RP300x Series
0.8% Accuracy, Voltage Detector with Delay Function
NO.EA-306-160309
OUTLINE
The RP300x is a CMOS-based voltage detector (VD) IC with a built-in output delay circuit. Internally, a single
IC consists of a voltage reference unit, a comparator, a resistor net for setting detector threshold, a manual
reset circuit, an output delay circuit and an output driver transistor.
The RP300x is available in internally fixed detector threshold type. When the V
DD
voltage becomes lower than
the preset voltage, the RP300xxxxA/C generates a “L” reset signal and the RP300xxxxB (custom IC
*1
)
generates a “H” reset signal. The detector threshold accuracy is as high as ±1.0% when −V
SET*2
< 1.7 V and
±0.8% when 1.7 V ≤ −V
SET
.
The reset output signal remains asserted for 50 ms, 100 ms (custom IC) or 200 ms after the V
DD
voltage rises
above the threshold voltage or when manual reset is canceled. The RP300x is designed to ignore fast
transients on the V
DD
pin. The output delay time accuracy is as high as ±5.0%.
The RP300x is available in an Nch open drain output type or in a CMOS output type.
The RP300x is offered in an ultra-small DFN(PLP)1010-4B package or in a SOT-23-5 package.
*1
*2
For more information about a custom IC, please contact our sales representatives.
−V
SET
is defined as a preset detector threshold.
FEATURES
•
•
•
•
•
•
•
•
•
•
Supply Current ··············································· Typ. 0.95
µA
(−V
SET
= 3.08 V, V
DD
= 3.18 V)
Operating Voltage Range ·································· 0.72 V to 5.50 V (25°C)
Detector Threshold Range ································ 1.1 V, 2.32 V, 2.63 V, 2.7 V, 2.8 V, 2.93 V, 3.08 V, 3.4 V (34),
4.38 V (43), 4.6 V (46)
Detector Threshold Accuracy ·····························
±1.0%
(−V
SET
< 1.7 V),
±0.8%
(1.7 V ≤ −V
SET
)
Detector Threshold Temperature Coefficient ·········· Typ.
±50
ppm/°C
Released Output Delay Time ····························· Typ. 50 ms, 100 ms (custom IC), 200 ms
Released Output Delay Time Accuracy ················
±5%
(25°C),
±15%
(−40°C to 85°C)
Package ························································ DFN(PLP)1010-4B, SOT-23-5
Output Type ··················································· Nch Open Drain output, CMOS Output
Reset Signal ·················································· Active-low, Active-high (custom IC)
APPLICATIONS
•
•
Voltage monitoring for handheld communication equipment, camera and VCRs.
Voltage monitoring for battery-powered equipment
1
RP300x
NO.EA-306-160309
BLOCK DIAGRAMS
Figure 1. RP300xxxxA/B (Nch Open Drain Output)
Figure 2. RP300xxxxC (CMOS Output)
SELECTION GUIDE
With the RP300x, the detector threshold, the package type, the released output delay time and the output type
are user-selectable options.
Product Name
RP300Kxxy∗(z)-TR
RP300Nxxy∗(z)-TR-FE
Package
DFN(PLP)1010-4B
SOT-23-5
Quantity per Reel
10,000 pcs
3,000 pcs
Pb Free
Yes
Yes
Halogen Free
Yes
Yes
xx: Specify −V
SET
from 1.1 V (11), 2.32 V (23), 2.63 V (26), 2.7 V (27), 2.8 V (28), 2.93 V (29),
3.08 V (30), 3.4 V (34), 4.38 V (43), 4.6 V (46).
z: If −V
SET
includes the 3
rd
digit, indicate the digit of 0.01 V.
Ex. If −V
SET
is 2.63 V, indicate as RP300x26xx3-TR-x.
y: Specify the released output delay time.
(A) 50 ms
(B) 100 ms (custom IC)
(D) 200 ms
∗:
Specify the output type.
(A) Nch Open Drain Output
(B) Nch Open Drain Inverting Output (custom IC)
(C) CMOS Output
2
RP300x
NO.EA-306-160309
PIN CONFIGULATIONS
•
DFN(PLP)1010-4B
4
3
3
4
•
SOT- 23-5
5
4
(mark side)
1
2
2
1
1
2
3
Figure 3. Top View
Figure 4. Bottom View
Figure 5. Mark Side
PIN DESCRIPTION
RP300K: DFN(PLP)1010-4B
Pin No.
Symbol
Pin Description
Output Pin
RP300xxxxA/C: asserts an active-low reset signal when a
voltage drops below the detector threshold.
RP300xxxxB: asserts an active-high reset signal when a
voltage drops below the detector threshold. (custom IC)
Manual Reset Input Pin: active-low
Ground Pin
Input Pin
1
OUT
2
3
4
MR
GND
V
DD
The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substarate
level). It is recommended that the tab be connected to the ground plane on the board. If not, the tab can be left open.
RP300N: SOT-23-5
Pin No.
1
2
3
Symbol
MR
GND
NC
Description
Manual Reset Input Pin: active-low
Ground Pin
No Connection
Output Pin
RP300xxxxA/C: asserts an active-low reset signal when a
voltage drops below the detector threshold.
RP300xxxxB: asserts an active-high reset signal when a
voltage drops below the detector threshold. (custom IC)
Input Pin
4
OUT
5
V
DD
3
RP300x
NO.EA-306-160309
ABSOLUTE MAXIMUM RATINGS
Symbol
V
IN
OUT
MR
I
OUT
P
D
Ta
Tstg
*3
Item
Input Voltage
Output Voltage (Nch Open Drain Output)
Output Voltage (CMOS Output)
Manual Reset Pin
Output Current
Power Dissipation (Standard Land Pattern)
*3
Operating Temperature Range
Storage Temperature Range
Rating
6.0
−0.3 to 6.0
−0.3 to V
DD
+0.3
−0.3 to V
DD
+0.3
20
DFN(PLP)1010-4B
SOT-23-5
−40 to +85
−55 to +125
400
420
Unit
V
V
V
mA
mW
°C
°C
Refer to the next page for detailed information about Power Dissipation.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the life time and safety for both device and system using the device in the field. The
functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
4
RP300x
NO.EA-306-160309
POWER DISSIPATION (DFN(PLP)1010-4B)
Power Dissipation (P
D
) of the package is dependent on PCB material, layout, and environmental
conditions. The following conditions are used in this measurement.
Measurement Conditions
Standard Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Result:
Power Dissipation
Thermal Resistance
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Double-sided)
40 mm x 40 mm x 1.6 mm
Top side: Approx. 50%, Back side: Approx. 50%
φ
0.54 mm x 24 pcs
(Ta = 25°C, Tjmax = 125°C)
Standard Land Pattern
400 mW
θja
= (125 −25°C) / 0.4 W = 250°C/W
θjc
= 67°C/W
600
Power Dissipation P
D
(mW)
40
500
400
On Board
200
100
0
0
25
50
75 85 100
125
150
40
Ambient Temperature (°C)
300
Measurement Board Pattern
IC Mount Area (Unit : mm)
Power Dissipation
5
FPGA/CPLD
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