EA3250PA18-16.384M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Mar 21, 2018)
174 SVHC
ITEM DESCRIPTION
Quartz Crystal Resonator 3.2mm x 5.0mm x 1.0mm 4 Pad Ceramic Surface Mount (SMD) 16.384MHz ±10ppm at 25°C, ±15ppm
over -20°C to +70°C 18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance
Equivalent Series Resistance
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
16.384MHz
±10ppm at 25°C, ±15ppm over -20°C to +70°C
±3ppm/Year Maximum
18pF Parallel Resonant
5pF Maximum
50 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
-3dB Minimum (Measured from Fo to Fo+5000ppm)
-40°C to +125°C
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 01/18/2018 | Page 1 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EA3250PA18-16.384M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.2
±0.2
MARKING
ORIENTATION
1.4 ±0.1
1.2 ±0.1 (X4)
PIN
1
2
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2
2.6
±0.1
1
1.0
MAX
3
3
4
5.0
±0.2
LINE MARKING
1
E16.38
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
4
0.9 ±0.1
(X4)
2
Note: Chamfer not shown.
Seam Sealed
Terminal Plating Thickness: Gold (0.3 to 1.0µm) over Nickel (1.27 to 8.89µm)
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.20 (X4)
1.50 (X4)
2.30
Solder Land
(X4)
1.00
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 01/18/2018 | Page 2 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EA3250PA18-16.384M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperature shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 01/18/2018 | Page 3 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EA3250PA18-16.384M
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
5°C/Second Maximum
N/A
Level 1
Temperature shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 01/18/2018 | Page 4 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
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