Monostable Multivibrator, CMOS, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2/6 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
CD54HC221F/3A | CD74HCT221MX | CD54HCT221F/3A | CD54HC221H | CD74HC221EX | CD54HCT221F | CD74HC221E | CD74HCT221E | CD74HC221H | CD74HC221M | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Monostable Multivibrator, CMOS, CDIP16 | Monostable Multivibrator, CMOS, PDSO16 | Monostable Multivibrator, CMOS, CDIP16 | Monostable Multivibrator, CMOS, | Monostable Multivibrator, CMOS, PDIP16, | Monostable Multivibrator, CMOS, CDIP16, | Monostable Multivibrator, CMOS, PDIP16, | Monostable Multivibrator, CMOS, PDIP16, | Monostable Multivibrator, CMOS, | Monostable Multivibrator, CMOS, PDSO16, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C |
封装等效代码 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIE OR CHIP | SOP16,.25 |
电源 | 2/6 V | 5 V | 5 V | 2/6 V | 2/6 V | 5 V | 2/6 V | 5 V | 2/6 V | 2/6 V |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
厂商名称 | RCA | - | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA |
JESD-30 代码 | R-XDIP-T16 | R-PDSO-G16 | R-XDIP-T16 | - | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | - | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 | - | e0 |
端子数量 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | - | 16 |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | - | DIP | DIP | DIP | DIP | - | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | SMALL OUTLINE |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | YES | NO | - | NO | NO | NO | NO | - | YES |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | - | DUAL |
包装说明 | - | SOP, SOP16,.25 | DIP, DIP16,.3 | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | SOP, SOP16,.25 |
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