21
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