Double Buffered 12-Bit MDAC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DOUBLE WIDTH, CERAMIC, DIP-28 |
| Reach Compliance Code | unknown |
| 最大模拟输出电压 | 10 V |
| 最小模拟输出电压 | -10 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 35.56 mm |
| 最大线性误差 (EL) | 0.015% |
| 标称负供电电压 | -15 V |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 标称安定时间 (tstl) | 2 µs |
| 最大压摆率 | 2.5 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| HS3120C-2 | HS3120 | HS3120C-0 | HS3120B-2 | HS3120B-0 | |
|---|---|---|---|---|---|
| 描述 | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 包装说明 | DOUBLE WIDTH, CERAMIC, DIP-28 | - | DOUBLE WIDTH, CERAMIC, DIP-28 | DOUBLE WIDTH, CERAMIC, DIP-28 | DOUBLE WIDTH, CERAMIC, DIP-28 |
| Reach Compliance Code | unknown | - | unknow | unknow | unknown |
| 最大模拟输出电压 | 10 V | - | 10 V | 10 V | 10 V |
| 最小模拟输出电压 | -10 V | - | -10 V | -10 V | -10 V |
| 转换器类型 | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | - | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
| 输入格式 | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-T28 | - | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 长度 | 35.56 mm | - | 35.56 mm | 35.56 mm | 35.56 mm |
| 最大线性误差 (EL) | 0.015% | - | 0.05% | 0.015% | 0.05% |
| 标称负供电电压 | -15 V | - | -15 V | -15 V | -15 V |
| 位数 | 12 | - | 12 | 12 | 12 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 28 | - | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | - | 70 °C | 125 °C | 125 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | - | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | - | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 15 V | - | 15 V | 15 V | 15 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 标称安定时间 (tstl) | 2 µs | - | 2 µs | 2 µs | 2 µs |
| 最大压摆率 | 2.5 mA | - | 2.5 mA | 2.5 mA | 2.5 mA |
| 标称供电电压 | 15 V | - | 15 V | 15 V | 15 V |
| 表面贴装 | NO | - | NO | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | - | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 |
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