NCV8703
300 mA, Ultra-Low Quiescent
Current, I
Q
12
mA,
Ultra-Low
Noise, LDO Voltage Regulator
The NCV8703 is a low noise, low power consumption and low
dropout Linear Voltage Regulator. With its excellent noise and PSRR
specifications, the device is ideal for use in products utilizing RF
receivers, imaging sensors, audio processors or any component
requiring an extremely clean power supply. The NCV8703 uses an
innovative Adaptive Ground Current circuit to ensure ultra low
ground current during light load conditions.
Features
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TSOP−5
SN SUFFIX
CASE 483
XDFN6
MX SUFFIX
CASE 711AE
Operating Input Voltage Range: 2.0 V to 5.5 V
Available in Fixed Voltage Options: 0.8 to 3.5 V
MARKING DIAGRAMS
5
XXXAYW
G
1
X, XXX = Specific Device Code
M = Date Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1
Contact Factory for Other Voltage Options
Ultra−Low Quiescent Current of Typ. 12
mA
Ultra−Low Noise: 13
mV
RMS
from 100 Hz to 100 kHz
Very Low Dropout: 180 mV Typical at 300 mA
2%
Accuracy Over Load/Line/Temperature
High PSRR: 68 dB at 1 kHz
Internal Soft−Start to Limit the Turn−On Inrush Current
Thermal Shutdown and Current Limit Protections
Stable with a 1
mF
Ceramic Output Capacitor
Available in TSOP−5 and XDFN 1.5 x 1.5 mm Package
Active Output Discharge for Fast Turn−Off
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
XM
G
PIN CONNECTIONS
1
IN
GND
EN
OUT
Typical Applications
N/C
5−Pin TSOP−5
(Top View)
1
Satellite Radio Receivers, GPS
Rear View Camera, Electronic Mirrors, Lane Change Detectors
Portable Entertainment Systems
Other Battery Powered Applications
V
IN
C
IN
1
mF
OFF
IN
ON
EN
OUT
C
OUT
V
OUT
1
mF
Ceramic
OUT
N/C
GND
IN
N/C
EN
NCV8703
GND
6−Pin XDFN 1.5 x 1.5 mm
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
Figure 1. Typical Application Schematic
Semiconductor Components Industries, LLC, 2013
June, 2013
−
Rev. 1
1
Publication Order Number:
NCV8703/D
NCV8703
IN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
UVLO
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
INTEGRATED
SOFT−START
AUTO LOW
POWER MODE
OUT
ACTIVE
DISCHARGE
EN
GND
Figure 2. Simplified Schematic Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
XDFN6
1
2
3
4
5
6
1
Pin No.
TSOP−5
5
4
2
3
Pin
Name
OUT
N/C
GND
EN
N/C
IN
Description
Regulated output voltage pin. A small 1
mF
ceramic capacitor is needed from this pin
to ground to assure stability.
Not connected.
Power supply ground. Connected to the die through the lead frame. Soldered to the
copper plane allows for effective heat dissipation.
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V
puts the regulator into shutdown mode.
Not connected. This pin can be tied to ground to improve thermal dissipation.
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Output Voltage
Enable Input
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
Symbol
V
IN
V
OUT
V
EN
t
SC
T
J(MAX)
T
STG
ESD
HBM
ESD
MM
Value
−0.3
V to 6 V
−0.3
V to V
IN
+ 0.3 V
−0.3
V to V
IN
+ 0.3 V
Indefinite
125
−55
to 150
2000
200
Unit
V
V
V
s
C
C
V
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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NCV8703
Table 3. THERMAL CHARACTERISTICS
(Note 3)
Rating
Thermal Characteristics, TSOP−5,
Thermal Resistance, Junction−to−Air
Thermal Characterization Parameter, Junction−to−Lead (Pin 2)
Thermal Characteristics, XDFN6 1.5 x 1.5 mm
Thermal Resistance, Junction−to−Air
Thermal Characterization Parameter, Junction−to−Board
3. Single component mounted on 1 oz, FR4 PCB with 645 mm
2
Cu area.
