HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x,
5962-88768 and 5962-88769
Hermetically Sealed Low IF, Wide VCC, Logic Gate Optocouplers
Data Sheet
Description
These units are single, dual and quad channel, hermeti-
cally sealed optocouplers. The products are capable of
operation and storage over the full military temperature
range and can be purchased as either standard product
or with full MIL-PRF-38534 Class Level H or K testing or
from the appropriate DLA Drawing. All devices are man-
ufactured and tested on a MIL-PRF-38534 certified line
and are included in the DLA Qualified Manufacturers List
QML-38534 for Hybrid Microcircuits.
Each channel contains an AlGaAs light emitting diode
which is optically coupled to an integrated high gain
photon detector. The detector has a threshold with hys-
teresis which provides differential mode noise immunity
and eliminates the potential for output signal chatter.
The detector in the single channel units has a tri-state
output stage which allows for direct connection to data
buses. The output is noninverting. The detector IC has
an internal shield that provides a guaranteed common
mode transient immunity of up to 10,000 V/μs. Improved
power supply rejection eliminates the need for special
power supply bypass precautions.
Features
Dual Marked with Device Part Number and DLA
Standard Microcircuit Drawing
Manufactured and Tested on a MIL-PRF-38534 Certi-
fied Line
QML-38534, Class H and K
Four Hermetically Sealed Package Configurations
Performance Guaranteed over -55°C to +125°C
Wide V
CC
Range (4.5 to 20 V)
350 ns Maximum Propagation Delay
CMR: > 10,000 V/μs Typical
1500 Vdc Withstand Test Voltage
Three State Output Available
High Radiation Immunity
HCPL-2200/31 Function Compatibility
Reliability Data Available
Compatible with LSTTL, TTL, and CMOS Logic
Applications
Military and Space
High Reliability Systems
Transportation and Life Critical Systems
High Speed Line Receiver
Isolated Bus Driver (Single Channel)
Pulse Transformer Replacement
Ground Loop Elimination
Harsh Industrial Environments
Computer-Peripheral Interfaces
Note: A 0.1
F
bypass capacitor must be connected between V
CC
and GND pins.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
Multiple Channel Devices Available
V
CC
V
O
Truth Tables
(Positive Logic)
Multichannel Devices
Input
On (H)
Output
H
L
V
E
Off (L)
GND
Package styles for these parts are 8 pin DIP through hole
(case outline P), 16 pin DIP flat pack (case outline F), and
leadless ceramic chip carrier (case outline 2). Devices
may be purchased with a variety of lead bend and plat-
ing options, see Selection Guide Table for details. Stan-
dard Microcircuit Drawing (SMD) parts are available for
each package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommend-
ed operating conditions, electrical specifications, and
performance characteristics shown in the figures are
identical for all parts. Occasional exceptions exist due
to package variations and limitations and are as noted.
Additionally, the same package assembly processes and
materials are used in all devices. These similarities give
justification for the use of data obtained from one part
to represent other part’s performance for die related reli-
ability and certain limited radiation test results.
Single Channel Devices
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
Z
Z
H
L
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15
1
2
3
4
V
CC
V
O
8
7
6
5
1
2
3
4
V
CC
V
O1
8
7
1
2
3
4
5
V
CC
V
O1
V
O2
V
O3
V
O4
GND
16
15
14
13
12
11
10
9
V
CC2
19
20
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
V
O2
V
E
GND
6
5
2
3
10
GND
6
7
8
Note: Multichannel DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip
carrier) package has isolated channels with separate V
CC
and ground connections.
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