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HMMC-3108-BLK

产品描述3108 SERIES, PRESCALER, PDSO8
产品类别逻辑    逻辑   
文件大小781KB,共8页
制造商HP(Keysight)
官网地址http://www.semiconductor.agilent.com/
下载文档 详细参数 选型对比 全文预览

HMMC-3108-BLK概述

3108 SERIES, PRESCALER, PDSO8

3108 系列, 分频器, PDSO8

HMMC-3108-BLK规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称HP(Keysight)
零件包装代码SOIC
包装说明SOP, SOP8,.25
针数8
Reach Compliance Codeunknown
其他特性CAN ALSO BE OPERATED WITH VEE = -4.5 V TO -6.5 V
系列3108
JESD-30 代码R-PDSO-G8
JESD-609代码e0
长度4.9 mm
逻辑集成电路类型PRESCALER
最大频率@ Nom-Sup16000000000 Hz
数据/时钟输入次数1
功能数量1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
最大电源电流(ICC)99 mA
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)6.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术GAAS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.9 mm
最小 fmax16000 MHz
Base Number Matches1

HMMC-3108-BLK文档预览

Agilent HMMC-3108
DC-16 GHz Packaged Divide-by-8
Prescaler
HMMC-3108-TR1 - 7” diameter reel/500 each
HMMC-3108-BLK - Bubble strip/10 each
Data Sheet
Description
The HMMC-3108 is a packaged
GaAs HBT MMIC prescaler
which offers dc to 16 GHz
frequency translation for use in
communications and EW
systems incorporating high–
frequency PLL oscillator circuits
and signal–path down
conversion applications. The
prescaler provides a large input
power sensitivity window and
low phase noise.
Package Type: SOIC-8 Plastic
Package Dimensions: 4.9 x 3.9 mm typ
Package Thickness: 1.55 mm typ
Lead Pitch: 1.25 mm nom
Lead Width: 0.42 mm nom
Absolute Maximum Ratings
1
(@ T = +25 °C, unless otherwise stated)
A
Features
• Wide Frequency Range:
0.2–16 GHz
• High Input Power Sensitivity:
On–chip pre– and post–amps
-20 to +10 dBm (1–10 GHz)
-15 to +10 dBm (10–12 GHz)
-10 to +5 dBm (12–15 GHz)
• P
out
: +6 dBm (0.99 V
p-p
) will drive
ECL
• Low Phase Noise:
-153 dBc/Hz @ 100 kHz Offset
(+) or (-) Single Supply Bias with
wide range:
4.5 to 6.5 V
• Differential I/0 with on–chip
50W matching
W
Min
Max
+7
-7
+7
V
CC
- 1.5
V
CC
-1.2
+10
V
CC
±0.5
-40
-65
+85
+165
310
Symbol
V
CC
V
EE
|V
CC
- V
EE
|
V
Logic
P
in(CW)
V
RFin
T
BS2
T
st
T
max
Parameters/Conditions
Bias Supply Voltage
Bias Supply Voltage
Bias Supply Delta
Logic Threshold Voltage
CW RF Input Power
DC Input Voltage (@ RFin or RF
in
Ports)
Backside Operating Temperature
Storage Temperature
Maximum Assembly Temperature (60 seconds max)
Units
volts
volts
volts
volts
dBm
volts
°C
°C
°C
Notes:
1. Operation in excess of any parameter limit (except T
BS
) may cause permanent damage to the device.
2. MTTF >1 x 10
6
hours @ T
BS
<85°C. Operation in excess of maximum operating temperature (T
BS
) will degrade MTTF.
DC Specifications/Physical Properties
(T
A
= +25 °C, V
CC
- V
EE
= 5.0 volts, unless otherwise listed)
Symbol
V
CC
- V
EE
|I
CC
| or |I
EE
|
V
RFin(q)
V
RFout(q)
V
Logic
Parameters/Conditions
Operating bias supply difference
1
Bias supply current
Quiescent dc voltage appearing at all RF ports
Min
4.5
73
Typ
5.0
86
V
CC
Max
6.5
99
Units
volts
mA
volts
Nominal ECL Logic Level
(V
Logic
contact self-bias voltage, generated on-chip)
V
CC
-1.45
V
CC
-1.35
V
CC
-1.25
volts
Notes:
1. Prescaler will operate over full specified supply voltage range. V
CC
or V
EE
not to exceed limits specified in Absolute Maximum Ratings section.
2
RF Specifications
(T
A
= +25 °C, Z
0
= 50
W,
V
CC
- V
EE
= 5.0 volts)
Symbol
ƒ
in(max)
ƒ
in(min)
ƒ
Sel-Osc.
P
in
Parameters/Conditions
Maximum input frequency of operation
Minimum input frequency of operation
1
(P
in
= -10 dBm)
Output Self-Oscillation Frequency
2
@ dc, (Square-wave input)
@ ƒ
in
= 500 MHz, (Sine-wave input)
ƒ
in
= 1 to 8 GHz
ƒ
in
= 8 to 10 GHz
ƒ
in
= 10 to 12 GHz
Min
16
Typ
18
0.2
3.4
Max
Units
GHz
0.5
GHz
GHz
-15
-15
-15
-10
-4
>-25
>-20
>-25
>-15
>-10
15
30
-153
+10
+10
+10
+10
+4
dBm
dBm
dBm
dBm
dBm
dB
dB
dBc/Hz
RL
S
12
j
N
Small-Signal Input/Output Return Loss (@ ƒ
in
<10 GHz)
Small-Signal Reverse Isolation (@ ƒ
in
<10 GHz)
SSB Phase noise (@ P
in
= 0 dBm, 100 KHz offset from a ƒ
ou
t =
1.2 GHz Carrier)
Input signal time variation @ zero-crossing (ƒ
in
= 10 GHz, P
in
=
-10 dBm)
Output transition time (10% to 90% rise/fall time)
@ ƒ
out
< 1 GHz
@ ƒ
out
= 2.5 GHz
@ ƒ
out
= 3.0 GHz
4
3.5
0
Jitter
1
ps
T
r
or T
f
P
out3
70
6
5.5
2.0
0.99
0.94
0.63
-40
ps
dBm
dBm
dBm
volts
volts
volts
dBm
|V
out(p-p)
|
4
@ ƒ
out
< 1 GHz
@ ƒ
out
= 2.5 GHz
@ ƒ
out
= 3.0 GHz
P
Spitback
ƒ
out
power level appearing at RF
in
or RF
out
(@ ƒ
in
10 GHz,
Unused RF
out
or RF
out
unterminated)
ƒ
out
power level appearing at RF
in
or RF
out
(@ ƒ
in
10 GHz, Both
RF
out
or RF
out
unterminated)
-47
dBm
P
feedthru
H
2
Power level of ƒ
in
appearing at RF
out
or RF
out
(@ ƒ
in
= 12 GHz,
Pin = 0 dBm, Referred to P
in
in
))
Second harmonic distortion output level (@ ƒ
out
= 3.0 GHz,
Referred to P
out
out
))
-23
dBc
-25
dBc
Notes:
1. For sine–wave input signal. Prescaler will operate down to dc for square–wave input signal. Min. divide frequency limited by input slew rate.
