REVISIONS
LTR
A
B
DESCRIPTION
Added case outlines M, N, 4, and 5.
Figure 1; For the case outlines 4 and 5 changed dimension D3 min
and max from 1.030 and 1.040 inches to 1.020 and 1.060 inches.
Changed dimension A min from .156 inches to .135 inches. Changed
dimension L min from .145 inches to .132 inches. -sld
Update drawing to the latest requirements. -sld
DATE (YR-MO-DA)
96-10-15
98-07-08
APPROVED
K. A. Cottongim
K. A. Cottongim
C
06-06-30
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
C
15
C
16
C
17
C
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
C
19
C
20
C
21
C
1
C
22
C
2
C
23
C
3
C
24
C
4
C
25
C
5
C
26
C
6
C
27
C
7
C
28
C
8
C
29
C
9
C
30
C
10
C
11
C
12
C
13
C
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, DIGITAL, FLASH,
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 128K x 32-BIT
DRAWING APPROVAL DATE
95-01-31
REVISION LEVEL
C
SIZE
A
SHEET
CAGE CODE
67268
1 OF
30
5962-94610
DSCC FORM 2233
APR 97
5962-E417-06
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
⏐
⏐
⏐
Federal
stock class
designator
\
-
⏐
⏐
⏐
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
WF128K32-200HQ
WF128K32-150HQ
WF128K32-120HQ
Circuit function
FLASH EPROM, 128K X 32-bit
FLASH EPROM, 128K X 32-bit
FLASH EPROM, 128K X 32-bit
Access Time
200 ns
150 ns
120 ns
94610
01
⏐
⏐
⏐
Device
type
(see 1.2.2)
/
H
⏐
⏐
⏐
Device
class
designator
(see 1.2.3)
X
⏐
⏐
⏐
Case
outline
(see 1.2.4)
X
⏐
⏐
⏐
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-94610
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
M
N
W
X
Y
Z
4
5
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
66
66
66
66
66
66
Package style
Ceramic, single/dual cavity, quad pack, lead formed
Ceramic, single cavity, quad flat pack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) 2/ ....................................................
Signal Voltage range (any pin except A9) 2/ ..............................
Power dissipation (P
D
) ...............................................................
Storage temperature range........................................................
Lead temperature (soldering, 10 seconds).................................
Thermal resistance junction-to-case (θ
JC
):
Case outlines W, X, Y, Z, 4, and 5 .........................................
Case outline M .......................................................................
Case outline N........................................................................
Data retention ............................................................................
Endurance (write/erase cycles)..................................................
V
PP
supply voltage (with respect to ground) 3/ ..........................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ........................................................
Input low voltage range (V
IL
) ......................................................
Input high voltage range (V
IH
) ....................................................
V
PP
high voltage (V
PPH
) ..............................................................
V
PP
low voltage (V
PPL
) ................................................................
Case operating temperature range (T
C
) .....................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.3 V dc
+11.4 V dc to +12.6 V dc
0 V dc to 6.5 V dc
-55°C to +125°C
-2.0 V dc to +7.0 V dc
-2.0 V dc to +7.0 V dc
2.2 W
-65°C to +150°C
+300
°C
7.8°C/W
11.3°C/W
1.7°C/W
10 years minimum
10,000 cycles minimum
-2.0 V dc to +14.0 V dc
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum DC voltage on input or I/O pins is -0.5 V dc. During voltage transitions, inputs may undershoot GND to -2.0 V dc
for periods of up to 20 ns. Maximum DC voltage on output and I/O pins is V
CC
+ 0.5 V dc. During voltage transitions,
outputs may overshoot to V
CC
+ 2.0 V dc for periods up to 20 ns.
3/ Minimum DC input voltage on A9 pin is -0.5 V dc. During voltage transitions, A9 may undershoot GND to -2.0 V dc for
periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V dc which may overshoot to +14.0 V dc for periods up to
20 ns.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-94610
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4, 5, and 6.
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-94610
SHEET
4
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be
available on request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendors's reliability monitor. The
reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendors procedure
shall be kept under document control and shall be made available upon request of the acquiring of preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-94610
SHEET
5
DSCC FORM 2234
APR 97
微控制器 MCU
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