minimum current transfer ratio (CTR) of 300% with a
maximum value of 30,000%.
Approvals
Features
•
•
•
•
•
•
100mA Continuous Load Rating
3750V
rms
Input/Output Isolation
Unidirectional Input
Small 6-Pin Package, Thru-Hole or Surface Mount
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Packaging Available
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part Number
LDA111
LDA111S
LDA111STR
Description
6-Pin DIP (50/tube)
6-Pin Surface Mount (50/tube)
6-Pin Surface Mount (1000/Reel)
Applications
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
Pin Configuration
A
K
1
2
3
6
5
4
B
C
E
Pb
DS-LDA111-R06
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Power Dissipation
Input Power Dissipation
1
Phototransistor
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LDA111
Ratings
30
5
100
1
150
150
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
mW
V
rms
°C
°C
Derate linearly 1.33mW / °C
Derate linearly 2mW / °C
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
I
C
= 100µA
V
CEO
= 5V, I
F
= 0mA
I
C
= 3mA, I
F
= 1mA
I
F
= 1mA, V
CE
= 2V
25V, f =1MHz
I
C
= 3mA, V
CE
= 2V
I
F
= 5mA
V
R
= 5V
-
Symbol
BV
CEO
I
CEO
V
CE(sat)
CTR
C
OUT
I
F
V
F
I
R
C
I/O
Min
30
-
-
300
-
-
0.9
-
-
Typ
85
50
-
8500
3
0.07
1.2
-
3
Max
-
500
1
30000
-
1
1.4
10
-
Units
V
nA
V
%
pF
mA
V
µA
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Turn-Off Time
Symbol
t
on
t
off
Test Condition
V
CC
=5V, I
F
=1mA, R
L
=500
Typ
8
345
Units
s
Switching Time Test Circuit
V
CC
R
L
I
F
V
CE
90%
10%
t
on
t
off
Pulse Width=5ms
Duty Cycle=1%
I
F
V
CE
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Voltage vs. Current
50
LED Forward Current (mA)
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
100
LED Forward Current (mA)
LED Forward Voltage (V)
LDA111
LED Voltage vs. Current (Log)
1.6
1.5
1.4
1.3
1.2
1.1
LED Forward Voltage vs. Temperature
I
F
=50mA
I
F
=20mA
I
F
=10mA
10
1
0.1
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
1.0
-40
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
20000
Typical CTR vs. LED Forward Current
(V
CE
=5V)
-40ºC
Collector Current I
C
(mA)
Typical Collector Current
vs. Collector Voltage
250
200
150
100
50
0
I
F
=2mA
I
F
=1mA
I
F
=0.5mA
0
1
2
3
4
Collector Voltage V
CE
(V)
5
6
I
F
=20mA
I
F
=10mA
I
F
=5mA
250
200
I
CE
Current (mA)
150
100
50
0
-40
I
CE
Current vs. Temperature
(V
CE
=5V)
I
F
=10mA
I
F
=5mA
I
F
=2mA
I
F
=1mA
15000
CTR (%)
25ºC
10000
85ºC
5000
I
F
=0.2mA
I
F
=0.1mA
I
F
=0.5mA
0
0
2
4
6
8
LED Forward Current (mA)
10
-20
0
20
40
60
Temperature (ºC)
80
100
0.95
0.90
V
CE(sat)
vs. Temperature
(I
F
=1mA, I
C
=3mA)
Leakage Current vs. Temperature
1400
1200
Leakage (nA)
1000
800
600
400
200
V
CC
=10V
V
CC
=5V
V
CC
=3V
V
CE(sat)
(V)
0.85
0.80
0.75
0.70
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
8.0
7.9
7.8
7.7
7.6
7.5
7.4
7.3
7.2
7.1
7.0
6.9
6.8
1x10
2
Turn-On Time vs. Load Resistance
(I
F
=1mA, V
CC
=5V)
15000
Turn-Off Time ( s)
Turn-Off Time vs. Load Resistance
(I
F
=1mA, V
CC
=5V)
Turn-On Time ( s)
10000
5000
1x10
3
1x10
4
Load Resistance ( )
1x10
5
0
1x10
2
1x10
3
1x10
4
Load Resistance ( )
1x10
5
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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Manufacturing Information
Moisture Sensitivity
LDA111
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LDA111 / LDA111S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LDA111 / LDA111S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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