Op Amp Dual High Speed Amplifier ±6V/12V 8-Pin SOIC N Tube
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
类型 Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 2 |
Process Technology | Bipolar |
Maximum Input Offset Voltage (mV) | 6@±5V |
Minimum Single Supply Voltage (V) | 6 |
Typical Single Supply Voltage (V) | 9 |
Maximum Single Supply Voltage (V) | 12 |
Minimum Dual Supply Voltage (V) | ±3 |
Typical Dual Supply Voltage (V) | ±5 |
Maximum Dual Supply Voltage (V) | ±6 |
Typical Input Bias Current (uA) | 3@±5V |
Maximum Input Bias Current (uA) | 6@±5V |
Maximum Quiescent Current (mA) | 11.5@±5V |
Typical Output Current (mA) | 70@±5V |
Power Supply Type | Single|Dual |
Maximum Power Dissipation (mW) | 900 |
Typical Slew Rate (V/us) | 1200@±5V |
Typical Input Noise Voltage Density (nV/rtHz) | 2@±5V |
Input Offset Voltage Drift (uV/°C) | 9 |
Typical Inverting Input Current Noise Density (pA/rtHz) | 18@±5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 2@±5V |
Minimum PSRR (dB) | 60 |
Minimum CMRR (dB) | 49 |
Minimum CMRR Range (dB) | <50 |
Typical Settling Time (ns) | 16 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
系列 Packaging | Tube |
Pin Count | 8 |
Standard Package Name | SOP |
Supplier Package | SOIC N |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Package Width | 4(Max) |
PCB changed | 8 |
Lead Shape | Gull-wing |
AD8002ARZ | AD8002ARMZ-REEL7 | AD8002ARMZ | AD8002ARZ-R7 | P0805H2180WNPD | |
---|---|---|---|---|---|
描述 | Op Amp Dual High Speed Amplifier ±6V/12V 8-Pin SOIC N Tube | Op Amp Dual High Speed Amplifier ±6V/12V 8-Pin MSOP T/R | Op Amp Dual High Speed Amplifier ±6V/12V 8-Pin MSOP Tube | Op Amp Dual High Speed Amplifier ±6V/12V 8-Pin SOIC N T/R | Fixed Resistor, Thin Film, 0.2W, 218ohm, 150V, 0.05% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP |
是否Rohs认证 | - | 符合 | 符合 | - | 符合 |
包装说明 | - | TSSOP, | TSSOP, | - | CHIP |
Reach Compliance Code | - | compliant | compliant | - | compliant |
ECCN代码 | - | EAR99 | EAR99 | - | EAR99 |
端子数量 | - | 8 | 8 | - | 2 |
最高工作温度 | - | 85 °C | 85 °C | - | 155 °C |
最低工作温度 | - | -40 °C | -40 °C | - | -55 °C |
封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMT |
表面贴装 | - | YES | YES | - | YES |
端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | - | TIN SILVER OVER NICKEL |
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