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W3EG7218S-AD4: 产品描述128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL; 文件大小166KB，共13页; 制造商White Electronic Designs Corporation; 官网地址http://www.wedc.com/

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W3EG7218S-AD4概述

128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL

W3EG7218S-AD4相似产品对比

	W3EG7218S-AD4	W3EG7218S202BD4	W3EG7218S262BD4	W3EG7218S265BD4	W3EG7218S262AD4	W3EG7218S-BD4	W3EG7218S202AD4
描述	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL	128MB - 16Mx72 DDR SDRAM UNBUFFERED w/PLL
是否Rohs认证	-	不符合	不符合	不符合	不符合	-	不符合
厂商名称	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	-	White Electronic Designs Corporation
包装说明	-	DIMM,	DIMM,	DIMM,	DIMM,	-	DIMM,
Reach Compliance Code	-	unknow	unknow	unknow	unknow	-	unknow
访问模式	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
最长访问时间	-	0.75 ns	0.75 ns	0.75 ns	0.75 ns	-	0.75 ns
其他特性	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
JESD-30 代码	-	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200	-	R-XDMA-N200
内存密度	-	1207959552 bi	1207959552 bi	1207959552 bi	1207959552 bi	-	1207959552 bi
内存集成电路类型	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	-	DDR DRAM MODULE
内存宽度	-	72	72	72	72	-	72
功能数量	-	1	1	1	1	-	1
端口数量	-	1	1	1	1	-	1
端子数量	-	200	200	200	200	-	200
字数	-	16777216 words	16777216 words	16777216 words	16777216 words	-	16777216 words
字数代码	-	16000000	16000000	16000000	16000000	-	16000000
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
最高工作温度	-	70 °C	70 °C	70 °C	70 °C	-	70 °C
组织	-	16MX72	16MX72	16MX72	16MX72	-	16MX72
封装主体材料	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED
封装代码	-	DIMM	DIMM	DIMM	DIMM	-	DIMM
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
自我刷新	-	YES	YES	YES	YES	-	YES
最大供电电压 (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V
最小供电电压 (Vsup)	-	2.3 V	2.3 V	2.3 V	2.3 V	-	2.3 V
标称供电电压 (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V
表面贴装	-	NO	NO	NO	NO	-	NO
技术	-	CMOS	CMOS	CMOS	CMOS	-	CMOS
温度等级	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
端子形式	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD
端子位置	-	DUAL	DUAL	DUAL	DUAL	-	DUAL
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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