Symbol
q
JA
y
JL
q
JA
y
JB
Value
241
129
146
77
Unit
C/W
C/W
Table 4. ELECTRICAL CHARACTERISTICS
(−40C
T
J
125C; V
IN
= V
OUT(NOM)
+ 0.5 V or 2.0 V, whichever is greater; V
EN
= 0.9 V, I
OUT
= 10 mA, C
IN
= C
OUT
= 1
mF
unless
otherwise noted. Typical values are at T
J
= +25C.) (Note 4)
Parameter
Operating Input Voltage
Undervoltage Lock−out
Output Voltage Accuracy
Line Regulation
V
IN
rising
V
OUT
+ 0.5 V
V
IN
5.5 V, I
OUT
= 0
−
300 mA
V
OUT
+ 0.5 V
V
IN
4.5 V, I
OUT
= 10 mA
V
OUT
+ 0.5 V
V
IN
5.5 V, I
OUT
= 10 mA
Load Regulation
Load Transient
Dropout Voltage (Note 5)
Output Current Limit
Quiescent Current
Ground Current
Shutdown Current
I
OUT
= 0 mA to 300 mA
I
OUT
= 1 mA to 300 mA or 300 mA to 1 mA in
1
ms,
C
OUT
= 1
mF
I
OUT
= 300 mA, V
OUT(nom)
= 2.5 V
V
OUT
= 90% V
OUT(nom)
I
OUT
= 0 mA
I
OUT
= 300 mA
V
EN
0.4 V, T
J
= +25C
V
EN
0 V, V
IN
= 2.0 to 4.5 V, T
J
=
−40
to +85C
EN Pin Threshold Voltage
High Threshold
Low Threshold
EN Pin Input Current
Turn−On Time
Power Supply Rejection Ratio
V
EN
Voltage Increasing
V
EN
Voltage Decreasing
V
EN
= 5.5 V
C
OUT
= 1.0
mF,
from assertion EN pin to 98%
V
OUT(nom)
V
IN
= 3 V, V
OUT
= 2.5 V
I
OUT
= 300 mA
f = 100 Hz
f = 1 kHz
f = 10 kHz
Test Conditions
Symbol
V
IN
UVLO
V
OUT
Reg
LINE
Reg
LINE
Reg
LOAD
Tran
LOAD
V
DO
I
CL
I
Q
I
GND
I
DIS
I
DIS
V
EN_HI
V
EN_LO
I
EN
t
ON
PSRR
0.9
100
200
70
68
53
13
160
−
20
−
310
Min
2.0
1.2
−2
450
600
20
−100/
+150
180
450
12
200
0.12
0.55
2
300
750
20
1.6
Typ
Max
5.5
1.9
+2
Unit
V
V
%
mV/V
mV/V
mV/mA
mV
mV
mA
mA
mA
mA
mA
V
0.4
500
nA
ms
dB
Output Noise Voltage
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
V
OUT
= 2.5 V, V
IN
= 3 V, I
OUT
= 300 mA
f = 100 Hz to 100 kHz
Temperature increasing from T
J
= +25C
Temperature falling from T
SD
V
N
T
SD
T
SDH
mV
rms
C
C
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T
J
= T
A
= 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when V
OUT
falls 100 mV below the regulated voltage at V
IN
= V
OUT(NOM)
+ 0.5 V.