2. Prescaler can exhibit this output signal under bias in the absence of an RF input signal. This condition can be eliminated by use of the Input dc offset
technique described on page 4.
3. Fundamental of output square wave’s Fourier Series.
4. Square wave amplitude calculated from P
out
.
3
Applications
The HMMC-3108 is designed for
use in high frequency
communications, microwave
instrumentation, and EW radar
systems where low phase–noise
PLL control circuitry or broad–
band frequency translation is
required.
Operation
The device is designed to
operate when driven with either
a single–ended or differential
sinusoidal input signal over a
200 MHz to 16 GHz bandwidth.
Below 200 MHz the prescaler
input is “slew–rate” limited,
requiring fast rising and falling
edge speeds to properly divide.
The device will operate at
frequencies down to dc when
driven with a square–wave.
Due to the presence of an off–
chip RF–bypass capacitor inside
the package (connected to the
V
CC
contact on the device), and
the unique design of the device
itself, the component may be
biased from either a single
positive or single negative
supply bias. The backside of the
package is not dc connected to
any dc bias point on the device.
For positive supply operation,
V
CC
pins are nominally biased at
any voltage in the +4.5 to +6.5
volt range with pin 8 (V
EE
)
grounded. For negative bias
operation V
CC
pins are typically
grounded and a negative voltage
between - 4.5 to - 6.5 volts is
applied to pin 8 (V
EE
).
ac–Coupling and dc–Blocking
All RF ports are dc connected
on–chip to the V
CC
contact
through on–chip 50W resistors.
Under any bias conditions where
V
C C
is not dc grounded the RF
ports should be ac coupled via
series capacitors mounted on
the PC– board at each RF port.
Only under bias conditions
where V
CC
is dc grounded (as is
typical for negative bias supply
operation) may the RF ports be
direct coupled to adjacent
circuitry or in some cases, such
as level shifting to subsequent
stages. In the latter case the
package heat sink may be
“floated” and bias applied as the
difference between V
CC
and V
EE
.
Input dc Offset
If an RF signal with sufficient
signal to noise ratio is present at
the RF input lead, the prescaler
will operate and provide a
divided output equal the input
frequency divided by the divide
modulus. Under certain “ideal”
conditions where the input is
well matched at the right input
frequency, the component may
“self–oscillate”, especially under
small signal input powers or
with only noise present at the
input. This “self–oscillation” will
produce an undesired output
signal also known as a false
trigger. To prevent false triggers
or self– oscillation conditions,
apply a 20 to 100 mV dc offset
voltage between the RFi n and
RFi n ports. This prevents noise
or spurious low level signals
from triggering the divider.
Adding a 10KW resistor between
the unused RF input to a contact
point at the VEE potential will
result in an offset of » 25mV
between the RF inputs. Note,
however, that the input
sensitivity will be reduced
slightly due to the presence of
this offset.
V
CC
6
V
CC
4
V
CC
2
150p
Vcc
By
poss
Vcc
Vcc
50
50
OUT
50
50
IN
IN
5
7
IN
÷
IN
Vee
Vpwr
sel
3
OUT
OUT
OUT
Pin 1
SOIC8 w/Backside GND
8
V
EE
Figure 1. Simplified Schematic
4
Assembly Notes
Independent of the bias applied
to the package, the backside of
the package should always be
connected to both a good RF
ground plane and a good
thermal heat sinking region on
the PC–board to optimize
performance. For single–ended
output operation the unused RF
output lead should be
terminated into 50W to a contact
point at the V
CC
potential or to
RF ground through a dc blocking
capacitor.
A minimum RF and thermal PC
board contact area equal to or
greater than 2.67 x 1.65 mm
(0.105" x 0.065") with eight
0.020" diameter plated–wall
thermal vias is recommended.
MMIC ESD precautions,
handling considerations, die
attach and bonding methods are
critical factors in successful
GaAs MMIC performance and
reliability.
Agilent application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines”
provides basic information on
these subjects.
Moisture Sensitivity
Classification: Class 1, per
JESD22-A112-A.
Additional References:
PN #18, “HBT Prescaler
Evaluation Board.”
Notes:
-
-
All dimensions in millimeters.
Refer to JEDEC Outline MS-012 for
additional tolerances.
Symbol
A
A1
B
C
D
E
e
H
L
Min
1.35
0.0
0.33
0.19
4.80
3.80
Max
1.75
.25
0.51
.025
5.00
4.00
1.27 BSC
5.80
0.40
6.20
1.27
Figure 2. Package & Dimensions
-
-
V
CC
6
a
Exposed heat slug area on pkg bottom =
2.67 x 1.65
Exposed heat sink on package bottom must
be soldered to PCB RF ground plane.
V
CC
4
V
CC
2
150p
V
cc
By
poss
V
cc
V
cc
50
50
OUT
50
50
IN
IN
5
7
IN
÷
IN
Vee
Vpwr
sel
3
OUT
OUT
OUT
Pin 1
SOIC8 w/Backside GND
8
V
EE
Figure 3. Assembly Diagram
(Single-supply, Positive-bias Configuration shown)
5

