EMIF06-USD05F3
6-line EMI filter and ESD protection for SD card, mini-SD card and
micro-SD card interfaces
Description
The EMIF06-USD05F3 is a 6-line EMI filter
dedicated to SD, mini-SD and micro-SD card
applications. It provides an efficient attenuation at
900 MHz to reduce or suppress the antenna de-
sense. This filter includes ESD protection
circuitry, which prevents damage to the protected
device when inserting the card. Pull-up resistors
are not integrated inside the chip, hence the
EMIF06-USD05F3 gives the flexibility to
customers to use controllers with embedded
resistance. This 6-line IPAD
™
is packaged into a
flip-chip solution, saving PCB space
.
Figure 1. Pin configuration (bump side)
4
3
2
1
A
B
C
D
Flip Chip
(15 bumps)
Datasheet
−
production data
Features
•
EMI low-pass filter
•
104 MHz clock frequency compatible with
SDR50 mode (SD3.0)
•
High attenuation level of -30 dB at 900 MHz
•
Lead-free package
Complies with the following standards:
•
IEC 61000-4-2 level 4:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
•
Features phones, smartphones, phablets and
communication systems
•
Tablets, multimedia players like MP3,
camcorders
TM:
IPAD is a trademark of STMicroelectronics
April 2014
This is information on a product in full production.
DocID025910 Rev 1
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www.st.com
Characteristics
EMIF06-USD05F3
1
Characteristics
Table 1. Absolute maximum ratings (T
amb
= 25 °C)
Symbol
Parameter
ESD discharge IEC 61000-4-2, level 4
Air discharge card side
Contact discharge card side
Air discharge IC side
Contact discharge IC side
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
Unit
V
PP
15
8
2
2
125
- 30 to + 85
- 55 to + 150
kV
T
j
T
op
T
stg
°C
°C
°C
Figure 2. Electrical characteristics (definitions)
I
Symbol
V
BR
=
V
RM
=
I
RM
=
C
line
=
Parameter
Breakdown voltage
Stand-off voltage
Leakage current at V
RM
Line capacitance
V
CL
V
BR
V
RM
I
RM
V
I
PP
Table 2. Electrical characteristics (values, T
amb
= 25 °C)
Symbol
V
BR
I
RM
R
line
C
line
F
c
S
21
Parameter
Breakdown voltage
Leakage current at V
RM
Serial line resistor
Total line capacitance
-3dB cut-off frequency
Attenuation
V
BIAS
= 2.4 V
Z
source
= Z
load
= 50
Ω
F = 900 MHz
-25
Test conditions
I
R
= 1 mA
V
RM
= 3 V
32
40
11
300
-30
Min.
6
100
48
14
Typ.
Max.
Unit
V
nA
Ω
pF
MHz
dB
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DocID025910 Rev 1
EMIF06-USD05F3
Table 3. Pin configuration
Pin
A1
A2
A3
A4
B1
B2
B3
B4
Signal
dat0
dat1
SDdat1
SDdat0
clk
V
cc
GND
SDclk
Pin
C1
C2
C3
C4
D1
D2
D3
D4
Characteristics
Signal
cmd
GND
SDcmd
dat3
dat2
SDdat2
SDdat3
Figure 3. Functional schematic
Vcc
Clk
Cmd
dat0
dat1
dat2
dat3
R
SDClk
SDCmd
SDdat0
SDdat1
SDdat2
SDdat3
GND
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Characteristics
EMIF06-USD05F3
Figure 4. Attenuation versus frequency
S21(dB)
0
-5
-10
-15
-20
-25
-30
6
16
14
12
10
8
Figure 5. Line capacitance versus applied
voltage
Cline(pF)
-35
4
-40
2
-45
-50
10M
Dat0
F(Hz)
30M
Dat2
Vbias(V)
0
1
2
3
4
5
6
0
100M
Clk
300M
Dat1
1G
Dat3
3G
Cmd
Figure 6. Analog crosstalk versus frequency
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
10M
30M
Dat0/Clk
100M
Clk/Vcc
300M
1G
Dat2/Dat1
3G
Figure 7. Digital crosstalk measurements
XTalk(dB)
F(Hz)
Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
5.0 V / Div
1
2
3
4
V
CL
: Peak clamping voltage
V
CL
:clamping voltage @ 30 ns
V
CL
:clamping voltage @ 60 ns
V
CL
:clamping voltage @ 100 ns
Figure 9. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
2.0 V / Div
3
-2.58 V
4
-1.15 V
1
14.8 V
2
10.1 V
2
-3.16 V
3
9V
4
5.9 V
1
2
3
4
V
CL
: Peak clamping voltage
V
CL
:clamping voltage @ 30 ns
V
CL
:clamping voltage @ 60 ns
V
CL
:clamping voltage @ 100 ns
1
-8.90 V
20 ns / Div
20 ns / Div
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DocID025910 Rev 1
EMIF06-USD05F3
Package information
2
Package information
•
•
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Figure 10. Package dimensions
190 µm ± 10
400 µm ± 40
255 µm ± 40
500 µm ± 50
400 µm ± 40
190 µm ± 10
1.58 mm ± 40 µm
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
1.58 mm ± 40 µm
Figure 12. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
y = year,
ww = week
x x z
y w w
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