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NCV8703
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (mV/rtHz)
10
1
I
OUT
= 10 mA
0.1
V
IN
= 2.0 V
V
OUT
= 0.8 V
C
IN
= C
OUT
= 1
mF
MLCC, X7R,
1206 size
0.01
0.1
1
I
OUT
= 1 mA
I
OUT
= 300 mA
10
100
1000
RMS Output Noise (mV
RMS
)
I
OUT
1 mA
10 mA
300 mA
10 Hz
−
100 kHz
18.45
17.18
14.14
100 Hz
−
100 kHz
17.77
16.43
13.11
0.01
0.001
FREQUENCY (kHz)
Figure 3. Output Voltage Noise Spectral Density for V
OUT
= 0.8 V, C
OUT
= 1
mF
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
1
RMS Output Noise (mV
RMS
)
I
OUT
0.1
V
IN
= 2.0 V
V
OUT
= 0.8 V
C
IN
= 1
mF
C
OUT
= 4.7
mF
MLCC, X7R,
1206 size
0.01
0.1
1
I
OUT
= 10 mA
I
OUT
= 1 mA
10
100
1000
I
OUT
= 300 mA
1 mA
10 mA
300 mA
10 Hz
−
100 kHz
14.07
16.59
15.46
100 Hz
−
100 kHz
13.14
15.83
14.53
0.01
0.001
FREQUENCY (kHz)
Figure 4. Output Voltage Noise Spectral Density for V
OUT
= 0.8 V, C
OUT
= 4.7
mF
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
1
RMS Output Noise (mV
RMS
)
0.1
V
IN
= 3.8 V
V
OUT
= 3.3 V
C
IN
= C
OUT
= 1
mF
MLCC, X7R,
1206 size
0.01
0.1
1
I
OUT
= 10 mA
I
OUT
1 mA
10 mA
300 mA
I
OUT
= 1 mA
I
OUT
= 300 mA
10
100
1000
10 Hz
−
100 kHz
20.29
19.76
18.74
100 Hz
−
100 kHz
17.06
16.11
15.46
0.01
0.001
FREQUENCY (kHz)
Figure 5. Output Voltage Noise Spectral Density for V
OUT
= 3.3 V, C
OUT
= 1
mF
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NCV8703
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (mV/rtHz)
10
1
RMS Output Noise (mV
RMS
)
I
OUT
= 300 mA
0.1
V
IN
= 3.8 V
V
OUT
= 3.3 V
C
IN
= 1
mF
C
OUT
= 4.7
mF
MLCC, X7R,
1206 size
0.01
0.1
1
I
OUT
1 mA
10 mA
I
OUT
= 10 mA
I
OUT
= 1 mA
10
100
1000
300 mA
10 Hz
−
100 kHz
17.64
19.54
21.50
100 Hz
−
100 kHz
13.52
15.96
18.71
0.01
0.001
FREQUENCY (kHz)
Figure 6. Output Voltage Noise Spectral Density for V
OUT
= 3.3 V, C
OUT
= 4.7
mF
350
I
GND
, GROUND CURRENT (mA)
I
GND
, GROUND CURRENT (mA)
315
280
245
210
175
140
105
70
35
0
V
IN
= V
OUT
+ 0.5 V
C
IN
= 1
mF
C
OUT
= 1
mF
MLCC, X7R,
1206 size
0
50
100
150
200
250
300
V
OUT
= 0.8 V
V
OUT
= 3.3 V
V
OUT
= 2.5 V
160
140
120
100
80
60
40
20
0
0
0.25
0.50
0.75
1.00
V
OUT
= 3.3 V
V
OUT
= 2.5 V
V
OUT
= 0.8 V
V
IN
= V
OUT
+ 0.5 V
C
IN
= 1
mF
C
OUT
= 1
mF
MLCC, X7R,
1206 size
1.25
1.50
1.75 2.00
I
OUT
, OUTPUT CURRENT (mA)
I
OUT
, OUTPUT CURRENT (mA)
Figure 7. Ground Current vs. Output Current
270
I
GND
, GROUND CURRENT (mA)
I
GND
, GROUND CURRENT (mA)
240
210
180
150
120
90
60
30
0
0
30
60
90
V
IN
= V
OUT
+ 0.5 V
C
IN
= 1
mF
C
OUT
= 1
mF
MLCC, X7R,
1206 size
120 150 180
210 240 270 300
T
J
= 25C
T
J
= 125C
T
J
=
−40C
160
140
120
100
80
60
40
20
0
0
Figure 8. Ground Current vs. Output Current
from 0 mA to 2 mA
T
J
= 25C
T
J
=
−40C
T
J
= 125C
V
IN
= V
OUT
+ 0.5 V
C
IN
= 1
mF
C
OUT
= 1
mF
MLCC, X7R,
1206 size
0.25
0.50
0.75
1.00
1.25
1.50
1.75 2.00
I
OUT
, OUTPUT CURRENT (mA)
I
OUT
, OUTPUT CURRENT (mA)
Figure 9. Ground Current vs. Output Current
at Temperatures
Figure 10. Ground Current vs. Output Current
0 mA to 2 mA at Temperatures
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