TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
1 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE:
This specification defines the performance, test, quality and reliability requirements of the HPC product.
2.0
SCOPE:
This specification is applicable to the termination characteristics of the HPC II family of products which
provide mechanical and electrical interconnection of a daughter PCB to a mother PCB.
3.0
GENERAL:
This document is composed of the following sections:
Paragraph
1.0
2.0
3.0
4.0
5.0
5.1
5.2
5.3
5.4
6.0
7.0
8.0
9.0
9.1
9.2
9.3
9.4
9.5
9.6
TABLE 1
Title
OBJECTIVE
SCOPE
GENERAL
APPLICABLE DOCUMENTS
REQUIREMENTS
Qualification
Material
Finish
Design and Construction
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
ENVIRONMENTAL CONDITIONS
QUALITY ASSURANCE PROVISIONS
Equipment Calibration
Inspection Conditions
Sample Quantity and Description
Acceptance
Qualification Testing
Re-qualification Testing
QUALIFICATION TESTING MATRIX
3.1 Banned/Restricted Substances
All product where the part number ends in “LF” meet the European Union directives and other
country regulations as described in GS-22-008. The part numbers that do not end in “LF” meet all
regulations except for Pb in SnPb plating.
3.2 Manufacturing Processability
All products covered by this specification will withstand exposure to 260°C peak temperature for 10-
30 seconds in a convection, infra-red or vapor phase reflow oven.
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
2 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
4.0
APPLICABLE DOCUMENTS:
4.1
Specifications
4.1.1
4.1.2
4.2
Engineering drawings
Process drawings
Military Standards
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
MIL-STD-202F: Test Methods for Electronic and Electrical Component Parts.
MIL-STD-1344A: Test Methods for Electrical Connectors
MIL-STD-2166: Connectors, Electrical, Compliant Pin
MIL-G-45204: Gold Plating (Electrodeposited)
MIL-P-81728: SnPb Plating
MIL-P-45209: Palladium Alloy Plating
4.3
Federal Specifications
4.3.1
QQ-N-290 - Nickel Plating
QQ-C-533 - Beryllium Copper Alloy Copper Strip
4.4
Other Standards and Specifications
4.4.1
4.4.2
UL94-VO: Flammability
UL-STD-498
4.5
FCI Specifications
4.5.1
4.5.2
4.5.3
4.5.4
4.5.5
4.5.6
4.5.7
BUS-03-114
BUS-03-113
BUS-03-108
BUS-03-404
BUS-03-405
BUS-03-111
BUS-03-110
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
3 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
4.6
Lab Reports - Supporting Data
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
4.6.6
4.6.7
4.6.8
4.6.9
EL-93-07-045 (Qualification Test Matrix)
EL-94-04-055 (Compliant Pin)
EL-94-05-053 (Compliant Pin)
EL-94-08-006 (Solderability)
EL-94-08-028 and -028A (Pin Torque Strength)
EL-94-09-025 (FCI Environmental Sequence and Bellcore 3-Gas IMFG, Central Office)
EL-99-08-003CR (Berg Environmental sequence)
EL-95-02-053 (Normal Force)
EL-99-08-003CR (Resistance to Solder Heat)
5.0
REQUIREMENTS:
5.1
Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.2
Material
The material for each component shall be as specified herein or equivalent.
5.2.1
5.2.2
5.2.3
5.3
Finish
The finish for applicable components shall be as specified herein or equivalent.
5.3.1
Gold Plating. When gold plating is specified, the receptacle terminals and header pins
shall be plated with the specified minimum thickness (as shown on the product drawings)
of gold over 50 microinches, minimum, of nickel. The gold deposit shall meet the
requirements of MIL-G-45204, Type II, Grade C and the nickel deposit shall meet the
requirements of QQ-N-290, Class 2.
Receptacle Terminal. The receptacle terminal shall be Beryllium Copper Alloy, or other
copper alloy as specified on the product drawing.
Header Pin. The pin shall be Phosphor Bronze Alloy UNS C51000 in accordance with
ASTM B-159 or other copper alloy as specified on the product drawing.
Housing. Housings shall be molded using glass and mineral filled LCP. The material
shall be rated V-O in accordance with UL-94.
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
4 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
5.3.2
GXT Plating. When GXT plating is specified, the terminals and pins shall be plated with a
thin gold flash over the specified minimum thickness (as shown on the product drawings)
of palladium alloy over 50 microinches, minimum, of nickel. The palladium allow deposit
shall meet the requirements of MIL-P-45209 and the nickel deposit shall meet the
requirements of QQ-N-290, Class 2.
Sn-Pb Plating. Receptacle tails shall be plated with a minimum of 100 microinches of Sn-
Pb over a minimum of 50 microinches of nickel. The plating shall meet requirements of
MIL-P-81728.
5.3.3
5.4
Design and Construction
Connectors shall be of the design, construction, and physical dimensions specified on the applicable
product drawing.
6.0
ELECTRICAL CHARACTERISTICS
6.1
Contact Resistance, Low Level (LLCR) - The low level contact resistance shall not exceed 15
milliohms (20 milliohms after environmental exposure) when measured in accordance with MIL-STD-
1344A, Method 3002.1. The following details shall apply:
a.
b.
c.
6.2
Method of Connection - Attach current and voltage leads as shown in Figure 1.
Test Voltage - 20 millivolts DC max open circuit.
Test Current - Not to exceed 100 milliamperes.
Insulation Resistance - The insulation resistance of unmated connectors shall not be less than 500
megohms when measured in accordance with MIL-STD-202F, Method 302. The following details
shall apply:
a.
b.
c.
Test Voltage - 500 volts DC.
Electrification Time - 2 minutes, unless otherwise specified.
Points of Measurement - Between adjacent contacts.
6.3
Dielectric Withstanding Voltage - There shall be no evidence of arc-over, insulation breakdown, or
excessive leakage current (> 1 milliampere) when unmated connectors are tested in accordance with
MIL-STD-1344A, Method 3001.1. The following details shall apply:
a.
b.
c.
d.
Test Voltage - 1000 volts (DC, 60Hz).
Test Duration - 60 seconds.
Test Condition - 1 (760 Torr - sea level).
Points of Measurement - Between adjacent contacts.
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
5 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
6.4
Current Rating - The temperature rise above ambient shall not exceed 30 degrees C at any point in
the system when all contacts are powered at 1 ampere or one contact is powered at 2.25 amperes.
The following details shall apply:
a.
b.
Ambient Conditions - Still air at 25 degrees C.
Reference - EIA-364-70.
6.5
Capacitance - The specification requirements shall be satisfied when evaluated in accordance with
EIA 364-30 and the following details.
Testing is to be performed using the impedance test method with a frequency of 1 mhz and a test
voltage of 1 volt. The capacitance measurements are to be taken between two signal pins with no
ground reference, therefore, testing at various signal to ground ratios is not required. Measurements
are to be made between two adjacent pins in the same row with all other pins isolated from ground.
The following Pin Out & Point of Measurement was utilized to obtain the given results.
PIN OUT & POINT OF MEASUREMENT
Row
Long Pin
4
oMMoo
M = Point of Measurement
3
oMMoo
o = Unused Signal Pin
2
oMMoo
Short Pin
1
oMMoo
NOTE:
Layout pattern represents 5 columns of a 4 row connector which is repeated for the
length of the connector.
The average results found are listed below:
Row 1
0.87 pF
Row 2
1.06 pF
Row 3
1.15pF
Row 4
1.24 pF
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
