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MAX9700CETB-

产品描述Audio Amplifiers 1.2W, Low-EMI, Filterless, Class D Audio Amplifier
产品类别半导体    模拟混合信号IC   
文件大小351KB,共20页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX9700CETB-概述

Audio Amplifiers 1.2W, Low-EMI, Filterless, Class D Audio Amplifier

MAX9700CETB-规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Maxim(美信半导体)
产品种类
Product Category
Audio Amplifiers
产品
Product
Audio Amplifiers

Class
Class-D
Output Power1.6 W
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
TDFN-EP-10
Audio - Load Impedance16 Ohms
THD plus Noise0.01 %
电源电压-最大
Supply Voltage - Max
5.5 V
电源电压-最小
Supply Voltage - Min
2.5 V
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
Description/FunctionSpeaker
高度
Height
0.75 mm
Input TypeDifferential
长度
Length
3.1 mm
Output Current600 mA
输出类型
Output Type
1-Channel Mono
Supply TypeSingle
宽度
Width
3.1 mm
CMRR - Common Mode Rejection Ratio72 dB
Ib - Input Bias Current600 mA
NumOfPackaging1
工作电源电压
Operating Supply Voltage
3 V, 5 V
Output Signal TypeDifferential
Pd-功率耗散
Pd - Power Dissipation
1.9512 W
PSRR - Power Supply Rejection Ratio72 dB

文档预览

下载PDF文档
19-3030; Rev 2; 10/08
1.2W, Low-EMI, Filterless,
Class D Audio Amplifier
General Description
The MAX9700 mono class D audio power amplifier pro-
vides class AB amplifier performance with class D effi-
ciency, conserving board space and extending battery
life. Using a class D architecture, the MAX9700 delivers
1.2W into an 8Ω load while offering efficiencies above
90%. A low-EMI modulation scheme renders the tradi-
tional class D output filter unnecessary.
The MAX9700 offers two modulation schemes: a fixed-
frequency (FFM) mode, and a spread-spectrum (SSM)
mode that reduces EMI-radiated emissions due to the
modulation frequency. Furthermore, the MAX9700 oscil-
lator can be synchronized to an external clock through
the SYNC input, allowing the switching frequency to be
user defined. The SYNC input also allows multiple
MAX9700s to be cascaded and frequency locked, mini-
mizing interference due to clock intermodulation. The
device utilizes a fully differential architecture, a full-
bridged output, and comprehensive click-and-pop sup-
pression. The gain of the MAX9700 is set internally
(MAX9700A: 6dB, MAX9700B: 12dB, MAX9700C:
15.6dB, MAX9700D: 20dB), further reducing external
component count.
The MAX9700 features high 72dB PSRR, a low 0.01%
THD+N, and SNR in excess of 90dB. Short-circuit and
thermal-overload protection prevent the device from
damage during a fault condition. The MAX9700 is avail-
able in 10-pin TDFN (3mm
3mm
0.8mm), 10-pin
µMAX
®
, and 12-bump UCSP™ (1.5mm
2mm
0.6mm)
packages. The MAX9700 is specified over the extended
-40°C to +85°C temperature range.
Features
Filterless Amplifier Passes FCC Radiated
Emissions Standards with 100mm of Cable
Unique Spread-Spectrum Mode Offers 5dB
Emissions Improvement Over Conventional
Methods
Optional External SYNC Input
Simple Master-Slave Setup for Stereo Operation
94% Efficiency
1.2W into 8Ω
Low 0.01% THD+N
High PSRR (72dB at 217Hz)
Integrated Click-and-Pop Suppression
Low Quiescent Current (4mA)
Low-Power Shutdown Mode (0.1µA)
Short-Circuit and Thermal-Overload Protection
Available in Thermally Efficient, Space-Saving
Packages
10-Pin TDFN (3mm x 3mm x 0.8mm)
10-Pin µMAX
12-Bump UCSP (1.5mm x 2mm x 0.6mm)
MAX9700
Ordering Information
PART
MAX9700AETB
MAX9700AEUB
MAX9700AEBC-T
MAX9700BETB
MAX9700BEUB
MAX9700BEBC-T
TEMP RANGE
-40
o
C to +85
o
C
-40
o
C to +85
o
C
-40 C to +85 C
-40 C to +85 C
-40
o
C to +85
o
C
-40 C to +85 C
o
o
o
o
o
o
PIN-
PACKAGE
10 TDFN-EP*
10 µMAX
12 UCSP
10 TDFN-EP*
10 µMAX
12 UCSP
TOP
MARK
ACM
ACI
Applications
Cellular Phones
PDAs
MP3 Players
Portable Audio
Block Diagram
V
DD
*EP = Exposed pad.
Ordering Information continued and Selector Guide appears
at end of data sheet.
Pin Configurations
DIFFERENTIAL
AUDIO INPUT
MODULATOR
AND H-BRIDGE
TOP VIEW
V
DD
1
IN+
2
3
4
5
10
PV
DD
9
OUT-
OUT+
PGND
SYNC
SYNC
INPUT
OSCILLATOR
IN-
GND
MAX9700
8
7
6
MAX9700
SHDN
TDFN/μMAX
UCSP is a trademark of Maxim Integrated Products, Inc.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9700CETB-相似产品对比

MAX9700CETB- MAX9700AETB-T MAX9700DEBC-T MAX9700BEBC-T MAX9700CEUB-T
描述 Audio Amplifiers 1.2W, Low-EMI, Filterless, Class D Audio Amplifier Audio Amplifiers 1.2W L-EMI Filterles Class D Audio Amp Audio Amplifiers Audio Amplifiers Audio Amplifiers
是否无铅 - 含铅 含铅 含铅 含铅
是否Rohs认证 - 不符合 不符合 不符合 不符合
厂商名称 - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 - SON BGA BGA TSSOP
包装说明 - VSON, SOLCC10,.11,20 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 1.50 X 2 MM, 0.60 MM HEIGHT, UCSP-12 MO-187CBA, MICRO, SOP-10
针数 - 10 12 12 10
Reach Compliance Code - not_compliant not_compliant not_compliant not_compliant
ECCN代码 - EAR99 EAR99 EAR99 EAR99
标称带宽 - 22 kHz 22 kHz 22 kHz 22 kHz
商用集成电路类型 - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
增益 - 6 dB 20 dB 12 dB 15.6 dB
JESD-30 代码 - S-XDSO-N10 R-PBGA-B12 R-PBGA-B12 S-PDSO-G10
JESD-609代码 - e0 e0 e0 e0
长度 - 3 mm 2.02 mm 2.02 mm 3 mm
湿度敏感等级 - 1 1 1 -
信道数量 - 1 1 1 1
功能数量 - 1 1 1 1
端子数量 - 10 12 12 10
最高工作温度 - 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C
标称输出功率 - 1.6 W 1.6 W 1.6 W 1.6 W
封装主体材料 - UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - VSON VFBGA VFBGA TSSOP
封装等效代码 - SOLCC10,.11,20 BGA12,3X4,20 BGA12,3X4,20 TSSOP10,.19,20
封装形状 - SQUARE RECTANGULAR RECTANGULAR SQUARE
封装形式 - SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) - 245 245 245 245
电源 - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 0.8 mm 0.67 mm 0.67 mm 1.1 mm
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 - YES YES YES YES
技术 - BICMOS BICMOS BICMOS BICMOS
温度等级 - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - NO LEAD BALL BALL GULL WING
端子节距 - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 - DUAL BOTTOM BOTTOM DUAL
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 - 3 mm 1.54 mm 1.54 mm 3 mm
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