This document was generated on 05/26/2011
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
0512484799
Active
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tape and Reel Package, 0.25µm
(10µ") Gold (Au) Plating, Lead Free
Documents:
3D Model
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
General
Product Family
Series
Comments
Component Type
Product Name
Processor Sockets
51248
ZIF, with Pick and Place Cover
Socket
Micro PGA
image - Reference only
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Low-Halogen Status
Low-Halogen
China RoHS
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Packaging Type
Pitch - Mating Interface
Plating min - Mating
Plating min - Termination
Temperature Range - Operating
Termination Interface: Style
479
479
Black, Natural
50
Copper-Nickel-Silicon, Stainless Steel
Gold
Nickel
High Temperature Thermoplastic
Embossed Tape on Reel
1.27mm (.050")
0.254µm (10µ")
1.270µm (50µ")
-20°C to +90°C
Surface Mount
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Electrical
Current - Maximum per Contact
Voltage - Maximum
0.5A
100V
Search Parts in this Series
51248Series
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
10
Reflow Capable (SMT only)
1
250
Material Info
* Pentium and Celeron are registered trademark of Intel Corporation
This document was generated on 05/26/2011
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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