Standard Products Found
Page 1 of 3
Solder Anchor Attachment Method
Part Number: 375024B60024
(Vis Number: 037815)
This part is in stock and available for immediate delivery:
Contact your
local sales rep
BGA Surface Interface Heat Sink Finish Part Class
All
T766
Black Anodize
A
Features and Benefits
• New unique wire clip design allows for complete reworkability
after assembly
• Configurations are available for a wide range of BGA package
sizes in any thickness up to 3.0mm
• Minimal PC Board real estate is required for mounting
• Solder Anchors provide the most rugged mounting in the
industry
• Each Heat Sink utilizes a phase change pad as the interface for
optimal performance
Solder anchors are sold separately
Part Number Do57
2 Solder anchors must be soldered to the PCB Prior to
attaching the heat sink clip.
Fin Thickness Fin Thickness
# of fins
# of fins
Base Thickness
Across Width Across Length
across width across length
Width Length Height
40mm 40mm 18mm
1.4mm
1.56mm
1.5mm
12
12
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037815&attach=&size=...
2/25/2003
Standard Products Found
Page 3 of 3
Thermal Performance
*θn **θf
12.2 4.34
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037815&attach=&size=...
2/25/2003
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
