SIDC06D120F6
Fast switching diode chip in Emitter Controlled Technology
Features:
1200V technology 120 µm chip
soft, fast switching
low reverse recovery charge
small temperature coefficient
qualified according to JEDEC for target
applications
Recommended for:
power modules and discrete
devices
A
C
Applications:
SMPS, resonant applications,
drives
Chip Type
SIDC06D120F6
V
R
1200V
I
Fn
5A
Die Size
2.45 x 2.45 mm
2
Package
sawn on foil
Mechanical Parameters
Die size
Area total
Anode pad size
Thickness
Wafer size
Max. possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
for original and
sealed MBB bags
Storage environment
for open MBB bags
Acc. to IEC62258-3: Atmosphere >99% Nitrogen or inert gas,
Humidity <25%RH, Temperature 17°C – 25°C, < 6 month
2.45 x 2.45
6
1.73 x 1.73
120
150
2520
Photoimide
3200 nm AlSiCu
Ni Ag –system
Electrically conductive epoxy glue and soft solder
Al,
500µm
0.65mm; max 1.2mm
Ambient atmosphere air, Temperature 17°C – 25°C,
< 6 month
µm
mm
mm
2
Edited by INFINEON Technologies, IPC TD VLS, L4345M, Rev. 2.1, 14.05.2013
SIDC06D120F6
Maximum Ratings
Parameter
Repetitive peak reverse voltage
Continuous forward current
Maximum repetitive forward current²
Operating junction and storage
temperature
1)
2)
Symbol
V
RRM
I
F
)
Condition
T
vj
= 25 °C
T
vj
< 150°C
T
vj
< 150°C
Value
1200
1)
Unit
V
A
I
FRM
T
vj,
T
stg
10
-55...+150
C
depending on thermal properties of assembly
not subject to production test - verified by design/characterisation
Static Characteristics
(tested on wafer),
T
vj
= 25 °C
Parameter
Reverse leakage current
Cathode-Anode breakdown
Voltage
Forward voltage drop
Symbol
I
R
V
BR
V
F
Conditions
V
R
= 1 20 0 V
I
R
= 0. 25m A
I
F
=5A
1200
V
1.68
2.1
2.42
Value
min.
typ.
max.
20
Unit
µA
Electrical Characteristics
(not subject to production test - verified by design/characterization)
Parameter
Forward voltage
drop
T
vj
= 125°C
Symbol
V
F
Conditions
I
F
=5A
Value
min.
typ.
1.8
max.
Unit
V
Further Electrical Characteristics
Switching characteristics and thermal properties are depending strongly on module design and
mounting technology and can therefore not be specified for a bare die.
This chip data sheet refers to the device data sheet
Edited by INFINEON Technologies, IPC TD VLS, L4345M, Rev. 2.1, 14.05.2013
SIDC06D120F6
Chip Drawing
A
A: Anode pad
Edited by INFINEON Technologies, IPC TD VLS, L4345M, Rev. 2.1, 14.05.2013
SIDC06D120F6
Description
AQL 0,65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to MIL-STD 883
Revision History
Version
2.0
2.1
Subjects (major changes since last revision)
Final data sheet
Date
26.10.2012
14.05.2013
Operating junction and storage temperature
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein
and/or any information regarding the application of the device, Infineon Technologies hereby disclaims
any and all warranties and liabilities of any kind, including without limitation, warranties of non-
infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the
nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on
the types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support
devices or systems and/or automotive, aviation and aerospace applications or systems only with the
express written approval of Infineon Technologies, if a failure of such components can reasonably be
expected to cause the failure of that life-support, automotive, aviation and aerospace device or system
or to affect the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
Edited by INFINEON Technologies, IPC TD VLS, L4345M, Rev. 2.1, 14.05.2013
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