Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Operating Voltage Range
SYMBOL
V
CC
V
CC
= 5.5V, no load
V
CC
Supply Current
I
CC
V
CC
= 3.6V, no load
V
CC
= 2.5V, no load
V
CC
= 1.8V, no load
V
CC
Reset Threshold
(See Reset Thresholds table)
Reset Threshold Tempco
V
CC
to Reset Delay
T
A
= +25°C
V
TH
T
A
= -40°C to +125°C
∆V
TH
/°C
V
CC
falling at 10mV/µs from V
TH
+ 100mV
to V
TH
- 100mV
D1
D2
Reset Timeout Period
MAX6381–MAX6389
(See Reset Timeout table)
D3
t
RP
D5
D6
D4
D7
MR
timeout period
Reset Timeout Period
MAX6390
t
RP
V
CC
timeout period
V
IL
V
TH
< 4V
MR
Input Voltage
V
IH
V
IL
V
IH
V
TH
> 4V
0.7 x
V
CC
0.8
2.4
D4
D7
D4
D7
1
20
140
280
560
1120
1200
140
150
1120
1200
V
TH
-
1.5%
V
TH
-
2.5%
CONDITIONS
MIN
1.0
7
6
4
3
V
TH
V
TH
60
35
2
40
280
560
1120
2240
2400
280
300
2240
2400
0.3 x
V
CC
V
ms
ms
TYP
MAX
5.5
13
11
7
6
V
TH
+
1.5%
V
V
TH
+
2.5%
ppm/°C
µs
µA
UNITS
V
2
SC70/µDFN, Single/Dual Low-Voltage,
Low-Power µP Reset Circuits
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
MR
Minimum Input Pulse Width
MR
Glitch Rejection
MR
to Reset Delay
MR
Internal Pullup Resistance
MAX6381–MAX6389
MAX6390
T
A
= +25°C
RESET IN Input Threshold
V
THRST
T
A
= 0°C to +85°C
T
A
= -40°C to +125°C
RESET IN to RESET Delay
RESET IN Input Leakage Current
Open-Drain
RESET
Output
Voltage
Open-Drain
RESET
Output
Leakage Current
I
RESET IN
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
I
LKG
V
CC
> V
TH
,
RESET
not asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
Push-Pull
RESET
Output Voltage
V
OH
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset not
asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset not
asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset asserted
V
OH
V
CC
≥
1.8V, I
SOURCE
= 150µA, reset asserted
Push-Pull RESET Output Voltage
V
CC
≥
1.0V, I
SOURCE
= 1µA, reset asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset not
asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset not
asserted
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.4
0.3
V
RESETIN
falling at 4mV/µs from
V
THRST
+ 40mV to V
THRST
- 40mV
-50
32
500
1.245
1.232
1.219
4.5
±1
+50
0.4
0.3
0.3
1.0
0.4
0.3
0.3
V
µA
V
SYMBOL
CONDITIONS
MIN
1
100
200
63
1560
1.27
100
3000
1.295
1.308
1.321
µs
nA
V
TYP
MAX
UNITS
µs
ns
ns
kΩ
Ω
MAX6381–MAX6390
V
Note 1:
Specifications over temperature are guaranteed by design, not production tested.
ABI Research最近评选并公布了全球超高频无源和高频无源 RFID芯片的前十大制造商。 前十大超高频无源芯片制造商是： 前十大高频无源芯片制造商是： 超高频的得奖名单并不出人意外，因为实际上似乎总是前三家公司获得大订单。ABI分析家 Mike Liard称，ABI很容易就评选出 Alien、Avery,和 Raflatac为全球...[详细]
复杂 IC 不仅吸引了更多系统，而且还吞食着设计者用于建立、评估与校准芯片的测试设备。 芯片设计者正开始在自己的复杂 IC上设计测试与测量仪器。在IC中设计测试仪器的潮流开始于CPU核心与总线的数字调试硬件。现在，设计者也在高速I/O块中建立分析仪器。设计者正在高频芯片的内部作业中集成更复杂的模拟与RF测试仪器，如读取通道IC。 这只是尺度问题。随着系统级 IC 越来越大而复杂...[详细]
GD32 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
