ASMT-TWBM / ASMT-TBBM / ASMT-TGBM
Surface Mount LED Indicator
Reliability Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accor-
dance with the latest revision of MIL-STD-883 and JEDEC.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on
the electrical and environmental characteristics of your
application but will probably be better than the perfor-
mance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship
between ambient temperature and actual junction tem-
perature is given by the following:
T
J
(°C) = T
A
(°C) +
θ
JA
P
AVG
Where;
T
A
= ambient temperature in (°C)
θ
JA
= thermal resistance of junction-to ambient in °C/watt
P
AVG
= average power dissipated in watts
The estimated MTTF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature
acceleration. Results of such calculations are shown in the
table below using activation energy of 0.43eV (reference
MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Colors
Green
Blue / Ice Blue /
Cool White
Stress Test Conditions
T
A
= 55°C, I
F
= 20 mA
T
A
= 55°C, I
F
= 18 mA
Total Device
Hours
56,000
56,000
Units
Tested
56
56
Units
Failed
0
0
MTBF
(60% Confidence)
61,100
71,700
Failure Rate
(%/1K Hrs)
1.64
1.39
Reliability Prediction
Table 2a. Green (I
F
= 20mA)
Point Typical
Performance in Time
[1 - 5]
(60% Confidence)
Failure Rate
MTTF
(%/1K Hours)
38500
39200
40000
40700
41500
42300
43100
43900
51700
61100
72500
86500
103600
124700
151000
183700
2.60
2.55
2.50
2.46
2.41
2.36
2.32
2.28
1.93
1.64
1.38
1.16
0.97
0.80
0.66
0.54
Ambient
Temperature (°C)
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
Junction
Temperature (°C)
125
125
124
123
123
122
122
121
116
111
106
101
96
91
86
81
Performance in Time
[1 - 5]
(90% Confidence)
Failure Rate
MTTF
(%/1K Hours)
15300
15600
15900
16200
16500
16800
17200
17500
20600
24300
28900
34400
41200
49600
60100
73100
6.54
6.41
6.29
6.17
6.06
5.95
5.81
5.71
4.85
4.12
3.46
2.91
2.43
2.02
1.66
1.37
Table 2b. Blue / Ice Blue / Cool White (I
F
= 18mA)
Point Typical
Performance in Time
[1 - 5]
(60% Confidence)
Failure Rate
MTTF
(%/1K Hours)
63800
64600
65400
66300
67100
68000
68900
69800
70700
71700
72600
86700
104100
125600
152200
185600
1.57
1.55
1.53
1.51
1.49
1.47
1.45
1.43
1.41
1.39
1.38
1.15
0.96
0.80
0.66
0.54
Ambient
Temperature (°C)
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
Junction
Temperature (°C)
108
108
107
107
107
106
106
106
105
105
104
99
94
89
84
79
Performance in Time
[1 - 5]
(90% Confidence)
Failure Rate
MTTF
(%/1K Hours)
25400
25700
26000
26400
26700
27100
27400
27800
28200
28500
28900
34500
41400
50000
60600
73900
3.94
3.89
3.85
3.79
3.75
3.69
3.65
3.60
3.55
3.51
3.46
2.90
2.42
2.00
1.65
1.35
Notes:
1. The 60% or 90% confidence MTTF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples.
The confidence level is established based on the chi-square distribution.
2. Failure rate (FIT) is 1/MTTF x 10
5
, assuming the failures are exponentially distributed
3. A failure is any LED that is open, shorted or fails to emit light.
4. Calculated from data generated at 55°C biased at 20mA (Green) 18mA (Blue/Ice Blue/Cool White).
5. Junction temperature is calculated based on
θ
JA
= 850°C/W
2
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is:
(8 hours/day) x (5 days/week) / (168 hours/week) = 0.24
The point failure rate per year (8760 hours) at 25°C ambient temperature is (60% confidence level):
(0.54%/1K hours) x 0.24 x (8760 hours/year) = 1.13% per year
Similarly, 90% confidence level failure rate per year at 25°C:
(1.35%/1K hours) x 0.24 x (8760 hours/year) = 2.84% per year.
Table 3. Environmental Tests
Test Name
Temperature Cycle
Resistance to Soldering Heat
Temperature Humidity
Power Cycle
Power Temperature Cycle
Unbiased AutoClave
Temperature Humidity
Storage Life
Temperature Humidity
Operating Life
High Temperature
Operating Life
Room Temperature
Operating Life
Reference
Avago Req.
JESD 22-B106
Avago Req.
Avago Req.
JESD22-A102
Avago Req.
JESD22-A101
JESD22-A108
JESD22-A108
Test Conditions
-40/100°C 15 min dwell, 5 min transfer,
1000 cycles
260°C for 10 seconds, 2x
25/65°C, 95%RH Dwell time: 3|6|3 hrs
I
F
= 15mA, 5 mins on/off for 100cyc
-40/85°C, Dwell time: 15|15|15 Min
I
F
= 8mA, 5 mins on/off for 1000cyc
T
A
= 121°C, 100%RH,
Vapor Pressure = 205kPa for 96 hours
T
A
= 85°C, 85%RH, for 1000 hours
T
A
= 85°C, 85%RH, I
F
= 13 mA for 1000 hours
T
A
= 85°C, I
F
= 8 mA for 1000 hours
T
A
= 25°C, I
F
= 20 mA for 1000 hours
Units
Tested
468
30
231
231
231
168
84
84
84
Units
Failed
0
0
0
0
0
0
0
0
0
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2328EN - January 25, 2010
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