HMMC-3108-BLK相似产品对比

HMMC-3108-BLK HMMC-3108 HMMC-3108-TR1
描述 3108 SERIES, PRESCALER, PDSO8 3108 SERIES, PRESCALER, PDSO8 3108 SERIES, PRESCALER, PDSO8
是否Rohs认证 不符合 不符合 不符合
厂商名称 HP(Keysight) HP(Keysight) HP(Keysight)
零件包装代码 SOIC SOIC SOIC
包装说明 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25
针数 8 8 8
Reach Compliance Code unknown unknow unknown
其他特性 CAN ALSO BE OPERATED WITH VEE = -4.5 V TO -6.5 V CAN ALSO BE OPERATED WITH VEE = -4.5 V TO -6.5 V CAN ALSO BE OPERATED WITH VEE = -4.5 V TO -6.5 V
系列 3108 3108 3108
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
长度 4.9 mm 4.9 mm 4.9 mm
逻辑集成电路类型 PRESCALER PRESCALER PRESCALER
数据/时钟输入次数 1 1 1
功能数量 1 1 1
端子数量 8 8 8
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP
封装等效代码 SOP8,.25 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
电源 5 V 5 V 5 V
最大电源电流(ICC) 99 mA 92 mA 99 mA
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 1.75 mm 1.75 mm
最大供电电压 (Vsup) 6.5 V 6.5 V 6.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES YES YES
技术 GAAS GAAS GAAS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL
宽度 3.9 mm 3.9 mm 3.9 mm
最小 fmax 16000 MHz 16000 MHz 16000 MHz
Base Number Matches 1 1 1
JESD-609代码 e0 - e0
最大频率@ Nom-Sup 16000000000 Hz - 16000000000 Hz
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
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