PLASTIC INFRARED
LIGHT EMITTING DIODE
QED233
PACKAGE DIMENSIONS
0.195 (4.95)
QED234
REFERENCE
SURFACE
0.305 (7.75)
0.040 (1.02)
NOM
0.800 (20.3)
MIN
0.050 (1.25)
CATHODE
0.100 (2.54)
NOM
0.240 (6.10)
0.215 (5.45)
0.020 (0.51)
SQ. (2X)
SCHEMATIC
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
ANODE
CATHODE
DESCRIPTION
The QED233 / QED234 is a 940 nm GaAs / AlGaAs LED encapsulated in a clear untinted, plastic T-1 3/4 package.
FEATURES
• = 940 nm
• Chip material =GaAs with AlGaAs window
• Package type: T-1 3/4 (5mm lens diameter)
• Matched Photosensor: QSD122/123/124
• Medium Emission Angle, 40°
• High Output Power
• Package material and color: Clear, untinted, plastic
• Ideal for remote control applications
2001 Fairchild Semiconductor Corporation
DS300338
10/31/01
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED233
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
(2,3,4)
Soldering Temperature (Flow)
(2,3)
Continuous Forward Current
Reverse Voltage
Power Dissipation
(1)
Peak Forward Current
(T
A
= 25°C unless otherwise specified)
Symbol
T
OPR
T
STG
T
SOL-I
T
SOL-F
I
F
V
R
P
D
I
FP
Rating
-40 to +100
-40 to +100
240 for 5 sec
260 for 10 sec
100
5
200
1.5
Unit
°C
°C
°C
°C
mA
V
mW
A
QED234
1. Derate power dissipation linearly 2.67 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron
1/16”
(1.6mm) minimum from housing.
5. Pulse conditions; tp = 100 µs, T = 10 ms.
ELECTRICAL / OPTICAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
DEVICE
(T
A
=25°C)
SYMBOL
PE
MIN
TYP
MAX
UNITS
Peak Emission Wavelength
Spectral Bandwidth
Temp. Coefficient of
Emission Angle
Forward Voltage
Temp. Coefficient of V
F
Reverse Current
Radiant Intensity
Temp. Coefficient of I
E
Rise Time
Fall Time
PE
I
F
= 20 mA
I
F
= 20 mA
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA, tp = 20 ms
I
F
= 100 mA
V
R
= 5 V
I
F
= 100 mA, tp = 20 ms
I
F
= 20 mA
I
F
= 100 mA
ALL
ALL
ALL
ALL
ALL
ALL
ALL
QED233
QED234
ALL
ALL
ALL
—
50
—
—
—
—
—
10
27
940
—
0.2
40
—
-1.5
—
—
—
-0.6
1000
1000
—
nm
—
—
1.6
—
10
50
—
—
—
—
nm
—
TC
2
1/2
nm/K
Deg.
V
mV/K
µA
mW/sr
%/K
ns
V
F
TC
V
I
R
I
E
TC
I
t
r
t
f
—
—
—
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED233
TYPICAL PERFORMANCE CURVES TBD
Fig. 1 Normalized Radiant Intensity vs. Forward Current
10
2.0
I
F
= 50mA
1
I
F
=100mA
QED234
Fig. 2 Forward Voltage Vs. Ambient Temperature
I
e
- NORMALIZED RADIANT INTENSITY
V
F
- FORWARD VOLTAGE (V)
Normalized to:
I
F
= 100 mA
T
A
= 25˚C
t
pw
= 100 µs
1.5
0.1
1.0
I
F
=10mA
I
F
=20mA
0.01
0.5
I
F
Pulsed
t
pw
= 100 µs
Duty Cycle = 0.1%
0.0
-40
-20
0
20
40
60
80
100
1
10
100
1000 1500
I
F
- FORWARD CURRENT (mA)
T
A
- AMBIENT TEMPERATURE (˚ C)
Fig. 3 Normalized Radiant Intensity vs. Wavelength
1.0
Fig. 4 Radiation Diagram
110
120
130
140
150
100
90
80
70
60
50
40
30
20
10
0
1.0
NORMALIZED INTENSITY
0.8
0.6
0.4
160
0.2
0
800
170
180
1.0
850
900
950
1000
1050
0.8
0.6
0.4
0.2
0.0
0.2
0.4
0.6
0.8
λλ
(nm)
Fig. 5 Forward Current vs. Forward Voltage
1000
T
A
= 25˚C
I
F
- FORWARD CURRENT (mA)
100
10
1
1
2
3
4
V
F
- FORWARD VOLTAGE (V)
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED233
QED234
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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