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BD6066EKN-E2

产品描述LED Lighting Drivers Wht Backlight LED Medium/Large LCD
产品类别模拟混合信号IC    驱动程序和接口   
文件大小522KB,共19页
制造商ROHM(罗姆半导体)
官网地址https://www.rohm.com/
标准
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BD6066EKN-E2概述

LED Lighting Drivers Wht Backlight LED Medium/Large LCD

BD6066EKN-E2规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称ROHM(罗姆半导体)
零件包装代码QFN
包装说明HVQCCN,
针数28
Reach Compliance Codecompliant
ECCN代码EAR99
接口集成电路类型LED DISPLAY DRIVER
JESD-30 代码S-XQCC-N28
长度5.2 mm
复用显示功能NO
功能数量1
区段数48
端子数量28
最高工作温度85 °C
最低工作温度-30 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1 mm
最大供电电压22 V
最小供电电压2.7 V
标称供电电压12 V
表面贴装YES
温度等级OTHER
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5.2 mm
Base Number Matches1

文档预览

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LED Drivers for LCD Backlights
White Backlight LED Drivers
for Medium to Large LCD Panels
(Switching Regulator Type)
BD6066GU, BD6066EKN
No.11040EBT26
●Description
BD6066GU/BD6066EKN are white LED driver ICs with PWM step-up DC/DC converter that can boost max 40.5V and
current driver that can drive max 30mA. The wide brightness can be adjusted to control by external PWM pulse on power
control terminal. And, with extended resolution current driver, a few errors between the lines of the current driver, it is suitable
for decreasing the lacking in brightness of the display. BD6066GU, CSP package type, is suited for saving space.
BD6066EKN, HQFN package type, is suited for mounting on the flexible board.
●Features
1) High efficiency PWM step-up DC/DC converter (fsw=1MHz)
2) Extended resolution current driver 4ch
3) Driving
12 series × 4parallel =48 white LEDs (
white LED Vf=3.2Vmax)
4) Wide input voltage range (2.7V ~ 22V)
5) Rich safety functions
Over-voltage protection (OVP)
Over current limit
External SBD open detect
Thermal shutdown (175
℃)
6) CSP small & thin package
VCSP85H2 2.6 × 2.6 × 0.85mm
HQFN28V 5.2 × 5.2 × 0.95mm
●Applications
Notebook PC, portable DVD player, car navigation systems
Absolute maximum ratings (Ta=25
℃)
Parameter
Maximum applied voltage 1
Maximum applied voltage 2
Maximum applied voltage 3
Maximum applied voltage 4
Power dissipation 1 (BD6066GU)
Power dissipation 2 (BD6066EKN)
Power dissipation 3 (BD6066EKN)
Power dissipation 4 (BD6066EKN)
Operating temperature range
Storage temperature range
Symbol
VMAX1
VMAX2
VMAX3
VMAX4
Pd1
Pd2
Pd3
Pd4
Topr
Tstg
Limits
7
15.5
30.5
50.5
1100
*1
560
*2
880
*3
2650
*4
-30 ~ +85
-55 ~ +150
Unit
V
V
V
V
mW
mW
mW
mW
Condition
TEST,ISET,VREG,SENSP,
SENSN, SW, EN1, EN2, PWM
LED1, LED2, LED3, LED4
VBAT
VDET
(*1) The measurement value which was mounted on the PCB by ROHM. When it’s used by more than Ta=25
℃,
it’s reduced by 8.8mW/
℃.
(*2) Reduced 4.5mW/
With Ta>25
when not mounted on a heat radiation Board.
(*3) 70mm x 70mm x 1.6mm glass epoxy Board which has 1 layers (60mm x 60mm). When it’s used by more than Ta=25
℃,
it’s reduced by 7.0mW/
℃.
(*4) 70mm x 70mm x 1.6mm glass epoxy Board which has 2 layers (60mm x 60mm). When it’s used by more than Ta=25
℃,
it’s reduced by 21.2mW/
℃.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/15
2011.06 - Rev.B

 
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