Battery Management BATTERY PROTECTION IC
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| 制造商包装代码 | 846AF |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e6 |
| 湿度敏感等级 | 3 |
| 端子数量 | 8 |
| 最高工作温度 | 80 °C |
| 最低工作温度 | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.5/10 V |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.013 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Bismuth (Sn/Bi) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| LV51134T-TLM-E | LV51135T-TLM-E | LV51132T-TLM-E | LV51137T-TLM-E | LV51139T-TLM-E | |
|---|---|---|---|---|---|
| 描述 | Battery Management BATTERY PROTECTION IC | Battery Management | Battery Management BATTERY PROTECTION IC | Battery Management BATTERY PROTECTION IC | Battery Management BATTERY PROTECTION IC |
| Brand Name | ON Semiconductor | - | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 包装说明 | TSSOP, TSSOP8,.19 | - | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | - |
| 针数 | 8 | - | 8 | 8 | - |
| 制造商包装代码 | 846AF | - | 846AF | 846AF | 846AF |
| Reach Compliance Code | compliant | - | compliant | compliant | unknown |
| JESD-30 代码 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e6 | - | e6 | e6 | e6 |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 |
| 端子数量 | 8 | - | 8 | 8 | 8 |
| 最高工作温度 | 80 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -30 °C | - | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP8,.19 | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 1.5/10 V | - | 6/8 V | 1.5/10 V | 1.5/10 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | 0.013 mA | - | 0.013 mA | 0.013 mA | 0.013 mA |
| 表面贴装 | YES | - | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | - | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Bismuth (Sn/Bi) | - | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | - | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
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