Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Operating Voltage Range
Supply Current
SYMBOL
CONDITIONS
V
CC
= 2.8V
I
CC
No load, V
CC
> V
TH
V
CC
= 3.6V
V
CC
= 5.5V
T
A
= +25°C
Supply Current in Battery
Backup Mode
V
BATT
= 2.8V,
V
CC
= 0V,
excluding I
OUT
(V
BATT
+ 0.2V) < V
CC
< 5.5V
T
A
= -40°C to +85°C
T
A
= -55°C
(MAX16039PLA31+T
only)
T
A
= +25°C
T
A
= -40°C to +85°C
-0.1
-0.3
MIN
0
13
16
22
TYP
MAX
5.5
30
35
50
1
2
µA
10
+0.02
+0.02
3.1
3.7
4.6
V
BATT
- 0.2
V
BATT
- 0.15
V
BATT
- 0.15
0
-40
mV
V
Ω
µA
UNITS
V
V
CC
, V
BATT
No load (Note 2)
BATT Standby Current (Note 3)
I
BATT
µA
V
CC
= 4.75V, V
CC
> V
TH
, I
OUT
= 150mA
V
CC
to OUT On-Resistance
R
ON
V
CC
= 3.15V, V
CC
> V
TH
, I
OUT
= 65mA
V
CC
= 2.5V, V
CC
> V
TH
, I
OUT
= 25mA
Output Voltage in Battery
Backup Mode
Battery-Switchover Threshold
V
BATT
= 4.50V, V
CC
= 0V, I
OUT
= 20mA
V
OUT
V
BATT
= 3.15V, V
CC
= 0V, I
OUT
= 10mA
V
BATT
= 2.5V, V
CC
= 0V, I
OUT
= 5mA
V
SW
V
CC
- V
BATT
,
V
CC
< V
TH
V
CC
rising
V
CC
falling
www.maximintegrated.com
Maxim Integrated
│
2
MAX16033–MAX16040
Low-Power Battery-Backup
Circuits in Small μDFN Packages
Electrical Characteristics (continued)
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
RESET OUTPUT
MAX160_ _ _L_46
MAX160_ _ _L_44
Reset Threshold
V
TH
MAX160_ _ _L_31
MAX160_ _ _L_29
MAX160_ _ _L_26
MAX160_ _ _L_23
V
CC
Falling Reset Delay
Reset Active Timeout Period
RESET
Output Low Voltage
RESET
Output High Voltage
RESET
Output Leakage
Current
POWER-FAIL COMPARATOR
PFI Input Threshold
PFI Hysteresis
PFI Input Current
PFO
Output Low Voltage
V
OL
V
OH
V
PFI
= 0V or V
CC
Output asserted
V
CC
>
2.1V, I
SINK
= 1.6mA
V
CC
>
1.2V, I
SINK
= 100µA
0.8 x
V
CC
1
4
0.3 x V
CC
0.7 x V
CC
20
1
V
CC
= 3.3V
100
120
165
-100
V
PFI
V
PFI
falling
1.185
1.235
1
+100
0.3
0.4
1.285
V
%
nA
V
t
RP
V
OL
V
OH
I
LKG
RESET
asserted
I
SINK
= 1.6mA, V
CC
≥
2.1V
I
SINK
= 100µA, V
CC
>
1.2V
0.8 x
V
CC
1
V
CC
falling at 10V/ms
140
4.50
4.25
3.00
2.85
2.55
2.25
4.63
4.38
3.08
2.93
2.63
2.32
25
280
0.3
0.4
4.75
4.50
3.15
3.00
2.70
2.38
µs
ms
V
V
µA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX160_ _L only (push-pull),
RESET
not
asserted, I
SOURCE
= 500µA, V
CC
>
V
TH(MAX)
MAX160_ _P only (open drain), not asserted
PFO
Output High Voltage
PFO
Leakage Current
PFO
Delay Time
MAX160_ _L only (push-pull), V
CC
>
V
TH(MAX),
I
SOURCE
= 500µA, output not
asserted
MAX160_ _P only (open drain), V
PFO
= 5.5V,
not asserted
V
PFI
+ 100mV to V
PFI
- 100mV
V
µA
µs
MANUAL RESET (MAX16033/MAX16037)
MR
Input Voltage
Pullup Resistance to V
CC
Minimum Pulse Width
Glitch Immunity
MR
to Reset Delay
V
IL
V
IH
V
kΩ
µs
ns
ns
www.maximintegrated.com
Maxim Integrated
│
3
MAX16033–MAX16040
Low-Power Battery-Backup
Circuits in Small μDFN Packages
Electrical Characteristics (continued)
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Watchdog Timeout Period
Minimum WDI Input Pulse Width
WDI Input Voltage
WDI Input Current
BATTON (MAX16035/MAX16039)
Output Voltage
Output Short-Circuit Current
RESETIN (MAX16036/MAX16040)
RESETIN Threshold
RESETIN Input Current
RESETIN to Reset Delay
CEIN
Leakage Current
CEIN
to
CEOUT
Resistance
CEOUT
Short-Circuit Current
CEIN
to
CEOUT
Propagation
Delay (Note 4)
CEOUT
Output-Voltage High
RESET
to
CEOUT
Delay
Note
Note
Note
Note
1:
2:
3:
4:
(V
RTH
+ 100mV) to (V
RTH
- 100mV)
RESET
asserted
RESET
not asserted, V
CC
= V
TH(MAX),
V
CEIN
= V
CC
/2, I
SINK
= 10mA
RESET
asserted, V
CEOUT
= 0V
50Ω source impedance driver, V
CC
= 4.75V
C
LOAD
= 50pF
V
CC
= 3.15V
V
CC
= 5V, V
CC
>
V
BATT
, I
SOURCE
= 100µA
V
CC
= 0V, V
BATT
>
2.2V, I
SOURCE
= 1µA
0.7 x V
CC
V
BATT
- 0.1
1
1
1.5
2
CHIP-ENABLE GATING (MAX16033–MAX16036)
±1
100
2.0
7
9
µA
Ω
mA
ns
V
µs
V
RTH
1.185
1.235
0.01
1.5
1.285
25
V
nA
µs
V
OL
I
SINK
= 3.2mA, V
BATT
= 2.1V
Sink current, V
CC
= 5V
Source current, V
BATT
>
2V
10
60
30
120
0.4
V
mA
µA
SYMBOL
t
WD
t
WDI
V
IL
V
IH
0.7 x V
CC
-1.0
+1.0
(Note 4)
CONDITIONS
MIN
1.00
100
0.3 x V
CC
TYP
1.65
MAX
2.25
UNITS
s
ns
V
µA
WATCHDOG (MAX16034/MAX16038)
All devices are 100% production tested at T
A
= +25°C. All overtemperature limits are guaranteed by design.
ABI Research最近评选并公布了全球超高频无源和高频无源 RFID芯片的前十大制造商。 前十大超高频无源芯片制造商是： 前十大高频无源芯片制造商是： 超高频的得奖名单并不出人意外，因为实际上似乎总是前三家公司获得大订单。ABI分析家 Mike Liard称，ABI很容易就评选出 Alien、Avery,和 Raflatac为全球...[详细]
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