TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
SURFACE MOUNT 130 kW
Transient Voltage Suppressor
- High Reliability controlled devices
- Bidirectional (CA) construction
- 275 V standoff voltages (V
WM
)
- Fast response
LEVELS
M, MA, MX, MXL
DEVICES
MPLAD130KP275CA and MPLAD130KP275CV, e3
FEATURES
High reliability controlled devices with wafer fabrication and assembly lot traceability
100 % surge tested devices
Low profile surface mount
Low package inductance
Available as either low clamp with “CV” suffix or normal clamping features with “CA” suffix
Optional up screening available by replacing the M prefix with MA, MX or MXL. These
prefixes specify
various screening and conformance inspection options based on MIL-PRF-19500.
Refer to
MicroNote 129
for more details on the screening options.
Suppresses transients up to 130 kW1 @ 6.4/69 µs
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current I
D
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 °C: 130,0001 watts @ 6.4/69 µs (also see Figure 1) with
impulse repetition rate (duty factor) of 0.05% or less
tclamping (0 volts to VBR min.): < 5 ns (theoretical)
Operating and Storage temperature: -55 °C to +150 °C
Thermal resistance: 0.5 °C/W junction to case or 50 °C/W junction to ambient when mounted
on FR4 PC board with recommended mounting pad (see page 2) and 1oz Cu
Steady-State Power dissipation: 250 watts at T
C
= 25 °C with good heat sink, or 2.5 watts at
T
A
= 25 °C if mounted on FR4 PC board as described for thermal resistance
Temperature Coefficient of voltage: 0.1 %/°C
Solder temperatures: 260 °C for 10 s (maximum)
MECHANICAL AND PACKAGING
Void-free transfer molded thermosetting epoxy body meeting UL94V-0
Tin-Lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating
readily solderable per MIL-STD-750, method 2026
Body marked with part number
No Cathode band for Bi-directional devices
Available in custom tape-and-reel or bulk packaging
TAPE-AND-REEL Standard per EIA-481-B (add “TR” suffix to part number)
Weight: 2.2 grams (approximately)
RF01020 Rev A, November 2010
High Reliability Product Group
Page 1 of 3
_____
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
______________________________________________________________________________________________________________________________
PACKAGE AND MOUNTING PAD DIMENSIONS Inches [mm]
SYMBOLS & DEFINITIONS
Symbol
V
WM
P
PP
V
BR
I
D
Definition
Working Peak (Standoff) Voltage
Peak Pulse Power
Breakdown Voltage
Standby Current
Symbol
I
PP
V
C
Definition
Peak Pulse Current
Clamping Voltage
Breakdown Current for V
BR
I
BR
ELECTRICAL CHARACTERISTICS @ 25
o
C
Description
Breakdown Voltage
Working Standoff Voltage
Standby Current
Peak Pulse Current 1
Clamping Voltage
PLAD130KP275CV
PLAD130KP275CA
V
C
Ic = I
PP
400
445
V
V
Symbol
V
BR
V
WM
I
D
I
PP
Conditions
I
BR
= 5mA
Min
300
Typ
Max
275
Unit
V
V
A
A
V
R
= V
WM
tr=6.4us, tp=69us
5
292
Note:
1) Also equivalent to 40 kW at a longer pulse of 10/1000 us with clamping voltages shown and Ipp = 90A
RF01020 Rev A, November 2010
High Reliability Product Group
Page 2 of 3
_____
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
______________________________________________________________________________________________________________________________
GRAPHS
Peak Pulse Power (P
PP
) or continuous
Power in Percent of 25
o
C Rating
T
L
Lead Temperature
o
C
FIGURE 2
Derating Curve
RF01020 Rev A, November 2010
High Reliability Product Group
Page 3 of 3
Microchip MCU
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