The PS2401 is an AC Solid State Switch using optical
coupling with dual power SCR outputs to produce an
alternative to optocoupler and Triac circuits. The
PS2401 switches are robust enough to provide a
blocking voltage of up to 500V
P
and max surge
current rating of 20A. In addition, tightly controlled
zero-cross circuitry ensures switching of AC loads
without the generation of transients. The input and
output circuits are optically coupled to provide
3750V
rms
of isolation and noise immunity between
control and load circuits. As a result the PS2401
is well suited for industrial environments where
electromagnetic interference would disrupt the
operation of electromechanical relays.
Approvals
•
UL Recognized Component: UL 508 File E69938
•
CSA Certified Component: File 043639
Ordering Information
Part #
PS2401
Description
4-Pin (8-Pin Body) SIP Package (25/Tube)
Features
•
Load Current up to 1A
rms
(3A
rms
with heat sink)
•
Blocking Voltages up to 500V
P
•
5mA Sensitivity
•
Zero-Crossing Detection
•
DC Control, AC Output
•
Optically Isolated
•
TTL and CMOS Compatible
•
Low EMI and RFI Generation
•
High Noise Immunity
•
VDE compatible
•
Machine Insertable, Wave Solderable
Applications
•
Programmable Control
•
Process Control
•
Power Control Panels
•
Remote Switching
•
Gas Pump Electronics
•
Contactors
•
Large Relays
•
Solenoids
•
Motors
•
Heaters
Pin Configuration
ZC
1
2
– LED + LED
6
8
AC Load AC Load
DS-PS2401-R14
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PS2401
Min
-
-
-
-
-
-
3750
-40
-40
Max
500
5
100
1
150
1600
-
+85
+125
Units
V
P
V
mA
A
mW
mW
V
rms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 16.6 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
AC Operating Voltage
Load Current (Continuous)
Maximum Surge Current
Off-State Leakage Current
On-State Voltage Drop
Critical Rate of Rise
Switching Speeds
Turn-On
Turn-Off
Zero-Cross Turn-On Voltage
1
Operating Frequency
Load Power Factor for Guaranteed Turn-On
2
Capacitance Input-To-Output
Input Characteristics
Input Control Current
For Normal Environment
For High Noise Environment
Input Voltage Drop
Input Dropout Voltage
Reverse Input Current
1
2
Conditions
I
F
=5mA
V
L
=120-240VAC
t<16ms
V
L
=500V
DC
I
L
=1A
rms
-
Symbol
V
OP
I
L
I
PEAK
I
LEAK
-
dV/dt
t
on
t
off
-
-
PF
C
I/O
Min
20
0.005
-
-
-
1000
-
-
-
-
20
0.25
-
Typ
-
-
-
-
-
1200
-
-
2
-
-
-
3
Max
240
1
20
1
1.2
-
0.5
0.5
5
1
500
-
-
Units
V
rms
A
rms
A
mA
V
rms
V/µs
I
F
=5mA
1
st
half-cycle
Subsequent half-cycle
-
-
-
Cycles
V
V
Hz
-
pF
-
-
I
F
=5mA
-
V
R
=5V
I
F
V
F
-
I
R
-
-
0.9
0.8
-
-
-
1.2
-
-
5
10
1.4
-
10
mA
V
V
µA
Zero Cross 1
st
half-cycle @ < 100Hz.
Snubber circuits may be required at low power factors.
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PERFORMANCE DATA*
Load Current
Free Air
1.2
Load Current (A
rms
)
Load Current (A
rms
)
1.0
0.8
4
Peak Surge Current (A)
PS with Thermal Clip attached
to 3ºC/W heat sink
3
PS2401
Load Current
Heat Sink
25
20
15
10
5
0
-40
0
55
85
16
Ambient Temperature (ºC)
Max. Surge Current
Non-Repetitive
NOTE: Values apply to
T
J
=50ºC before Surge
R
JA
=60ºC/W
0.6
0.4
0.2
0
-40
0
55
85
Ambient Temperature (ºC)
2
PS with Thermal Clip freestanding
1
0
50
Pulse Duration (ms)
100
Typical Forward Voltage
vs. Temperature
1.3
Critical Rate of Rise (V/µs)
Forward Voltage (V)
1400
1200
1000
800
600
400
200
0
0
10
25
40
55
70
Ambient Temperature (ºC)
85
0
Typical dV/dt
vs. Temperature
Vo
dV/dt Method
1.2
1.1
63%
Vo = 300V
dV 0.63 x 300V 189
=
=
dt
RC
RC
In accordance with
EIA/NARM Standards
RS-443 for Solid State Relays
RC
1.0
10%
25
50
Ambient Temperature (ºC)
85
0.9
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
PS2401
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PS2401
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PS2401
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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Mechanical Dimensions
PS2401
19.202 ± 0.381
(0.756 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
5.944 ± 0.127
(0.234 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
1.30
(0.051)
PS2401
PCB Hole Pattern
0.800 DIA. x4
(0.031 DIA. x4)
Pin 1
Pin 8
2.642 ± 0.127
(0.104 ± 0.005)
0.711 ± 0.102
(0.028 ± 0.004)
5.08 ± 0.127
(0.200 ± 0.005)
10.160 ± 0.127
(0.400 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
5.080
(0.200)
10.160
(0.400)
2.540
(0.100)
0.457 ± 0.076
(0.018 ± 0.003)
0.254 ± 0.013
(0.010 ± 0.0005)
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.