Green
US1JDF/US1MDF
1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
Product Summary
(@ T
A
= +25°C)
V
RRM
(V)
600,1000
I
O
(A)
1
V
F
Max (V)
1.7
I
R
Max (µA)
5
Features and Benefits
Glass Passivated Die Construction
Ultra-Fast Recovery Time for High Efficiency
Surge Overload Rating to 30A Peak
High Current Capability
Low Profile Design, Package Height Less than 1.1mm
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Description
The US1JDF and US1MDF are rectifiers packaged in the low profile
D-FLAT package. Providing ultra-fast recovery time for high
efficiency, this device is ideal for use in general rectification
applications.
Applications
Switching Mode Power Supply
DC-DC Converter
Mechanical Data
Case: D-FLAT
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Weight: 0.035 grams (Approximate)
D-FLAT
Top View
Ordering Information
(Note 4)
Part Number
US1JDF-13
US1MDF-13
Notes:
Qualification
Commercial
Commercial
Case
D-FLAT
D-FLAT
Packaging
10,000/Tape & Reel
10,000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
U1J or U1M = Product Type Marking Code
= Manufacturers’ Code Marking
YWW = Date Code Marking
Y = Last Digit of Year (ex: 6 for 2016)
WW = Week Code (01 to 53)
AB = Foundry and Assembly Code
US1JDF / US1MDF
Document number: DS36877 Rev. 9 - 2
1 of 5
www.diodes.com
May 2016
© Diodes Incorporated
US1JDF/US1MDF
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
RMS Reverse Voltage
Average Rectified Output Current
@T
T
= +25°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
US1JDF
600
420
1.0
30
US1MDF
1,000
700
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Typical Thermal Resistance, Junction to Terminal (Note 8)
Typical Thermal Resistance, Junction to Ambient (Note 8)
Operating and Storage Temperature Range
Symbol
R
JT
R
JA
T
J,
T
STG
Value
44
80
-55 to +150
Unit
°C/W
°C/W
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Minimum Reverse Breakdown Voltage (Note 5)
Maximum Forward Voltage Drop
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
Maximum Reverse Recovery Time (Note 6)
Typical Total Capacitance (Note 7)
Notes:
@I
R
= 5μA
@ I
F
= 1.0A
@T
A
= +25°C
@T
A
= +100°C
Symbol
V
(BR)R
V
F
I
R
t
RR
C
T
US1JDF
600
1.7
5.0
100
75
10
US1MDF
1,000
Unit
V
V
μA
ns
pF
5. Short duration pulse test used to minimize self-heating effect.
6. Measured with I
F
= 0.5A, I
R
= 1.0A, I
RR
= 0.25A. See figure 7.
7. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
8. Device mounted on FR-4 substrate, 1" * 1", 2oz, single-sided, PC boards with 0.1"*0.15" copper pads.
9. Device mounted on FR-4 substrate, 0.4" * 0.5", 2oz, single-sided, PC boards with 0.2"*0.25" copper pads.
I
F
, INSTANTANEO US FORWARD CURRENT (A)
1.20
I
F
, DC FORWARD CURRENT (A)
10
T
A
= 150°C
T
A
= 125°C
1
0.80
Note 9
1
0.60
Note 8
T
A
= 100°C
T
A
= 85°C
0.40
0
.
1
T
A
= 25°C
0.20
0
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
Figure 1 Forward Current Derating
T
A
= -55°C
0
.
01
0
.
5
1
.
0
1
.
5
2
.
0
2
.
5
3
.
0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2 Typical Forward Characteristics
May 2016
© Diodes Incorporated
US1JDF / US1MDF
Document number: DS36877 Rev. 9 - 2
2 of 5
www.diodes.com
US1JDF/US1MDF
40
I
R
, INSTANTANEOUS REVERSE CURRENT (µA)
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
100
10
T
A
= 150°C
T
A
= 125°C
30
1
T
A
=100°C
T
A
= 85°C
20
0.1
T
A
= 25°C
10
0.01
T
A
= -55°C
0
1
10
100
NUMBER OF CYCLES AT 60Hz
Fig. 3 Forward Surge Current Derating Curve
0.001
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Figure 4 Typical Reverse Characteristics
f=1MHz
PF
(av)
, Average Forward Power Dissipation (W)
20
P
F(AV)
, AVERAG E FORWARD POWER DI SSI PATION (W)
1.2
T
J
= 150°C
1
C
T
, TOTAL CAPACITANCE (pF)
15
0.8
10
0.6
0.4
5
0.2
Note 8
0
0
1
10
V
R
, DC REVERSE VOLTAGE (V)
Figure 5 Total Capacitance
100
0
0
0.4
0.6
0.8
1
1.2
I
F(AV)
AVERAGE FORWARD CURRENT (A)
Figure 6 Forward Power Dissipation
0.2
Figure 7 Reverse Recovery Time Characteristic and Test Circuit
US1JDF / US1MDF
Document number: DS36877 Rev. 9 - 2
3 of 5
www.diodes.com
May 2016
© Diodes Incorporated
US1JDF/US1MDF
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
D-FLAT
H
E
E
b
D
L
k
D-FLAT
Dim
Min
Max
A
0.90
1.10
b
1.25
1.65
c
0.10
0.40
D
2.25
2.95
E
3.95
4.60
k
2.80
–
5.00
5.60
H
E
L
0.50
1.30
All Dimensions in mm
A
c
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
D-FLAT
X1
X
Dimensions
C
G
X
X1
Y
Value
(in mm)
4.65
2.80
1.85
6.50
1.70
Y
G
C
US1JDF / US1MDF
Document number: DS36877 Rev. 9 - 2
4 of 5
www.diodes.com
May 2016
© Diodes Incorporated
US1JDF/US1MDF
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
US1JDF / US1MDF
Document number: DS36877 Rev. 9 - 2
5 of 5
www.diodes.com
May 2016
© Diodes Incorporated
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