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MRC1/21001000G13LF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 100ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小241KB,共2页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
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MRC1/21001000G13LF概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 100ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

MRC1/21001000G13LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid2124906299
包装说明MELF, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
构造MELF
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装直径1.6 mm
封装长度3.25 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 13 Inch
额定功率耗散 (P)0.5 W
额定温度70 °C
电阻100 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形状WRAPAROUND
容差2%
工作电压200 V

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Resistors
Metal Glaze™ High Power Density
Surface Mount Power Resistor
MRC Series
Metal Glaze High
Power
Density
MRC Series
Surface
Mount
Power
Resistor
TM
1/2 watt in 1/8 watt package
MRC1/2: 0.05 Ω to 1.0 Ω (contact factory for higher values)
1/2
watt
in 1/8
watt
package
150°C maximum operating temperature
1
watt
in 1/2
watt
package (2010
footprint)
Superior surge handling capability
MRC1/2:
0.05
to 1.0
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
OBSOLETE
Electrical Data
Size
Industry
Code
1
Footprint
IRC
Type
(contact
factory for
higher
values)
RoHS compliant Versions available
150°C maximum operating temperature
Superior surge handling capability
High temperature
dielectric coating
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
60/40 Solder
over
nickel barrier
Max.
Power Rating
Working
Voltage
2
Max.
Resistance
TCR
Tolerance
Voltage Range (ohms)
3
(ppm/°C)
3
(±%)
3
0.1 to 0.99
1,2,5
1,2,5
0.25, 0.5
100
50,100
50,100
Product
Catagory
Low
Range
Standard
Tight
Tolerance
C
1206
MRC1/2
1/2W @ 70°C
200
400
1.0 to 10K
20 to 10K
MRC Applications:
The
MRC1/2
will dissipate
1/2 watt at
70°C on
a
1206
footprint.
The
MRC
is recommended
for
applications where
board
real estate
is
a
major concern. Due
to
high power density and superior
surge
handling capability, it is
also
recommended
as a
direct replacement on
existing
board designs where standard 1206 resistors are marginal or
failing.
Environmental
Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specifi
ed
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
Test Method
MIL-R-55342E
Par
4.7.9 (-55°C + 125°C)
MIL-R-55342E
Par
4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E
Par
4.7.4 (-65°C @
working voltage)
MIL-R-55342E
Par
4.7.5
2.5 x
PxR
for
5 seconds
MIL-R-55342E
Par
4.7.6 (+150°C
for
100 hours)
MIL-R-55342E
Par
4.7.7
(Refl
ow
soldered to board at 260°C
for
10 seconds)
MIL-STD-202, Method 208 (245°C
for
5 seconds)
MIL-R-55342E
Par
4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E
Par
4.7.10 (2000 hours @ 70°C intermittent)
1200
gram
push from underside of mounted chip
for
60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to
exert
pull on chip contacts
for
10 seconds
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
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